Hot melt adhesive system and method using machine readable information

Abstract

A hot melt adhesive system includes a melting unit configured to liquify a bulk form of hot melt adhesive and deliver the liquified hot melt adhesive to an application location. The melting unit includes a controller for establishing and/or verifying at least one system condition, such as temperatures associated with system operation. A machine reading unit is coupled with the controller and is capable of receiving information from a machine readable element and communicating the information to the controller for use in establishing and/or verifying the system condition. A method of operating the system includes scanning information on at least one system condition into the controller from a machine readable element, and using the scanned information during operation of the melting unit.

1 . A hot melt adhesive system comprising: 
 a melting unit configured to liquify a bulk form of hot melt adhesive, and deliver the liquified hot melt adhesive to an application location, said melting unit including a controller for establishing and/or verifying at least one system condition, and    a machine reading unit coupled with said controller, said machine reading unit capable of receiving information from a machine readable element and communicating the information to said controller for use in establishing and/or verifying said system condition.    
     
     
         2 . The hot melt adhesive system of  claim 1 , wherein said machine reading unit further comprises a bar code reader.  
     
     
         3 . The hot melt adhesive system of  claim 1 , wherein said machine reading unit further comprises a magnetic strip reader.  
     
     
         4 . The hot melt adhesive system of  claim 1 , wherein said machine reading unit further comprises an RF reader.  
     
     
         5 . The hot melt adhesive system of  claim 1 , wherein said system condition comprises an application temperature of the hot melt adhesive.  
     
     
         6 . The hot melt adhesive system of  claim 1 , wherein said system condition comprises an over-temperature condition of the hot melt adhesive.  
     
     
         7 . The hot melt adhesive system of  claim 1 , wherein said system condition comprises a set-back temperature condition of the hot melt adhesive.  
     
     
         8 . The hot melt adhesive system of  claim 1 , wherein said system condition comprises a warning associated with an operation of the system.  
     
     
         9 . The hot melt adhesive system of  claim 1 , wherein said system condition comprises a flushing operation of the system.  
     
     
         10 . A method of operating a hot melt adhesive system having a controller operating a melting unit, comprising: 
 wirelessly receiving information on at least one system condition into the controller from a machine readable element, and    using the scanned information during operation of the melting unit.    
     
     
         11 . The method of  claim 10 , wherein using the scanned information further comprises: 
 setting an application temperature of the hot melt adhesive.    
     
     
         12 . The method of  claim 10 , wherein using the scanned information further comprises: 
 setting an over-temperature condition of the hot melt adhesive.    
     
     
         13 . The method of  claim 10 , wherein using the scanned information further comprises: 
 establishing and/or verifying a set-back temperature of the hot melt adhesive.    
     
     
         14 . The method of  claim 10 , wherein using the scanned information further comprises: 
 setting a warning condition in the controller.    
     
     
         15 . The method of  claim 10 , wherein using the scanned information further comprises: 
 setting a system flushing condition in the controller.    
     
     
         16 . The method of  claim 10 , wherein scanning information further comprises: 
 scanning information identifying the hot melt adhesive processed in the melter unit.    
     
     
         17 . The method of  claim 10 , wherein using the scanned information further comprises: 
 determining an amount of the hot melt adhesive processed in the melter unit.    
     
     
         18 . The method of  claim 10 , further comprising: 
 logging the scanned information into a database.    
     
     
         19 . The method of  claim 10 , wherein scanning information further comprises: 
 scanning information located on a container of the hot melt adhesive.    
     
     
         20 . The method of  claim 10 , wherein scanning information further comprises: 
 reading the information from a magnetic element.    
     
     
         21 . The method of  claim 10 , wherein scanning information further comprises: 
 reading the information from a bar code.    
     
     
         22 . The method of  claim 10 , wherein scanning information further comprises: 
 reading the information from an RF transponder.    
     
     
         23 . A method of operating a hot melt adhesive dispensing system comprising: 
 receiving information from a machine readable element regarding a hot melt adhesive to be dispensed,    utilizing the received information to set a system condition of the hot melt adhesive dispensing system, and    operating the hot melt adhesive dispensing system according to the system condition to dispense the hot melt adhesive.    
     
     
         24 . The method of  claim 23 , wherein the information is received from a container of the hot melt adhesive.  
     
     
         25 . The method of  claim 23 , further comprising: 
 optically receiving the information from the machine readable element.    
     
     
         26 . The method of  claim 23 , further comprising: 
 magnetically receiving the information from the machine readable element.    
     
     
         27 . The method of  claim 23 , further comprising: 
 electronically receiving the information from the machine readable element.    
     
     
         28 . The method of  claim 27 , further comprising: 
 receiving the information through a radio signal.    
     
     
         29 . The method of  claim 23 , further comprising: 
 receiving the information from an electronic chip.    
     
     
         30 . The method of  claim 29 , wherein said electronic chip is carried on a container of the hot melt adhesive.  
     
     
         31 . The method of  claim 30 , further comprising: 
 receiving the information from the electronic chip with a portable machine reading unit.    
     
     
         32 . The method of  claim 30 , further comprising: 
 receiving the information from the electronic chip automatically when the container of hot melt adhesive comes within proximity to the hot melt adhesive system.    
     
     
         33 . A container of hot melt adhesive for supplying adhesive to a hot melt adhesive dispensing system, said container having a machine readable element affixed thereto, said machine readable element carrying information for establishing and/or verifying at least one condition for operating the hot melt adhesive system.