Microprobe tips and methods for making

Abstract

Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

1 . A probe device for testing integrated circuits, comprising: 
 a bridging element;    a plurality of contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a pad of an integrated circuit and wherein the arms are configured to scrub the surface of the pad as contact between the probe and the pad is made.    
   
   
       2 . The probe of  claim 1  wherein a relative movement between the bridging element of the probe device and the contact pad of the integrated circuit is substantially perpendicular to a plane of the contact pad.  
   
   
       3 . The probe of  claim 1  wherein a plurality of the arms have an outward taper.  
   
   
       4 . The probe of  claim 1  wherein a plurality of the arms have an inward taper.  
   
   
       5 . The probe of  claim 1  additionally wherein the second end of each arm comprises a compliant member.  
   
   
       6 . The probe of claim in a direction  5  wherein the compliance is provided in a direction parallel to a direction of relative movement between the pad and the bridging element.  
   
   
       7 . The probe of  claim 1  additionally wherein the bridging element comprises a compliant member.  
   
   
       8 . The probe of  claim 7  wherein the compliance is provided in a direction parallel to a direction of relative movement between the pad and the bridging element.  
   
   
       9 . The probe of  claim 7  wherein the compliant member is located adjacent the plurality of arms.  
   
   
       10 . The probe of  claim 7  wherein the compliant member is located away from a location where the second end of the arms contact the bridging element.  
   
   
       11 . The probe of  claim 1  additionally comprising at least one pushing element that causes the arms to separate as the probe is mated to a pad.  
   
   
       12 . The probe of  claim 11  wherein the pushing element operates as a result of a contact between the probe and the pad as the pad and probe are brought into contact.  
   
   
       13 . The probe of  claim 11  wherein the pushing element may be controlled to operate independently of a movement of a contacted probe and pad.  
   
   
       14 . The probe of  claim 1  additionally comprising at least one pulling element that causes the arms to come together as the probe is mated to a pad.  
   
   
       15 . The probe of  claim 1  formed from a plurality of adhered layers.  
   
   
       16 . The probe of  claim 7  wherein the compliant member is formed from a plurality of adhered layers of material.  
   
   
       17 . A probe device for testing integrated circuits, comprising: 
 a bridging element;    a plurality of contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a pad of an integrated circuit and wherein at least one of the arms or the bridging element is configured to provide compliance between the probe and the pad as contact is made.    
   
   
       18 . The probe of  claim 17  wherein a relative movement between the bridging element of the probe device and the contact pad of the integrated circuit is substantially perpendicular to a plane of the contact pad.  
   
   
       19 . The probe of  claim 17  wherein a plurality of the arms have an outward taper.  
   
   
       20 . The probe of  claim 17  wherein a plurality of the arms have an inward taper.  
   
   
       21 . The probe of  claim 17  additionally wherein the second end of each arm comprises a compliant member.  
   
   
       22 . The probe of claim in a direction  21  wherein the compliance is provided in a direction parallel to a direction of relative movement between the pad and the bridging element.  
   
   
       23 . The probe of  claim 17  additionally wherein the bridging element comprises a compliant member.  
   
   
       24 . The probe of  claim 23  wherein the compliance is provided in a direction parallel to a direction of relative movement between the pad and the bridging element.  
   
   
       25 . The probe of  claim 23  wherein the compliant member is located adjacent the plurality of arms.  
   
   
       26 . The probe of  claim 23  wherein the compliant member is located away from a location where the second end of the arms contact the bridging element.  
   
   
       27 . The probe of  claim 17  additionally comprising at least one pushing element that causes the arms to separate as the probe is mated to a pad.  
   
   
       28 . The probe of  claim 27  wherein the pushing element operates as a result of a contact between the probe and the pad as the pad and probe are brought into contact.  
   
   
       29 . The probe of  claim 17  wherein the pushing element may be controlled to operate independently of a movement of a contacted probe and pad.  
   
   
       30 . The probe of  claim 17  additionally comprising at least one pulling element that causes the arms to come together as the probe is mated to a pad.  
   
   
       31 . The probe of  claim 17  formed from a plurality of adhered layers.  
   
   
       32 . A probe device for testing integrated circuits, comprising: 
 a compliant structure;    a bridging element adhered to a compliant structure;    a plurality of contact arms, each having a first end and a second end, where the second end of each connects to the bridging element and the first end of each is configured to contact a pad of an integrated circuit and wherein at least one of the arms or the bridging element is configured to provide compliance between the probe and the pad as contact is made.