Tray with flat bottom reference surface

Abstract

A molded component tray includes a component housing portion having a plurality of component pockets. The tray has a flange around the component housing portion defining a perimeter of the tray. A flange top surface in one embodiment is below the component housing top surface. A flange bottom surface includes recessed areas positioned in alignment with mold ejector pins which may contact the flange bottom surface, and alternatively in alignment with mold ejector pin marks on the flange top surface. The depth of the recesses is greater than the height burrs left by the ejector pins, thereby leaving the tray bottom surface free of burrs caused by ejector pins. Alternatively, when one tray is stacked on top of another, the recesses in the bottom of an upper tray can be positioned to allow clearance for ejector pin marks on the top of the flange of a lower tray.

1 . A tray comprising: 
 a molded tray including    a component housing having a plurality of pockets for holding components; and    a tray surface having a plurality of recesses, each recess for recessing a burr on a bottom surface of said recess below said tray surface.    
   
   
       2 . A tray as recited in  claim 1  wherein said burr is caused by contact of a mold ejector pin with said bottom surface.  
   
   
       3 . A tray as recited in  claim 1  wherein said tray has a flange, and said tray surface includes a flange surface.  
   
   
       4 . A tray as recited in  claim 3  wherein said tray surface includes a flange top surface.  
   
   
       5 . A tray as recited in  claim 3  wherein said tray surface includes a flange bottom surface.  
   
   
       6 . A tray comprising: 
 a tray for holding a plurality of semiconductor devices, said tray including    a component housing having a plurality of pockets for holding said semiconductor devices; and    a flange surrounding said housing, said flange having a flange surface with a plurality of recesses formed therein for providing clearance for a burr on a mating surface for contacting said flange surface.    
   
   
       7 . A tray as recited in  claim 6  wherein said flange surface is a flange bottom surface, and said mating surface is a flange top surface of a second tray upon which said tray is to be placed.  
   
   
       8 . A tray as recited in  claim 7  wherein said burr is caused by contact of a mold ejector pin with said flange top surface of said second tray.  
   
   
       9 . A method of tray manufacture comprising: 
 forming a plurality of recesses in a tray for holding semiconductors devices using a mold; and    applying a mold ejector pin to a recess bottom surface of a said recess for ejecting said tray from said mold.    
   
   
       10 . A method as recited in  claim 9  wherein said tray includes a flange, and at least one of said recesses is in a flange top surface.  
   
   
       11 . A method as recited in  claim 10  wherein said tray includes a flange, and at least one of said recesses is in a flange bottom surface.