High-speed signaling interface and method for communicating across across an interface

Abstract

A contact-less high-speed signaling interface and method provide for the communication of high-speed signals across an interface, such as a die-substrate interface or die-die interface. The interface includes a transmission-line structure disposed on a dielectric medium to carry a high-speed forward incident signal, and another transmission-line structure disposed on another dielectric medium and substantially aligned with the other transmission-line structure to generate a coupled high-speed signal in a direction opposite to the incident signal.

1 . An interface comprising: 
 a first transmission-line structure disposed on a first dielectric medium to carry a high-speed forward incident electromagnetic wave; and    a second transmission-line structure disposed on a second dielectric medium and substantially aligned with the first transmission-line structure to generate a coupled high-speed electromagnetic wave in a reverse direction to the incident electromagnetic wave,    wherein the first and second transmission-line structures comprise coplanar waveguides, and    wherein the high-speed forward incident electromagnetic wave is to be dynamically wave-coupled from the first transmission line structure to the second transmission line structure in a coupling region of the transmission line structures.    
   
   
       2 . The interface of  claim 1  further comprising: 
 a first broadband termination at an end of the first transmission-line structure to terminate the high-speed forward incident electromagnetic wave, the first broadband termination being a resistive termination to substantially reduce reflections of the high-speed forward incident electromagnetic wave; and    a second broadband termination at a corresponding end of the second transmission-line structure, the second broadband termination being a resistive termination.    
   
   
       3 . The interface of  claim 2  wherein the first and second transmission-line structures are substantially aligned in a coupling region, the coupling region not including the terminations, the coupling region having a length being approximately a quarter-wavelength of an arithmetic mean of odd and even mode guided wavelengths at about a center frequency of operation.  
   
   
       4 . The interface of  claim 3  wherein the first and second transmission-line structures have a narrower width in the coupling region and wider width outside the coupling region.  
   
   
       5 . The interface of  claim 3  wherein the coupling region is one of either a spiral shape, an “S” shape, a straight line, or a curved line.  
   
   
       6 . The interface of  claim 1  wherein the first transmission-line structure and first broadband termination are disposed on a die, and the second transmission-line structure and second broadband termination are disposed on a substrate, the die and substrate having significantly different coefficients of thermal expansion (CTE), the substrate being comprised of either a ceramic or an organic material.  
   
   
       7 . The interface of  claim 1  wherein the first transmission-line structure is a first planar transmission-line structure comprised of conductive elements residing in a first plane, and the second transmission-line structure is a second planar waveguide comprised of conductive elements residing in a second plane, the second plane being substantially parallel to the first plane, wherein the first and second transmission-line structures are substantially aligned to provide broadside coupling.  
   
   
       8 . The interface of  claim 7  wherein the first and second transmission-line structures comprise coplanar waveguides residing respectively within the first and second planes.  
   
   
       9 . The interface of  claim 7  wherein the first and second transmission-line structures comprise finite ground coplanar waveguides (FGCPW) residing respectively within the first and second planes.  
   
   
       10 . The interface of  claim 1  wherein the high-speed forward incident signal is a digital signal, and wherein the coupled high-speed signal is integrated to compensate at least in part for differentiation effects of the interface to generate a digital signal corresponding with the high-speed forward incident signal.  
   
   
       11 . The interface of  claim 1  wherein the high-speed forward incident signal is comprised of a carrier frequency modulated with a data signal, the carrier frequency being within a coupling bandwidth of the interface.  
   
   
       12 . An interface comprising: 
 a first transmission-line structure disposed on a first dielectric medium to carry a high-speed forward incident electromagnetic wave; and    a second transmission-line structure disposed on a second dielectric medium and substantially aligned with the first transmission-line structure to generate a dynamically wave-coupled high-speed electromagnetic wave in a reverse direction to the incident electromagnetic wave,    wherein the first and second transmission-line structures each comprise a pair of differential lines residing respectively within first and second planes.    
   
   
       13 . The interface of  claim 12  wherein the first transmission-line structure is on a first die, the second transmission-line structure is on a second die, and the first and second dies are located on a single substrate of a multichip module (MCM).  
   
   
       14 . An interface comprising: 
 a first transmission-line structure disposed on a first dielectric medium to carry a high-speed forward incident electromagnetic wave; and    a second transmission-line structure disposed on a second dielectric medium and substantially aligned with the first transmission-line structure to generate a dynamically wave-coupled high-speed electromagnetic wave in a reverse direction to the incident electromagnetic wave,    wherein the first and second transmission-line structures comprise microstrip structures having signal tracks residing respectively within the first and second planes, the microstrip structures having reference conductors residing in parallel planes opposite the first and second planes.    
   
   
       15 . The interface of  claim 14  wherein the first transmission-line structure is on a first die, the second transmission-line structure is on a second die, and the first and second dies are located on a single substrate of a multichip module (MCM).  
   
   
       16 . An interface comprising: 
 a first transmission-line structure disposed on a first dielectric medium to carry a high-speed forward incident electromagnetic wave; and    a second transmission-line structure disposed on a second dielectric medium and substantially aligned in a side-by-side orientation with the first transmission-line structure to generate an edge coupled high-speed electromagnetic wave in a reverse direction to the incident electromagnetic wave,    wherein the high-speed forward incident electromagnetic wave is to be dynamically wave-coupled from the first transmission line structure to the second transmission line structure in a coupling region of the transmission line structures.    
   
   
       17 . The interface of  claim 16  wherein the first transmission-line structure is a first planar transmission-line structure comprised of planar elements residing in a first and second parallel planes, and the second transmission-line structure is a second planar waveguide comprised of corresponding planar elements residing in the first and second planes, wherein the first and second transmission-line structures are substantially aligned to provide the edge coupling therebetween.  
   
   
       18 . The interface of  claim 16  wherein the first and second transmission-line structures further comprise corresponding planar elements residing in a third parallel plane and wherein the first and second transmission-line structures are stripline structures having corresponding reference conductors in the first and third parallel planes, and having corresponding signal conductors in the second plane, wherein edges of the signal conductors are substantially aligned.  
   
   
       19 . The interface of  claim 16  wherein the first and second transmission-line structures are microstrip structures having a planar signal track in the first plane, and a reference conductor residing in the second plane, wherein edges of the signal conductors are substantially aligned.  
   
   
       20 . The interface of  claim 16  wherein the first and second transmission-line structures further comprise corresponding planar elements residing in a third parallel plane, wherein the first and second transmission-line structures are stacked microstrip structures having planar signal conductors in the first and third plane, and having reference conductors residing in the second plane, wherein edges of the signal conductors are substantially aligned.  
   
   
       21 . The interface of  claim 16  wherein the first transmission-line structure is on a first die, the second transmission-line structure is on a second die, and the first and second dies are located on a single substrate of a multichip module (MCM).  
   
   
       22 . A method for communicating across an interface comprising: 
 receiving a high-speed forward incident signal in a first transmission-line structure; and    coupling the incident signal to a second transmission-line structure in a reverse direction to the incident signal,    wherein the first and second transmission-line structures are disposed on separate dielectric mediums,    wherein the first and second transmission-line structures comprise coplanar waveguides, and    wherein the first and second transmission-line structures are substantially aligned in a side-by-side orientation to provide edge coupling therebetween.    
   
   
       23 . The method of  claim 22  wherein the high-speed forward incident signal is a digital signal, and wherein the method includes integrating the coupled high-speed signal to generate a digital signal substantially corresponding with the high-speed forward incident signal.  
   
   
       24 . The method of  claim 23  further comprising: 
 terminating the high-speed forward incident signal in a first termination coupled to the first transmission-line structure; and    terminating coupled signals in a forward direction in a second termination coupled to the second transmission-line structure,    wherein the first and second transmission-line structures are substantially aligned in a coupling region, the coupling region not including the terminations, the coupling region having a length being approximately a quarter-wavelength of an arithmetic mean of odd and even mode guided wavelengths, and    wherein the first and second transmission-line structures have a narrower width in the coupling region and wider width outside the coupling region at about a center frequency of operation.    
   
   
       25 . The method of  claim 24  wherein the first transmission-line structure is a first planar transmission-line structure comprised of planar elements residing in a first and second parallel planes, and the second transmission-line structure is a second planar waveguide comprised of corresponding planar elements residing in the first and second planes, wherein the first and second transmission-line structures are substantially aligned to provide the edge coupling therebetween.  
   
   
       26 . A system comprising: 
 an interface between a die and a substrate; and    a signal processing element on the die to communicate RF signals over the interface with the substrate,    wherein the interface comprises a first transmission-line structure disposed on the substrate to carry a high-speed forward incident signal, and a second transmission-line structure disposed on the die, the second transmission-line structure being substantially aligned with the first transmission-line structure to generate a coupled high-speed signal in an opposite direction to the incident signal,    wherein the first and second transmission-line structures comprise coplanar waveguides, and    wherein the first and second transmission-line structures are substantially aligned in a side-by-side orientation to provide edge coupling therebetween.    
   
   
       27 . The system of  claim 26  wherein the substrate is comprised of either ceramic or organic material, and wherein the system is a processing system and wherein the high-speed forward incident signal is a digital signal, and wherein the die includes a integrator to integrate the coupled high-speed signal to generate a digital signal substantially corresponding with the high-speed forward incident signal.  
   
   
       28 . The system of  claim 27  wherein the first transmission-line structure is a first planar transmission-line structure comprised of planar elements residing in a first and second parallel planes, and the second transmission-line structure is a second planar waveguide comprised of corresponding planar elements residing in the first and second planes, wherein the first and second transmission-line structures are substantially aligned to provide edge coupling therebetween, 
 wherein the first and second transmission-line structures are substantially aligned in a side-by-side orientation to provide edge coupling therebetween.