High power light emitting diode device

Abstract

A circuit element having a heat-conducting body having top and bottom surfaces, and a die having an electronic circuit thereon is disclosed. The die includes first and second contact points for powering the electronic circuit. The die is in thermal contact with the heat-conducting body, the die having a bottom surface that is smaller than the top surface of the heat-conducting body. The first contact point on the die is connected to a first trace bonded to the top surface of the heat-conducting body. An encapsulating cap covers the die. The first trace has a first portion that extends outside of the encapsulating cap and a second portion that is covered by the encapsulating cap. The heat-conducting body is preferably constructed from copper or aluminum and includes a cavity having an opening on the first surface in which the die is mounted. The die preferably includes a light-emitting device.

1 . A circuit element comprising: 
 a heat-conducting body having top and bottom surfaces;    a die having an electronic circuit thereon, said die including first and second contact points for powering said electronic circuit, said die being in thermal contact with said heat-conducting body, said die having a bottom surface that is smaller than said top surface of said heat-conducting body;    a first trace comprising an electrically conducting material bonded to said top surface of said heat-conducting body and electrically insulated therefrom;    a first electrically conducting path from said first contact point to said first trace; and    an encapsulating cap covering said die, and said first electrically conducting path, said first trace having a first portion that extends outside of said encapsulating cap and a second portion that is covered by said encapsulating cap.    
     
     
         2 . The circuit element of  claim 1  wherein said electronic circuit comprises an LED.  
     
     
         3 . The circuit element of  claim 1  wherein said first trace comprises an electrically conducting material on an insulating substrate, said insulating substrate being bonded to said heat-conducting body.  
     
     
         4 . The circuit element of  claim 3  wherein said insulating substrate comprises an opening, said die being connected to said heat-conducting body through said opening.  
     
     
         5 . The circuit element of  claim 1  wherein said heat-conducting body comprises copper.  
     
     
         6 . The circuit element of  claim 1  wherein said heat-conducting body comprises aluminum.  
     
     
         7 . The circuit element of  claim 1  wherein said heat-conducting body comprises a cavity having an opening on said first surface and wherein said die is mounted in said cavity.  
     
     
         8 . The circuit element of  claim 1  wherein said die comprises a light-emitting device that emits light in a direction pointing away from said top surface and wherein said encapsulating cap is optically transparent to said emitted light.  
     
     
         9 . The circuit element of  claim 1  wherein said first electrically conducing path comprises a wire having a first end bonded to said first contact point and a second end bonded to said first trace.  
     
     
         10 . The circuit element of  claim 9  wherein said first trace comprises a T-shaped strip of copper.  
     
     
         11 . The circuit element of  claim 9  further comprising a solder ball on said first portion of said first trace.  
     
     
         12 . The circuit element of  claim 1  further comprising a second trace comprising an electrically conducting medium bonded to said top surface of said heat-conducting body and insulated therefrom, said second trace being electrically connected to said second contact point by a second electrically conducting path.  
     
     
         13 . The circuit element of  claim 12  wherein said second trace further comprises a solder ball.  
     
     
         14 . The circuit element of  claim 12  further comprising a third solder ball positioned on said top surface of said heat conducting die and positioned non-colinearly with respect to said first and second solder balls.  
     
     
         15 . The circuit element of  claim 1  wherein said encapsulating cap comprises a dam surrounding said die, said dam being filled with a clear encapsulating material.  
     
     
         16 . The circuit element of  claim 1  wherein said bottom surface of said heat-conducting body comprises a surface having a greater surface area than said top surface of said heat-conducting body.  
     
     
         17 . The circuit element of  claim 16  wherein said bottom surface of said heat-conducting body comprises fins for facilitating heat transfer from said bottom surface of said heat conducting body.  
     
     
         18 . The circuit element of  claim 1  further comprising a circuit board having top and bottom surfaces and a hole therethrough, said first trace being connected to a conductor on said bottom surface of said circuit board such that said die is visible from a location above said top surface of said circuit board.  
     
     
         19 . The circuit element of  claim 18  wherein said heat conducting body is connected to said circuit board via the second and third locations on said bottom surface of said circuit board.  
     
     
         20 . The circuit element of  claim 19  wherein said connections between said circuit board, said first trace, and said second and third locations comprise solder joints.