System and method for using film deposition techniques to provide an antenna within an integrated circuit package

Abstract

An integrated circuit package comprises a cavity for housing an integrated circuit (IC) and an antenna provided as part of the package that is located substantially outside the cavity. The antenna may be located on the floor of the IC package that lies in the region outside of the IC cavity. Alternatively, the antenna may be located on the upper or lower surface of the lid sealing the IC package. The antenna may be placed in the floor or on a surface of the IC lid by forming depressions in the floor or lid surface and depositing conductive material in the depressions. The conductive material deposition may be by sputtering, evaporation, or other known physical or chemical deposition method. Antennas formed in the upper surface of an IC lid may be coupled to a pin of the IC package so that the antenna may be electrically coupled to a transceiver component on the IC within the package. Antennas formed in the lower surface of an IC lid or the floor of the IC package may be coupled by a conductive pin to a component pad of the IC within the package. To reduce electromagnetic noise that may be induced by the radio frequency signals emitted or received by an antenna, a grounding plane may be provided as part of the IC package. The grounding plane may be coupled to an electrical ground reference point through an IC package pin or the IC within the package.

1 - 8 . (canceled)  
     
     
         9 . The package of  claim 21  further comprising: 
 a conductive pin for electrically coupling the conductive trace of the antenna to the IC in the cavity.    
     
     
         10 . (canceled)  
     
     
         11 - 18 . (canceled)  
     
     
         19 . The method of  claim 22  further comprising: 
 electrically coupling the conductive trace of the antenna to the IC in the cavity with a conductive pin.    
     
     
         20 . (canceled)  
     
     
         21 . An integrated circuit package for housing an integrated circuit comprising: 
 a cavity in an integrated circuit (IC) package for housing an IC; and    an antenna provided as part of the IC package and located substantially outside the cavity, the antenna including a conductive trace located on the underside of a lid for the IC package.    
     
     
         22 . A method for providing an antenna with an integrated circuit package comprising: 
 placing an antenna trace outside an integrated circuit (IC) cavity of an IC package;    placing a conductive trace on an underside of a lid for the IC package, the conductive trace coupled to the antenna trace;    coupling the conductive trace to the IC located in the IC cavity of the IC package.