Cooling technique

Abstract

Disclosed is a positioning apparatus, including a positioning unit, and a temperature adjusting unit which adjusts a temperature of at least a portion of the positioning unit, the temperature adjusting unit including a cooling mechanism based on vaporization heat of a liquid Also disclosed is a cooling apparatus, including a container, a supplying unit which supplies a liquid to the container, and an exhaust unit which exhausts the container.

1 . A positioning apparatus, comprising: 
 a positioning unit; and    a temperature adjusting unit which adjusts a temperature of at least a portion of said positioning unit, said temperature adjusting unit including a cooling mechanism based on vaporization heat of a liquid.    
   
   
       2 . An apparatus according to  claim 1 , wherein said cooling mechanism includes a liquid applying unit for applying a liquid to a particular member to be cooled.  
   
   
       3 . An apparatus according to  claim 1 , wherein said cooling mechanism cools a particular member to be cooled, to a temperature not higher than the temperature of the liquid.  
   
   
       4 . An apparatus according to  claim 1 , wherein said cooling mechanism includes a pressure adjusting unit for adjusting a pressure of an ambience contacting a particular member to be cooled, to a pressure not higher than a vapor pressure of the liquid at a target temperature of the particular member to be cooled.  
   
   
       5 . An Apparatus according to  claim 4 , wherein said pressure adjusting unit includes a container for surrounding the ambience, and an exhaust unit for exhausting said container.  
   
   
       6 . An apparatus according to  claim 5 , wherein said container includes a surrounding member disposed opposed to the particular member to be cooled, with a clearance intervening therebetween.  
   
   
       7 . An apparatus according to  claim 2 , wherein said liquid applying unit discharges a liquid against the particular member to be cooled.  
   
   
       8 . An apparatus according to  claim 2 , wherein said liquid applying unit includes a flowpassage formed inside the particular member to be cooled, a supplying unit for supplying a liquid to said flowpassage, and a connecting member for connecting the flowpassage and an ambience contacting the particular member to be cooled.  
   
   
       9 . An apparatus according to  claim 8 , wherein said supplying unit circulates the liquid through said flowpassage.  
   
   
       10 . An apparatus according to  claim 8 , wherein said connecting member is made of a porous material.  
   
   
       11 . An apparatus according to  claim 8 , wherein the particular member to be cooled is a member having high heat conductivity and having small thermal resistance with a subject of cooling.  
   
   
       12 . An apparatus according to  claim 1 , wherein said temperature adjusting unit includes a heater.  
   
   
       13 . An apparatus according to  claim 12 , wherein said heater includes a strand structure of resistance wire material.  
   
   
       14 . A cooling apparatus, comprising: 
 a container;    a supplying unit which supplies a liquid to said container; and    an exhaust unit which exhausts said container.    
   
   
       15 . An apparatus according to  claim 14 , further comprising a porous material member disposed in said container, for keeping the liquid therein.  
   
   
       16 . An apparatus according to  claim 14 , further comprising a collecting unit for collecting the liquid from said container.  
   
   
       17 . An apparatus according to  claim 14 , wherein at least a portion of said container constitutes a subject of cooling.  
   
   
       18 . An apparatus according to  claim 14 , wherein a subject of cooling is one of a radiation plate and a positioning apparatus.  
   
   
       19 . An apparatus according to  claim 14 , wherein said supplying unit includes a nozzle for discharging the liquid into said container.  
   
   
       20 . A positioning apparatus, comprising: 
 a holding unit which holds an object;    a positioning unit which positions said holding unit; and    a cooling unit which cools said holding unit;    wherein said cooling unit includes (a) a container, (b) a supplying unit which supplies a liquid to said container, and (c) an exhaust unit which exhausts said container.    
   
   
       21 . An exposure apparatus for exposing a substrate to a pattern, said apparatus comprising: 
 a cooling unit which cools an object,    wherein said cooling unit includes (a) a container, (b) a supplying unit which supplies a liquid to said container, and (c) an exhaust unit which exhausts said container.    
   
   
       22 . An apparatus according to  claim 21 , wherein the object is one of a chuck which holds the substrate, and a radiation plate.  
   
   
       23 . An apparatus according to  claim 21 , wherein the substrate is exposed in a vacuum ambience.  
   
   
       24 . A device manufacturing method, comprising the steps of: 
 exposing a substrate to a pattern by use of an exposure apparatus; and p 1  developing the exposed substrate, p 1  wherein said exposure apparatus has a cooling unit for cooling an object, which cooling unit includes (a) a container, (b) a supplying unit which supplies a liquid to said container, and (c) an exhaust unit which exhausts said container.