Substrate coating unit and substrate coating method

Abstract

The present invention is a coating unit for applying a coating solution to a substrate which includes: a discharge nozzle for reciprocating in a predetermined direction above the substrate and discharging the coating solution to the substrate; a holder for holding the substrate and horizontally movable in one direction perpendicular to the predetermined direction; and a cover for covering an upper face of the substrate when the substrate is moved in the one direction to be more forward than the discharge nozzle as viewed from a plane, wherein a lower face of the cover is inclined such as to be higher on the discharge nozzle side. According to the present invention, the cover covering the upper face of the substrate restrains a solvent from evaporating from the coating solution applied on the substrate to secure flatness of a coating film.

1 - 22 . (canceled).  
     
     
         23 . A substrate coating method for applying a coating solution to an entire surface of a substrate, comprising the steps of: 
 a discharge nozzle applying the coating solution onto the substrate while moving in a predetermined direction above the substrate;    moving the substrate by a predetermined distance in one direction perpendicular to the predetermined direction when the discharge nozzle reaches an outside of the substrate;    thereafter, the discharge nozzle applying the coating solution onto the substrate while moving in an opposite direction to the predetermined direction above the substrate;    moving a cover for covering an upper face of the substrate in the same one direction as the substrate when the substrate is moved in the one direction; and    moving the cover to an original position of the cover before the movement when the discharge nozzle applies the coating solution to the substrate while moving in the opposite direction to the predetermined direction.    
     
     
         24 . A substrate coating method as set forth in  claim 23 , 
 wherein a speed when the cover moves to the original position is lower than a speed when the cover moves in the one direction by a predetermined distance.    
     
     
         25 . (canceled).  
     
     
         26 . A substrate coating method as set forth in  claim 23 , 
 wherein said lower face of said cover is curved.    
     
     
         27 . A substrate coating method as set forth in  claim 23 , 
 wherein a temperature of said cover is adjustable.    
     
     
         28 . A substrate coating method as set forth in  claim 23 , 
 wherein a temperature of said cover is adjusted in a range of 10° C. to 23° C.    
     
     
         29 . A substrate coating method as set forth in  claim 23 , 
 wherein a flow passage for a cooling water is formed in said cover.    
     
     
         30 . A substrate coating method as set forth in  claim 23 , 
 wherein a Peltier element is accommodated in said cover.    
     
     
         31 . A substrate coating method as set forth in  claim 23 , 
 wherein a heat pipe device is accommodated in said cover.    
     
     
         32 . A substrate coating method as set forth in  claim 23 , 
 wherein a surface of said lower face of said cover is smooth without projections and depressions.