Stage structure in bonding machine and method for controlling the same

Abstract

Stage structure in a bonding machine including a plate movably fitted in a bonding chamber, a plurality of blocks of electro-static chucks fitted to the plate for providing an electro-static force to hold a substrate, a plurality of vacuum holes in the plate around the electro-static chucks for receiving a vacuum force, and adsorbing and holding the substrate, and a plurality of alignment mark confirming holes in a periphery of the plate for confirming the marks for aligning the adsorbed substrate, thereby separating substrate from the stage more easily by applying a DC power with polarities opposite to a regular DC power.

1 - 20 . (canceled)  
     
     
         21 . A method for controlling a bonding machine having upper and lower stages, each with electro-static chucks, each chuck having a plurality of plate electrodes, the method comprising: 
 applying voltages of one of negative and positive polarity to the plate electrodes in the electro-static chuck, and the upper and lower stages adsorbing respective substrates by using the electro-static chucks;    moving the upper and the lower stages to bond the substrates; and    cutting off the voltages applied to the electro-static chucks, applying voltages of opposite polarities to the plate electrodes respectively, and moving one of the upper and lower stages.    
     
     
         22 . A method for controlling a bonding machine having upper and lower stages, each with electro-static chucks, each chuck having a plurality of plate electrodes, the method comprising: 
 loading a first substrate and a second substrate in the bonding chamber;    evacuating the bonding chamber;    applying voltages of one of negative and positive polarity to the plate electrodes in the electro-static chuck, and the upper and lower stages adsorbing respective substrates by using the electro-static chucks;    moving the upper and the lower stages to bond the substrates; and    cutting off the voltages applied to the electro-static chucks, applying voltages of opposite polarities to the plate electrodes respectively, and moving one of the upper and lower stages.    
     
     
         23 . A method as claimed in  claim 22 , further comprising aligning the substrates adsorbed at the upper and lower stages after applying voltages of one of negative and positive polarity to the plate electrodes.  
     
     
         24 . A method as claimed in  claim 22 , further comprising: 
 venting the bonding chamber for applying pressure to the bonded two substrates; and    unloading the pressed first and second substrates, after cutting off the voltages applied to the elector-static chucks, applying voltages of opposite polarities to the plate electrodes respectively, and moving one of the upper and lower stages.