Chemical-mechanical planarization composition having PVNO and associated method for use

Abstract

A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition comprises an abrasive and a polyvinylpyridine-N-oxide polymer. The composition possesses high selectivities for metal and barrier material removal in metal CMP. The composition may further comprise an oxidizing agent in which case the composition is particularly useful in conjunction with the associated method for metal CMP applications (e.g., copper CMP).

1 . A polishing composition comprising: 
 a) an abrasive; and    b) a polyvinylpyridine-N-oxide polymer.    
   
   
       2 . The polishing composition of  claim 1  wherein the abrasive is a colloidal abrasive.  
   
   
       3 . The polishing composition of  claim 1  further comprising c) an oxidizing agent.  
   
   
       4 . The polishing composition of  claim 1  wherein the abrasive is silica.  
   
   
       5 . The polishing composition of  claim 1  wherein the level of the polyvinylpyridine-N-oxide polymer in the composition ranges from 0.02 weight % to 1 weight %.  
   
   
       6 . The polishing composition of  claim 5  wherein the level of the polyvinylpyridine-N-oxide polymer in the composition ranges from 0.05 weight % to 0.35 weight %.  
   
   
       7 . The polishing composition of  claim 6  wherein the level of the polyvinylpyridine-N-oxide polymer in the composition ranges from 0.1 weight % to 0.35 weight %.  
   
   
       8 . A method of polishing comprising the steps of: 
 A) placing a substrate in contact with a polishing pad;    B) delivering a polishing composition comprising a) an abrasive; and b) a polyvinylpyridine-N-oxide polymer; and    C) polishing the substrate with the polishing composition:    
   
   
       9 . The method of  claim 8  wherein the abrasive is a colloidal abrasive.  
   
   
       10 . The method of  claim 8  wherein the composition further comprises c) an oxidizing agent.  
   
   
       11 . The method of  claim 8  wherein the abrasive is silica.  
   
   
       12 . The method of  claim 8  wherein the level of the polyvinylpyridine-N-oxide polymer in the composition employed in the method ranges from 0.02 weight % to 1 weight %.  
   
   
       13 . The method of  claim 12  wherein the level of the polyvinylpyridine-N-oxide polymer in the composition employed in the method ranges from 0.05 weight % to 0.35 weight %.  
   
   
       14 . The polishing composition of  claim 13  wherein the level of the polyvinylpyridine-N-oxide polymer in the composition employed in the method ranges from 0.1 weight % to 0.35 weight %.