US2005098113A1PendingUtilityA1

Electro-optical apparatus, manufacturing method thereof, and electronic instrument

Assignee: SEIKO EPSON CORPPriority: Nov 2, 2001Filed: Oct 4, 2004Published: May 12, 2005
Est. expiryNov 2, 2021(expired)· nominal 20-yr term from priority
Inventors:Kenji Hayashi
H10H 20/8581H10H 20/84H05B 33/04H10K 50/844H10K 50/87
44
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Claims

Abstract

The invention achieves a reduction in a thickness while suppressing a thermal effect. An apparatus includes a light-emitting element and a sealing layer to hermetically seal the light-emitting element. The sealing layer includes a heat radiation layer having thermal conductivity.

Claims

exact text as granted — not AI-modified
1 . A light-emitting apparatus, comprising: 
 a substrate;    a light emitting element formed on the substrate; and    a sealing layer to seal the light-emitting element, the sealing layer including a planarizing layer formed above the light-emitting element and at least a first layer and a second layer formed above the planarizing layer, the first layer being made of an insulating film, the second layer being formed of a material including at least one element selected from a group comprising boron, carbon, nitrogen, aluminum, silicon, phosphorus, oxygen, cerium, ytterbium, samarium, erbium, yttrium, lanthanum, gadolinium, dysprosium, neodymium, gold, silver and copper.    
   
   
       2 . The light-emitting apparatus according to  claim 1 , 
 the first layer being formed on both of the top and side of the planarizing layer and extending to the substrate.    
   
   
       3 . The light-emitting apparatus according to  claim 1 , 
 the second layer being formed above the planarizing layer and extending to the first layer.    
   
   
       4 . The light-emitting apparatus according to  claim 1 , 
 the sealing layer further including an insulating layer between the first layer and the second layer.    
   
   
       5 . The light-emitting apparatus according to  claim 1 , further comprising a gas permeable protection film formed on the upper side of the sealing layer.

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