System and method for producing a reduced substrate micro-electro-mechanical systems (MEMS) device

Abstract

Briefly, a reduced substrate Micro-Electro-Mechanical Systems (MEMS) device, for example, a low-loss Film Bulk Acoustic Resonators (FBAR) filter or a low-loss FBAR Radio Frequency filter, and a process and a system to produce the same. A reduced substrate MEMS device in accordance with embodiments of the present invention may include a membrane bonded between packaging parts. A process in accordance with embodiments of the present invention may include bonding a first packaging part to a MEMS device including a support substrate, removing the support substrate, and bonding a second packaging part to the MEMS device.

1 - 21 . (canceled)  
   
   
       22 . A production process comprising attaching a first packaging part of a Micro-Electro-Mechanical Systems device to a first side of a membrane having a support substrate attached to a second side thereof opposite said first side.  
   
   
       23 . The production process of  claim 22 , further comprising removing at least part of said support substrate.  
   
   
       24 . The production process of  claim 23 , further comprising attaching a second packaging part of said device to the second side of said membrane.  
   
   
       25 . The production process of  claim 23 , wherein removing at least part of the support substrate comprises removing substantially the entire support substrate.  
   
   
       26 . The production process of  claim 23 , wherein removing at least part of the support substrate comprises etching at least part of the support substrate.  
   
   
       27 . The production process of  claim 23 , wherein removing at least part of the support substrate comprises grinding at least part of the support substrate.  
   
   
       28 . The production process of  claim 23 , wherein the support substrate comprises silicon.  
   
   
       29 . The production process of  claim 22 , wherein the first packaging part comprises a cap and a sealing ring.  
   
   
       30 . The production process of  claim 24 , wherein the second packaging part comprises a cap and a sealing ring.  
   
   
       31 . A production process comprising attaching a first packaging part to a wafer accommodating a membrane of one or more Micro-Electro-Mechanical Systems devices.  
   
   
       32 . The production process of  claim 31 , further comprising removing at least part of a support substrate from said wafer.  
   
   
       33 . The production process of  claim 32 , further comprising attaching a second packaging part to said wafer opposite the first packaging part.  
   
   
       34 . The production process of  claim 33 , further comprising sawing said wafer into one or more separate Micro-Electro-Mechanical Systems devices.  
   
   
       35 . The production process of  claim 32 , wherein removing at least part of the support substrate comprises removing substantially the entire support substrate.  
   
   
       36 . The production process of  claim 32 , wherein removing at least part of the support substrate comprises etching at least part of the support substrate.  
   
   
       37 . The production process of  claim 32 , wherein removing at least part of the support substrate comprises grinding at least part of the support substrate.  
   
   
       38 . The production process of  claim 32 , wherein the support substrate comprises silicon.  
   
   
       39 . A production system comprising a removal unit able to remove at least part of a support substrate from a wafer accommodating a membrane of one or more Micro-Electro-Mechanical Systems devices.  
   
   
       40 . The production system of  claim 39 , further comprising a bonding unit able to bond a packaging part of said one or more Micro-Electro-Mechanical Systems devices to said membrane.  
   
   
       41 . The production system of  claim 40 , wherein the one or more Micro-Electro-Mechanical Systems devices comprise a wafer accommodating a plurality of Micro-Electro-Mechanical Systems devices, and further comprising a sawing unit able to saw said wafer.  
   
   
       42 . The production system of  claim 40 , further comprising a cap production unit able to produce the packaging part.  
   
   
       43 . The production system of  claim 39 , wherein the support substrate comprises silicon.  
   
   
       44 . The production system of  claim 39 , wherein the removal unit comprises a grinding unit able to grind at least part of the support substrate.  
   
   
       45 . The production system of  claim 39 , wherein the removal unit comprises an etching unit able to etch at least part of the support substrate.