Sizing method for board

Abstract

A method for managing the water sorption of a board by layered sizing is provided, such that the sizing of a central layer is effected with a hydrophobic and fast-curing adhesive, and the surface sizing in preparation for calendering is effected with an adhesive which is hydrophilic during its curing period, such that, during a surface wetting process, water sorption occurs substantially only into a topliner.

1 . A method for managing water sorption of board by layered sizing, wherein sizing of at least one of a central layer and a back layer is effected with a hydrophobic and fast-curing adhesive, and sizing of a topliner is effected with an adhesive, the adhesive being hydrophilic during a curing period thereof, such that, during a surface wetting process, water sorption occurs substantially only into the topliner.  
     
     
         2 . A method as set forth in  claim 1 , wherein calendering is effected after the wetting process.  
     
     
         3 . A method as set forth in  claim 1 , wherein the method is used for manufacture of liquid packaging board.  
     
     
         4 . A method as set forth in  claim 1 , wherein the adhesive used as a topliner adhesive comprises a slow stuff sizing adhesive.  
     
     
         5 . A system for the manufacture of board, wherein the system sizes at least one of a central layer and a back layer with a hydrophobic, fast-curing stuff sizing adhesive, and sizes a topliner with a stuff sizing adhesive, the stuff sizing adhesive being hydrophilic during a curing period thereof, and, during a surface wetting process, water sorption occurs substantially only into the topliner.  
     
     
         6 . A system as set forth in  claim 5 , wherein the wetting mechanism comprises a spray device.  
     
     
         7 . Board manufactured by layered sizing, wherein at least one of a central layer and a back layer is sized with a hydrophobic and fast-curing adhesive, and surface sizing of the board is effected with an adhesive, the adhesive being hydrophilic during a curing period thereof.