Photoresist processing aid and method

Abstract

A composition and method to reduce photolithographic residue and scum formation on a substrate or in a solution, and to reduce or prevent foam formation. The composition contains a diphenyl oxide compound in combination with an antifoam agent. The composition may be added to developer solutions and stripper solutions used in manufacturing printed wiring boards.

1 - 11 . (canceled)  
     
     
         12 . A composition consisting of a diphenyl oxide in a sufficient amount to reduce or inhibit formation of photolithographic residue on a substrate or in a solution and an antifoam agent.  
     
     
         13 . The composition of  claim 12 , wherein the antifoam agent comprises silicones, hydrocarbons, acetylenics, vinyl polymers, polyalkoxylates or mixtures thereof.  
     
     
         14 . The composition of  claim 12 , wherein the diphenyl oxide comprise from about 20% to about 95% by weight of the composition and the antifoam agent comprises from about 5% to about 80% by weight of the composition.  
     
     
         15 . A method of reducing residue formation and foaming comprising contacting a substrate or a solution comprising photoresist with a sufficient amount of a photolithographic residue reducing-antifoam agent composition to inhibit the formation of photolithographic residue on the substrate or the solution and to inhibit or reduce foaming, the composition comprises a diphenyl oxide and an antifoam agent.  
     
     
         16 . The method of  claim 15 , wherein the antifoam agents comprises silicones, hydrocarbons, acetylenics, vinyl polymers, polyalkoxylates or mixtures thereof.  
     
     
         17 . The method of  claim 15 , wherein the photoresist cleaning composition further comprises an auxiliary surfactant.  
     
     
         18 . The method of  claim 15 , wherein the photoresist cleaning composition further comprises a solvent.  
     
     
         19 . The method of  claim 15 , wherein the composition further comprises a developer or stripper component.  
     
     
         20 . The method of  claim 19 , wherein the developer or stripper component develops or strips photoresist from the substrate.