Heat-conductive structure
Abstract
An improved heat-conductive structure includes a heat-conductive plate. The heat-conductive plate has a base plate, two support members extending upwards respectively from bilateral sides of the base plate for a predetermined breadth and height, a channel formed between the base plate and the two support members, two wing portions horizontally extending outwards respectively from the two support members, and a recession formed at a midsection of a bottom side of the base plate. The base plate is relatively thin and of low thermal resistance at the midsection thereof corresponding to the recession to attain effective and rapid heat conduction.
Claims
exact text as granted — not AI-modified1 . A heat-conductive structure comprising a heat-conductive plate, said heat-conductive plate having a base plate, two support members respectively extending upwards from bilateral sides of said base plate for a predetermined breadth and height, a channel formed between said base plate and said two support members, two wing portions extending parallel outwards respectively from said two support members, and a recession formed at a midsection of a bottom side of said base plate; wherein, the midsection of the bottom side of said base plate is relatively thin to have a relatively low thermal resistance, thereby causing rapid heat conduction.
2 . The heat-conductive structure as defined in claim 1 , wherein said wing portions are positioned higher than said base plate.
3 . A heat-dissipative structure having the heat-conductive structure as defined in claim 1 , said heat-dissipative structure comprising:
a heat-conductive plate having a base plate, two support members extending upwards respectively from bilateral sides of said base plate for a predetermined breadth and height, a channel formed between said base plate and said two support members, two wing portions extending parallel outwards respectively from said two support members, and a recession formed at a midsection of a bottom side of said base plate; at least one heat pipe disposed in said channel; and a plurality of fins mounted upright on said heat-conductive plate and said at least one heat pipe, positioned over said channel at bottom sides thereof, and connected to a surface of said heat pipe and top sides of said wing portions.
4 . The heat-dissipative structure as defined in claim 3 , wherein said heat pipe has at least one end extending outwards and upwards and through said fins.
5 . The heat-dissipative structure as defined in claim 3 further comprising a top plate mounted on said fins; said heat pipe has at least one end extending outwards and upwards and through said fins.Join the waitlist — get patent alerts
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