Noncontact ID card and method of manufacturing the same

Abstract

A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.

1 - 9 . (canceled)  
   
   
       10 . A method of manufacturing a noncontact ID card, comprising steps of, laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip, bonding an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, and bonding a substrate of said antenna circuit board and a substrate of said interposer board.  
   
   
       11 . The method of manufacturing the noncontact ID card of  claim 10 , wherein said substrates bonding step is executed before said electrodes bonding step.  
   
   
       12 . A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip, bonding between an antenna electrode of said antenna circuit board and the enlarged electrode of said interposer board with electroconductive adhesive material, and applying at least one local deformation to a boding face of the electrodes each other in a direction crossing the bonding face.  
   
   
       13 . A method of manufacturing of the noncontact ID card comprising steps of, laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip, bonding an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, and applying at least one local deformation to said antenna electrode and said enlarged electrode in a direction crossing opposite faces of both electrodes.  
   
   
       14 . The method of manufacturing of the noncontact ID card of  claim 13 , wherein said electrodes deformation step is executed before said electrodes bonding step.