US2005107003A1PendingUtilityA1

Ultra fine particle film forming method and apparatus

Assignee: AGENCY IND SCIENCE TECHNPriority: May 22, 2000Filed: Oct 19, 2004Published: May 19, 2005
Est. expiryMay 22, 2020(expired)· nominal 20-yr term from priority
Inventors:Jun Akedo
H05K 2203/105H05K 2203/0257H05K 3/14B24C 5/04B24C 1/10H05K 2203/0278H05K 2203/0143C23C 24/00H05K 2203/1344C23C 4/18H05K 3/102H05K 2203/025B24C 1/00C23C 24/04H10N 30/074
45
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Claims

Abstract

A ultra fine particle film forming apparatus is provided which is capable of forming a ultra fine particle film which has ultra fine particles sufficiently bonded together, sufficient density, flat surface and uniform density. A planarized ultra fine particle film forming method for forming a planarized ultra fine particle film from a deposited film of ultra fine particles formed by supplying the ultra fine particles to a substrate, the method comprising one or more of a planarizing step of planarizing a surface of the deposited film of the ultra fine particles supplied to the substrate.

Claims

exact text as granted — not AI-modified
1 - 22 . (canceled)  
   
   
       23 . A planarized ultra fine particle film forming apparatus for forming a planarized ultra fine particle film from a deposited film of a single layer structure or of a multi-layer structure of ultra fine particles, which deposited film is formed by supplying the ultra fine particles to a substrate, the apparatus comprising: means for applying the ultra fine particles to the substrate to form the deposited film, and means for planarizing a surface of the deposited film, the planarizing means including at least one of the following planarizing devices: an attached particle removal apparatus for rolling or scraping a surface layer portion of the deposited film to remove defective ones of the particles; a film surface processing apparatus for grinding or polishing the surface layer portion; and a pressure apparatus for pressing the deposited film.  
   
   
       24 . A planarized ultra fine particle film forming apparatus according to  claim 23 , wherein the substrate and said attached particle removal apparatus or said film surface processing apparatus are structured to be movable relative to each other.  
   
   
       25 . A film apparatus according to  claim 23  comprising both the particle removal apparatus and the surface processing apparatus, and wherein a grinding/polishing of the deposited film is performed by the surface processing apparatus after removal of defective particles in a scraping of the deposited film by the particle removal apparatus.  
   
   
       26 . A planarized ultra fine particle film forming apparatus for forming a planarized ultra fine particle film from a deposited film of ultra fine particles, comprising: means for applying the ultra fine particles to a substrate to form the deposited film, and means for planarizing a surface of the deposited film; wherein the planarizing means includes particle removal apparatus for rolling/scraping a surface layer portion of the deposited film to remove defective ones of the particles.  
   
   
       27 . A planarized ultra fine particle film forming apparatus for forming a planarized ultra fine particle film from a deposited film of ultra fine particles, comprising: means for applying the ultra fine particles to a substrate to form the deposited film, and means for planarizing a surface of the deposited film; wherein the planarizing means includes pressure apparatus with a roller to press the surface of the deposited film for increasing the density of the film.  
   
   
       28 . A planarized ultra fine particle film forming apparatus for forming a planarized ultra fine particle film from a deposited film of ultra fine particles, comprising: means for applying the ultra fine particles to a substrate to form the deposited film, and means for planarizing a surface of the deposited film; wherein the planarizing means includes means for applying a mechanical impact force to the deposited film to crush the ultra fine particles and to bond the ultra fine particles.

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