Solid-state image sensing apparatus and method of manufacturing the same

Abstract

A solid-state image sensing apparatus having a three-dimensional structure whose manufacturing process can be simplified is provided. A solid-state image sensing apparatus formed by bonding a first member ( 104 ) and a second member ( 108 ) is provided. The first member ( 104 ) has a first surface on the side of the bonding interface between the first member ( 104 ) and the second member ( 108 ) and a second surface on the opposite side of the bonding interface. The second member ( 108 ) has a third surface on the bonding interface side and a fourth surface on the opposite side of the bonding interface. The first member ( 104 ) includes photoelectric conversion elements ( 105 ) which are formed on the first surface before the first member ( 104 ) is bonded to the second member ( 108 ). The second member ( 108 ) includes circuit elements ( 106 ) which are formed on the third surface before bonding.

1 . A solid-state image sensing apparatus formed by bonding a plurality of members including a first member and a second member, 
 wherein the first member has a first surface on a side of a bonding interface between the first member and the second member and a second surface on an opposite side of the bonding interface,    the second member has a third surface on a side of the bonding interface and a fourth surface on an opposite side of the bonding interface,    the first member includes photoelectric conversion elements which are formed on the first surface before the first member is bonded to the second member,    the second member includes circuit elements which are formed on the third surface before bonding, and    the photoelectric conversion elements of the first member are electrically connected to the circuit elements of the second member.    
   
   
       2 . The apparatus according to  claim 1 , wherein the circuit elements of the second member include circuits which control the photoelectric conversion elements and/or circuits which process signals obtained from the photoelectric conversion elements.  
   
   
       3 . The apparatus according to  claim 1 , wherein the photoelectric conversion elements are arranged to form a plurality of pixels which are two-dimensionally arrayed, and the circuit elements of the second member are arranged to form a plurality of circuits which are two-dimensionally arrayed in correspondence with said plurality of pixels.  
   
   
       4 . The apparatus according to  claim 2 , wherein the first member is configured to make light incident on the photoelectric conversion elements through the second surface.  
   
   
       5 . The apparatus according to  claim 2 , further comprising an anti-reflection film and/or color filter on a side of the second surface of the first member.  
   
   
       6 . The apparatus according to  claim 2 , wherein a film which shields or attenuates light is formed on the bonding interface between the first member and the second member.  
   
   
       7 . A method of manufacturing a solid-state image sensing apparatus, comprising: 
 a first step of forming photoelectric conversion elements on a first surface of a first member which has the first surface and a second surface;    a second step of forming circuit elements on a third surface of a second member which has the third surface and a fourth surface; and    a third step of making a side of the first surface of the first member oppose a side of the third surface of the second member to form a bonded body of the first member and the second member.    
   
   
       8 . The method according to  claim 7 , wherein the circuit elements formed in the second step include circuits which control the photoelectric conversion elements and/or circuits which process signals obtained from the photoelectric conversion elements.  
   
   
       9 . The method according to  claim 7 , further comprising a step of forming an anti-reflection film and/or color filter on a side of the second surface of the first member.  
   
   
       10 . The method according to  claim 7 , wherein the first step includes a step of forming a film which shields or attenuates light on the side of the first surface of the first member.  
   
   
       11 . The method according to  claim 7 , wherein the second step includes a step of forming a film which shields or attenuates light on the side of the third surface of the second member.  
   
   
       12 . The method according to  claim 7 , wherein the first step includes a step of forming a separation layer on the first member and a step of forming the circuit elements above the separation layer of the first member, and 
 the manufacturing method further comprises a step of separating the first member at the separation layer after the bonded body is formed.