Load-lock technique
Abstract
Disclosed is a load-lock system and an exposure apparatus having the same, wherein the load-lock system includes a chamber, an exhaust system for exhausting a gas from the inside of the chamber, a heater, a first valve for opening/closing an opening of the chamber, a supply system for supplying a gas into the chamber through the heater and the first valve, and a second valve for opening/closing an opening of the chamber provided for conveyance of an object, wherein the supply system supplies a the gas before the object is conveyed into the chamber and when the second valve is held opened, and wherein the exhaust system exhausts a gas supplied from the supply system, after the conveyance of the object.
Claims
exact text as granted — not AI-modified1 . A load-lock system, comprising:
a chamber; an exhaust system for exhausting a gas from the inside of said chamber; a heater; a first valve for opening/closing an opening of said chamber; a supply system for supplying a gas into said chamber through said heater and said first valve; and a second valve for opening/closing an opening of said chamber provided for conveyance of an object; wherein said supply system supplies a the gas before the object is conveyed into said chamber and when said second valve is held opened, and wherein said exhaust system exhausts a gas supplied from said supply system, after the conveyance of the object.
2 . A load-lock system according to claim 1 , wherein said first valve is provided at a top of said chamber.
3 . A load-lock system according to claim 1 , wherein said supply system stops the gas supply prior to the conveyance of the object into said chamber.
4 . A load-lock system according to claim 1 , wherein one and the same valve is provided to function as said first and second valves.
5 . A load-lock system according to claim 1 , further comprising a filter, wherein said supply system supplies the gas into said chamber through said filter.
6 . A device manufacturing apparatus including a load-lock system as recited in claim 1 .
7 . A device manufacturing method including a process that uses a device manufacturing apparatus as recited in claim 6 .
8 . An exposure apparatus including a load-lock system as recited in claim 1 .
9 . A device manufacturing method, comprising the steps of:
transferring a pattern to a substrate by use of an exposure apparatus as recited in claim 8; and developing the substrate having the pattern transferred thereto.
10 . A load-lock method, comprising:
a first step for supply a gas into a chamber through a heater and a first valve which opens/closes an opening formed in the chamber; a second step for closing the first valve after said first step; a third step for conveying an object into the chamber through a second valve that opens/closes an opening formed in the chamber; a fourth step for closing the second valve after said third step; and a fifth step for exhausting a gas inside the chamber, after said second step and also after said fourth step.
11 . A method according to claim 10 , wherein said first step is carried out when the second valve is held opened.
12 . A method according to claim 10 , wherein one and the same valve is used as the first and second valves, and wherein said second and fourth steps comprise the same process to be carried out after said first step and also after said third step.
13 . A method according to claim 10 , wherein said first step is completed before, in said third step, the object is conveyed into the chamber.
14 . A method according to claim 10 , wherein the gas is supplied into the chamber through a filter.Join the waitlist — get patent alerts
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