Transfer method, method of manufacturing thin film devices, method of maufacturing integrated circuits, circuit board and manufacturing method thereof, electro-optical apparatus and manufacturing method thereof, IC card, and electronic appliance

Abstract

A transfer method comprising a step of forming a plurality of transferred bodies on a transfer origin substrate, and a step of applying energy to partial regions corresponding to the transferred bodies to be transferred, and transferring these transferred bodies corresponding to the partial regions onto a transfer destination substrate. A plurality of transferred bodies such as devices or circuits that are to be disposed on a transfer destination substrate with spaces therebetween can be manufactured integrated together on a transfer origin substrate, and hence compared with the case that the transferred bodies are formed on the transfer destination substrate directly, the amount of materials used in the manufacture of the transferred bodies can be reduced, the area efficiency can be greatly improved, and a transfer destination substrate on which a large number of devices or circuits are disposed in scattered locations can be manufactured efficiently and cheaply.

1 . A circuit board, comprising: 
 a plurality of first transferred bodies transferred from a transfer origin substrate; and    a partial region to which energy is applied and corresponding to each of said first transferred bodies; and    a transfer destination substrate receiving said first transferred bodies corresponding to the partial region.    
     
     
         2 . A circuit board according to  claim 1 , the plurality of said first transferred bodies received by said transfer destination substrate being electrically connected to one another.  
     
     
         3 . A circuit board according to  claim 1 , the plurality of said first transferred bodies being staggered on said transfer destination substrate, and the plurality of said first transferred bodies being electrically connected to one another.  
     
     
         4 . A circuit board according to  claim 1 , one or more second transferred bodies being transferred onto and thus disposed on top of said first transferred bodies transferred onto said transfer destination substrate, said second transferred bodies having a smaller area than said first transferred bodies, and said first and second transferred bodies being electrically connected to one another.  
     
     
         5 . A circuit board, comprising: 
 a plurality of first transferred bodies transferred from a transfer origin substrate and an intermediate transfer substrate; and    a transfer destination substrate receiving said first transferred bodies transferred from said intermediate transfer substrate,    energy being applied to partial regions corresponding to of said first transferred bodies transferred from at least one said transfer origin substrate and said intermediate transfer substrate to transfer said first transferred bodies formed in the partial regions.    
     
     
         6 . A circuit board according to  claim 5 , the plurality of said first transferred bodies transferred onto said transfer destination substrate being electrically connected to one another.  
     
     
         7 . A circuit board according to  claim 5 , the plurality of said first transferred bodies being staggered on said transfer destination substrate, and the plurality of said first transferred bodies being electrically connected to one another.  
     
     
         8 . A circuit board according to  claim 5 , one or more second transferred bodies being transferred onto and thus disposed on top of said first transferred bodies transferred onto said transfer destination substrate, said second transferred bodies having a smaller area than said first transferred bodies, and said first and second transferred bodies being electrically connected to one another.  
     
     
         9 . An electro-optical apparatus comprising the circuit board according to  claim 1 .  
     
     
         10 . An electro-optical apparatus comprising the circuit board according to  claim 5 .  
     
     
         11 . An electronic appliance comprising the circuit board according to  claim 1 .  
     
     
         12 . An electronic appliance comprising the circuit board according to  claim 5 .  
     
     
         13 . An IC card comprising the circuit board according to  claim 1 .  
     
     
         14 . An IC card comprising the circuit board according to  claim 5.