Method and apparatus for executing plural processes on a microelectronic workpiece at a single processing station

Abstract

An apparatus for processing a microelectronic workpiece is set forth. The apparatus comprises a workpiece support adapted to hold the microelectronic workpiece and a processing container adapted to receive the microelectronic workpiece held by the workpiece support. A drive mechanism is connected to drive the processing container and the workpiece support relative to one another so that the microelectronic workpiece may be moved to a plurality of workpiece processing positions for processing using processing fluid that is provided by first and second chemical delivery systems. The apparatus also includes first and second chemical collector systems that are used to assist in at least partially removing spent processing fluid. In accordance with one embodiment, the apparatus is particularly adapted to execute an immersion process, such as electroplating, and a spraying process, such as an in-situ rinse.

1 - 38 . (canceled)  
   
   
       39 . A method for processing a microelectronic workpiece, comprising: 
 carrying a microelectronic workpiece;    directing a stream of processing fluid toward the microelectronic workpiece to strike the microelectronic workpiece at a first radial location of the microelectronic workpiece; and    moving the microelectronic workpiece relative to the stream of processing fluid so that the stream of processing fluid strikes the microelectronic workpiece at a second radial location different than the first radial location.    
   
   
       40 . The method of  claim 39  wherein moving the microelectronic workpiece relative to the stream of processing fluid includes moving the microelectronic workpiece along an axis and simultaneously rotating the microelectronic workpiece about the axis.  
   
   
       41 . The method of  claim 39  wherein moving the microelectronic workpiece includes moving the microelectronic workpiece so that the stream of processing fluid strikes the microelectronic workpiece at a second radial location positioned radially outwardly from the first radial location.  
   
   
       42 . The method of  claim 39  wherein directing a stream of processing fluid includes directing a stream of rinsing fluid.  
   
   
       43 . The method of  claim 39  wherein directing a stream of processing fluid includes directing a stream of rinsing fluid after at least partially immersing the microelectronic workpiece in an electrolytic fluid.  
   
   
       44 . The method of  claim 39 , further comprising collecting at least some of the processing fluid in a fluid collector having a first annular channel and a second annular channel positioned at least proximate to and in fluid communication with the first annular channel.  
   
   
       45 . The method of  claim 39 , further comprising collecting at least some of the processing fluid in a fluid collector having a first annular channel and a second annular channel positioned at least proximate to and in fluid communication with the first annular channel, and wherein moving the microelectronic workpiece includes moving the microelectronic workpiece so that the stream of processing fluid reflecting from the microelectronic workpiece moves from the first annular channel to the second annular channel.  
   
   
       46 . The method of  claim 39 , further comprising: 
 at least partially immersing the microelectronic workpiece in an electrochemical bath prior to directing the stream of processing fluid;    moving the microelectronic workpiece along an axis and away from the bath to a first axial location and spinning the microelectronic workpiece about the axis to return fluid to the electrochemical bath; and    moving the microelectronic workpiece away from the bath and the first axial location to a second axial location prior to directing the stream of processing fluid.    
   
   
       47 . A method for processing a microelectronic workpiece, comprising: 
 carrying a microelectronic workpiece;    tilting the microelectronic workpiece to change an angle between a face of the microelectronic workpiece and a fluid stream orifice; and    directing a stream of processing fluid from the fluid stream orifice toward the microelectronic workpiece to strike the microelectronic workpiece.    
   
   
       48 . The method of  claim 47 , further comprising rotating the microelectronic workpiece about an axis while directing the stream of processing fluid.  
   
   
       49 . The method of  claim 47 , further comprising rotating the microelectronic workpiece about an axis and moving the microelectronic workpiece along the axis while directing the stream of processing fluid.  
   
   
       50 . The method of  claim 47  wherein directing a stream of processing fluid includes directing a stream of rinsing fluid.  
   
   
       51 . The method of  claim 47  wherein moving the microelectronic workpiece includes moving the microelectronic workpiece so that the stream of processing fluid strikes the microelectronic workpiece at a second radial location positioned radially outwardly from the first radial location.  
   
   
       52 . The method of  claim 47  wherein directing a stream of processing fluid includes directing a stream of rinsing fluid.  
   
   
       53 . The method of  claim 47  wherein directing a stream of processing fluid includes directing a stream of rinsing fluid after at least partially immersing the microelectronic workpiece in an electrochemical fluid.  
   
   
       54 . The method of  claim 47 , further comprising collecting at least some of the processing fluid in a fluid collector having a first annular channel and a second annular channel positioned at least proximate to and in fluid communication with the first annular channel.  
   
   
       55 . The method of  claim 47 , further comprising collecting at least some of the processing fluid in a fluid collector having a first annular channel and a second annular channel positioned at least proximate to and in fluid communication with the first annular channel, and wherein moving the microelectronic workpiece includes moving the microelectronic workpiece so that the stream of processing fluid reflecting from the microelectronic workpiece moves from the first annular channel to the second annular channel.  
   
   
       56 . The method of  claim 47 , further comprising: 
 at least partially immersing the microelectronic workpiece in an electrochemical bath prior to directing the stream of processing fluid;    moving the microelectronic workpiece along an axis and away from the bath to a first axial location and spinning the microelectronic workpiece about the axis to return fluid to the electrochemical bath; and    moving the microelectronic workpiece away from the bath and the first axial location to a second axial location prior to directing the stream of processing fluid.    
   
   
       57 . A method for processing a microelectronic workpiece, comprising: 
 carrying the microelectronic workpiece;    placing the microelectronic workpiece in contact with at least one electrical contact;    electrochemically applying material to the microelectronic workpiece by applying an electrical potential to the at least one electrical contact while the microelectronic workpiece is in fluid communication with an electrochemical processing fluid;    releasing the microelectronic workpiece from the at least one electrical contact; and    cleaning the at least one electrical contact by directing a stream of rinsing fluid at the at least one electrical contact while the at least one electrical contact is spaced apart from the microelectronic workpiece.    
   
   
       58 . The method of  claim 57  wherein cleaning the at least one electrical contact includes rotating the at least one electrical contact while directing the stream of rinsing fluid.  
   
   
       59 . The method of  claim 57  wherein directing a stream of rinsing fluid includes directing a stream of rinsing fluid after at least partially immersing the microelectronic workpiece in an electrolytic fluid.  
   
   
       60 . The method of  claim 57 , further comprising collecting at least some of the rinsing fluid in a fluid collector having a first annular channel and a second annular channel positioned at least proximate to and in fluid communication with the first annular channel.  
   
   
       61 . The method of  claim 57 , further comprising: 
 at least partially immersing the microelectronic workpiece in an electrochemical bath prior to directing the stream of rinsing fluid;    moving the microelectronic workpiece along an axis and away from the bath to a first axial location and spinning the microelectronic workpiece about the axis to return fluid to the electrochemical bath; and    moving the microelectronic workpiece away from the bath and the first axial location to a second axial location prior to releasing the microelectronic workpiece and directing the stream of rinsing fluid.    
   
   
       62 . An apparatus for processing microelectronic workpieces, formed by a process, comprising: 
 positioning a workpiece support at least proximate to a container, the container being configured to receive a processing fluid for processing a microelectronic workpiece;    positioning a nozzle at least proximate to the container, the nozzle being configured to direct a stream of processing fluid toward the workpiece support;    coupling an actuator to at least one of the workpiece support and the container;    coupling a programmable controller to the actuator; and    programming the programmable controller to move the at least one of the workpiece support and the container relative to the other to increase and decrease a distance between the workpiece support and the nozzle while the nozzle directs a stream of processing fluid toward the workpiece support.    
   
   
       63 . The method of  claim 62  wherein programming the programmable controller includes programming the programmable controller to move the at least one of the workpiece support and the container relative to the other along an axis while the workpiece support spins about the axis.  
   
   
       64 . The method of  claim 62  wherein programming the programmable controller includes programming the programmable controller to move the workpiece support relative to the nozzle along an axis