Electronic module

Abstract

An electronic module that includes a plurality of electrically conductive leads, an electrically conductive base plate, a first integrated circuit (IC) die, at least one material block and an electrically non-conductive overmold. The at least one material block functions to more closely match coefficient of thermal expansion (CTE) differences between components of the electronic module.

1 . An electronic module, comprising: 
 at least one electrically conductive lead pin;    an electrically conductive base plate;    a first integrated circuit (IC) die attached to the base plate, wherein the IC die is electrically coupled to at least one the lead pin;    at least one material block positioned adjacent the die and attached to the base plate, wherein the material block has a coefficient of thermal expansion (CTE) that is greater than a CTE of the die and less than a CTE of the base plate; and    an electrically non-conductive overmold encapsulating the die, the material block, the base plate and a portion of the lead pin; wherein said die comprises silicon.    
   
   
       2 . The module of  claim 1 , wherein the material block has about the same thickness as the die.  
   
   
       3 . An electronic module, comprising: 
 at least one conductive lead pin;    an electrically conductive base plate;    a first integrated circuit (IC) die attached to the base plate, wherein the IC die is electrically coupled to at least one the lead pin;    at least one material block positioned adjacent the die and attached to the base plate, wherein the material block has a coefficient of thermal expansion (CTE) that is greater than a CTE of the die and less than a CTE of the base plate;    an electrically non-conductive overmold encapsulating the die, the material block, the base plate and a portion of the lead pin;    a substrate including at least one conductive trace, wherein the substrate is attached to the base plate; and    at least one electronic component electrically coupled to the substrate, including at least a second IC die, wherein the second IC die is electrically coupled to at least a portion of the conductive trace of the substrate and the first IC die; and wherein said substrate comprising alumina.