Baths, methods, and tools for superconformal deposition of conductive materials other than copper

Abstract

Superconformal deposition promoters are used to facilitate the superconformal deposition of conductive metals other than copper. Features deposited using the baths, methods, and tools that employ the superconformal deposition promoters are void free. The superconformal deposition promoters include sulfonate terminated alkanethiols, sulfonic acid terminated alkanethiols, carboxylate terminated alkanethiols, carboxylic acid terminated alkanethiols, and sulfonate terminated alkanedisulfide compounds.

1 . A composition for electrolytically depositing a conductive material other than copper onto a conductive substrate comprising: 
 ions of the conductive material;    a complexing agent; and    a superconformal deposition promoter selected from sulfonate terminated alkanethiols, sulfonic acid terminated alkanethiols, carboxylate terminated alkanethiols, carboxylic acid terminated alkanethiols and sulfonate terminated alkanedisulfide compounds.    
     
     
         2 . The composition of  claim 1 , wherein the conductive material is gold.  
     
     
         3 . The composition of  claim 1 , further comprising a grain refiner.  
     
     
         4 . The composition of  claim 3 , wherein the grain refiner is thallium.  
     
     
         5 . The composition of  claim 1  which is free of polyethylene glycol.  
     
     
         6 . The composition of  claim 1 , further comprising a pH buffer.  
     
     
         7 . The composition of  claim 6 , wherein the pH buffer is a pyrophosphate.  
     
     
         8 . The composition of  claim 1 , wherein the superconformal deposition promoter is present in an amount ranging from about 0.05 to 0.3 millimoles.  
     
     
         9 . The composition of  claim 1 , wherein the superconformal deposition promoter is a sulfonate terminated alkanethiol.  
     
     
         10 . The composition of  claim 1 , wherein the superconformal deposition promoter is a sulfonic acid terminated alkanethiol.  
     
     
         11 . A method for the superconformal deposition of a conductive material other than copper onto a conductive substrate comprising: 
 providing a substrate including recessed features to be filled with the conductive material, a conductive feature being present within the recessed features;    contacting the conductive feature with a composition for electrolytically depositing the conductive material into the recessed feature, the composition comprising: 
 (a) ions of the conductive material;  
 (b) a complexing agent; and  
 (c) a superconformal deposition promoter selected from sulfonate terminated alkanethiols, sulfonic acid terminated alkanethiols, carboxylate terminated alkanethiols, carboxylic acid terminated alkanethiols, and sulfonate terminated alkanedisulfide compounds; and  
   depositing the conductive material onto the conductive feature to fill the recessed feature.    
     
     
         12 . The method of  claim 11 , wherein the conductive material is gold.  
     
     
         13 . The method of  claim 11 , wherein the composition for electrolytically depositing the conductive material is free of polyethylene glycol.  
     
     
         14 . The method of  claim 11 , wherein the superconformal deposition promoter is present in the composition for electrolytically depositing the conductive material in an amount ranging from about 0.05 to 0.3 millimoles.  
     
     
         15 . The method of  claim 11 , wherein the superconformal deposition promoter is a sulfonate terminated alkanethiol.  
     
     
         16 . The method of  claim 11 , wherein the superconformal deposition promoter is a sulfonic acid terminated alkanethiol.  
     
     
         17 . The method of  claim 11 , wherein the recessed features are reentrant.  
     
     
         18 . The method of  claim 11 , wherein the conductive material is deposited onto the conductive feature at a rate ranging from about 0.05 to 0.15 micrometers per minute.  
     
     
         19 . A tool for electrolytically depositing a conductive material other than copper onto a substrate that includes recessed features that contain a conductive feature and are to be filled with the conductive material, the tool comprising: 
 a reactor for receiving the substrate and contacting the conductive features with an electrolytic deposition bath containing a superconformal deposition promoter; and    a source of the electrolytic deposition bath containing a superconformal deposition promoter.    
     
     
         20 . The tool of  claim 19 , wherein the electrolytic deposition bath further comprises: 
 ions of the conductive material;    a complexing agent; and    a superconformal deposition promoter selected from sulfonate terminated alkanethiols, sulfonic acid terminated alkanethiols, carboxylate terminated alkanethiols, carboxylic acid terminated alkanethiols, and sulfonate terminated alkanedisulfide compounds.    
     
     
         21 . The tool of  claim 19 , wherein the conductive material is gold.  
     
     
         22 . The tool of  claim 19 , wherein the electrolytic deposition bath is free of polyethylene glycol.  
     
     
         23 . The tool of  claim 19 , wherein the superconformal deposition promoter is a sulfonate terminated alkanethiol.  
     
     
         24 . The tool of  claim 19 , wherein the superconformal deposition promoter is a sulfonic acid terminated alkanethiol.