Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross linking agent

Abstract

A resin composition that may be applied to make laminates and printed wiring boards. The composition includes a copolymer of styrene and maleic anhydride (SMA) as a cross-linking agent, and a mixture of an epoxy resin and a bismaleimide triazine resin.

1 - 10 . (canceled)  
     
     
         11 . A resin composition comprising a mixture of an epoxy resin, a copolymer of styrene and maleic anhydride, and a bismaleimide triazine resin.  
     
     
         12 . The resin composition of  claim 11  wherein the copolymer of styrene and maleic anhydride has a molecular weight of about 1400 to about 50,000, and an anhydride content of more than 15% by weight.  
     
     
         13 . The resin composition of  claim 11  wherein the copolymer of styrene and maleic anhydride is selected from one copolymer of styrene and maleic anhydride or a mixture of copolymers of styrene and maleic anhydride having a styrene:maleic anhydride ratio of 1:1, 2:1, or 4:1 and a molecular weight from about 1400 to about 2,000.  
     
     
         14 . The resin composition according to  claim 11  wherein a copolymer is used such as to give an equivalency ratio of anhydride and aromatic hydroxy groups:epoxy groups in the rage of 50 to 150% by weight.  
     
     
         15 . The resin composition according to  claim 11  wherein a copolymer is used such as to give an equivalency ratio of anhydride and aromatic hydroxy groups:epoxy groups in the range of 75 to 125% by weight.  
     
     
         16 . The resin composition according to  claim 11  wherein a copolymer is used such as to give an equivalency ratio of anhydride and aromatic hydroxy groups:epoxy groups in the range of 90 to 110% by weight.  
     
     
         17 . The resin composition of  claim 11  wherein the epoxy resin is FR4.  
     
     
         18 . The resin composition of  claim 11 , further comprising an accelerator.  
     
     
         19 . The resin composition of  claim 18  wherein the accelerator is an imidazole.  
     
     
         20 . The resin composition of  claim 11  further comprising one or more additives selected from the group consisting of dyes, pigments, thixotropic agents, fluidity control agents, and stabilizers.  
     
     
         21 . A prepreg comprising a supporting or reinforcing fabric and the thermosetting resin composition of claim  1 , wherein the thermosetting resin is impregnated in the reinforcing fabric.  
     
     
         22 . A laminate comprising one or more layers of the prepreg of  claim 21  and one or more layers of copper.