Printed circuit board unit with detachment mechanism for electronic component

Abstract

A printed circuit board unit comprises an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole for receiving the solder bump. The through hole may be designed to form a constriction in the solder bump. Electric connection can reliably be established between the printed circuit board and the electronic component since the solder bump is allowed to penetrate through the through hole in the insulated film. When the insulated film is brought away from the printed circuit board, the insulated film serves to tear the solder bump in two pieces at the constriction, so that the electronic component can easily be detached from the printed circuit board.

1 - 12 . (canceled).  
   
   
       13 . A method of detaching an electronic component from a printed circuit board, comprising: 
 keeping a solder bump at a melting temperature on a surface of a conductive pad on the printed circuit board under the electronic component; and    displacing a wall defined in an insulated film between the printed circuit board and the electronic component so as to surround the solder bumps.    
   
   
       14 . The method of detaching according to  claim 13 , wherein the insulated film is displaced relative to the conductive pad.  
   
   
       15 . The method of detaching according to  claim 13 , wherein the insulated film is displaced relative to the electronic component.