Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

Abstract

A semiconductor chip of the present invention is so arranged that a front face on which an element circuit is formed has electrode pads and a side face and a back face are coated with a shielding layer for shielding electromagnetic waves. With this, it is possible to provide a semiconductor element capable of being easily manufactured into a smaller semiconductor device compared with a conventional semiconductor device equipped with a shielding cap; a semiconductor device; and a method for manufacturing a semiconductor element.

1 - 17 . (canceled)  
   
   
       18 . A semiconductor device, comprising: 
 a substrate having wiring; and    a semiconductor element on said substrate, whose front face on which an element circuit is formed has electrode pads and whose side face is provided between said front face and a back face on a back side of said front face, said side face and said back face being coated with a shielding layer for shielding electromagnetic waves,    the wiring of the substrate being electrically connected to the electrode pads on said front face;    said semiconductor element being sealed with a resin; and    an external connecting terminal being provided on said substrate on a back face of a surface having the wiring so as to be electrically connected to a part of the wiring.    
   
   
       19 - 22 . (canceled)