Method, apparatus, system, method and device for data creating, and program for mounting electronic component

Abstract

This invention provides an electronic component mounting method capable of effectively utilizing a self-alignment effect even if a mounting interval of electronic components is small. This method includes the steps of detecting a printing position of a solder paste on the circuit board and mounting an electronic component. This invention further provides apparatus, devices, and system using the method. When a solder paste on a circuit board having a land formed thereon is printed and an electronic component is mounted, the printing position of the solder paste of the circuit board is detected by a printing position detecting device included in an inspecting apparatus. Then, the electronic component is mounted by using the detected printing position of the solder paste as a reference by an electronic component mounting apparatus.

1 . An electronic component mounting apparatus for mounting an electronic component comprising: 
 a mounting means for mounting the electronic component on the circuit board on which is formed a land and printed a solder paste by referring to a printing position of the solder paste as a reference.    
   
   
       2 . The electronic component mounting apparatus according to  claim 1 , further comprising: 
 a mounting data creating device for creating a data utilized for mounting the electronic component on the circuit board by the mounting means.    
   
   
       3 . An electronic component mounting system for mounting an electronic component comprising: 
 a printing position detecting device for detecting a printing position of a solder paste on a circuit board on which a land is formed and the solder paste is printed, and    an electronic component mounting apparatus for mounting an electronic component on the circuit board by referring the detected printing position of said solder paste.    
   
   
       4 . The electronic component mounting system according to  claim 3 , further comprising: 
 a solder paste printing apparatus for printing the solder paste on the circuit board by setting a position of the land as a target position.    
   
   
       5 . The electronic component mounting system according to  claim 4 , 
 wherein said printing position detecting device is provided in the solder paste printing apparatus.    
   
   
       6 . The electronic component mounting system according to  claim 3 , 
 wherein the printing position detecting device is provided in the electronic component mounting apparatus.    
   
   
       7 . The electronic component mounting system according to  claim 3 , further comprising: 
 a host computer connected to both of the printing position detecting device and the electronic component mounting apparatus through a communication line, and    wherein said host computer receives a detected printing position from the printing position detecting device and transmits a feed-forward signal to the electronic component mounting apparatus.    
   
   
       8 . The electronic component mounting system according to  claim 4 , further comprising: 
 an inspecting apparatus for inspecting states of said printed solder paste and said land formed on said circuit board.    
   
   
       9 . The electronic component mounting system according to  claim 8 , 
 wherein said printing position detecting device is provided in said inspecting apparatus.