Substrate holding apparatus and substrate polishing apparatus

Abstract

A substrate holding apparatus comprises a substrate holder body having a substrate holding side facing a polishing surface and holding a substrate on the substrate holding side and a retainer ring fixedly secured to the substrate holder body. The retainer ring is arranged to surround an outer periphery of the substrate held by the substrate holder body so that the retainer ring engages with the polishing surface radially outside the substrate as the polishing of the substrate is effected. The substrate holder body is provided with a membrane having inside and outside surfaces. The inside surface cooperates with a surface of the substrate holder body to define a fluid pressure chamber to which a fluid pressure is applied. The outer surface engages with the substrate held by the substrate holder body.

1 - 37 . (canceled)  
     
     
         38 . A substrate holding apparatus for holding a substrate and bringing it into contact with a polishing surface of a polishing table, the apparatus comprising: 
 a substrate holder body for holding a substrate;    a retainer ring arranged to surround an outer periphery of the substrate held by said substrate holder body;    a support member provided within said substrate holder and having therein a communication hole for connecting to a vacuum source;    an elastic membrane having an opening at a position where an opening of said communication hole of said support member opens, said elastic membrane defining a fluid pressure chamber within said substrate holder body;    wherein said fluid pressure chamber is supplied with a pressurized fluid to press the substrate against the polishing surface; said retainer ring is pressed against the polishing surface; and, said substrate is held by a vacuum portion formed by said communication hole of said support member and the opening of said elastic membrane by connecting said communication hole to said vacuum source.    
     
     
         39 . A substrate holding apparatus claimed in  claim 38 , wherein a pressure of said pressurized fluid is adjustably changed so as to adjust a pressure under which the substrate is pressed against said polishing surface.  
     
     
         40 . A substrate holding apparatus claimed in  claim 38 , wherein said elastic membrane is supported by said support member so that said elastic membrane moves together with said support member in a vertical direction within said substrate holder body, and movement of said support member in the vertical direction is limited by a restriction member.  
     
     
         41 . A substrate holding apparatus claimed in  claim 38 , wherein said support member includes a plurality of said communication holes, and said elastic membrane has a plurality of said openings.  
     
     
         42 . A substrate holding apparatus claimed in  claim 38 , wherein said retainer ring is pressed against said polishing surface by a mechanism for moving said substrate holder body in a vertical direction.  
     
     
         43 . A substrate polishing apparatus comprising: 
 a polishing table having a polishing surface; and    a substrate holder for holding a substrate and bringing it into contact with the polishing surface, said substrate holder comprising:    a support member provided within said substrate holder and having therein a communication hole for connecting to a vacuum source; and    an elastic membrane having an opening at a position where an opening of said communication hole of said support member opens, said elastic membrane defining a fluid pressure chamber within said substrate holder;    wherein a vacuum portion for holding said substrate is formed by said communication hole of said support member and the opening of said elastic membrane;    said fluid pressure chamber is supplied with a pressurized fluid to press the substrate against said polishing surface; and    said substrate is held by said vacuum portion of said support member by connecting said communication hole to said vacuum source.    
     
     
         44 . A substrate polishing apparatus claimed in  claim 43 , wherein said polishing surface is formed by an abrasive plate provided with fixed abrasive particles bound by a binder.  
     
     
         45 . A substrate polishing apparatus claimed in  claim 43 , wherein a pressure of said pressurized fluid is adjustably changed so as to adjust a pressure under which the substrate is pressed against said polishing surface.  
     
     
         46 . A substrate polishing apparatus claimed in  claim 43 , wherein said elastic membrane is supported by said support member so that said elastic membrane moves together with said support member in a vertical direction within said substrate holder body, and movement of said support member in the vertical direction is limited by a restriction member.  
     
     
         47 . A substrate polishing apparatus claimed in  claim 43 , wherein said support member includes a plurality of said communication holes, and said elastic membrane has a plurality of said openings.  
     
     
         48 . A substrate polishing apparatus claimed in  claim 43 , wherein said retainer ring is pressed against said polishing surface by a mechanism for moving said substrate holder body in a vertical direction.  
     
     
         49 . A method of polishing a substrate by holding a substrate by a substrate holder and pressing the substrate against a polishing surface of a polishing table, comprising: 
 supplying a fluid pressure into a fluid pressure chamber defined by an elastic membrane provided within said substrate holder to press said substrate against the polishing surface, wherein said elastic membrane includes an opening therein; and    holding said substrate by a vacuum portion by connecting said vacuum portion to a vacuum source, wherein said vacuum portion comprises a communication hole provided in said support member and connected to said vacuum source, and said opening of said elastic membrane, wherein said opening is provided at a position where an opening of said communication hole of said support member opens.    
     
     
         50 . A substrate holding apparatus for holding a substrate and bringing it into contact with a polishing surface of a polishing table, the apparatus comprising: 
 a substrate holder body for holding a substrate;    a retainer ring arranged to surround an outer periphery of said substrate held by said substrate holder body;    a support member provided within said substrate holder body;    an elastic membrane supported by said support member and forming a fluid pressure chamber within said substrate holder body; and    an actuator for adjusting a limitation of movement of said support member in a vertical direction within said substrate holder body;    wherein said fluid pressure chamber is supplied with a pressurized fluid to press the substrate against the polishing surface through said membrane, said retainer ring is pressed against said polishing surface, and the limitation of movement of said support member in a vertical direction is adjusted by said actuator.    
     
     
         51 . A substrate holding apparatus claimed in  claim 50 , wherein said retainer ring is integrally formed with or fixedly secured to said substrate holder.  
     
     
         52 . A substrate holding apparatus claimed in  claim 50 , wherein said actuator comprises an air cylinder.  
     
     
         53 . A substrate holding apparatus claimed in  claim 50 , wherein said substrate is mechanically pressed against said polishing surface during polishing operation of said substrate by moving said support member downward by said actuator.  
     
     
         54 . A substrate polishing apparatus comprising: 
 a polishing table having a polishing surface;    a substrate holder for holding a substrate and pressing said substrate against said polishing surface, said substrate holder comprising:    a support member provided within said substrate holder;    an elastic membrane supported by said support member and forming a fluid chamber within said substrate holder; and    an actuator for adjusting a limitation of movement of said support member in a vertical direction within said substrate holder body;    wherein said fluid pressure chamber is supplied with a pressurized fluid to press the substrate against the polishing surface through said membrane, a retainer ring is pressed against said polishing surface, and the limitation of movement of said support member in a vertical direction is adjusted by said actuator.    
     
     
         55 . A substrate polishing apparatus claimed in  claim 54 , wherein said retainer ring is integrally formed with or fixedly secured to said substrate holder.  
     
     
         56 . A substrate polishing apparatus claimed in  claim 54 , wherein said actuator comprises an air cylinder.  
     
     
         57 . A substrate polishing apparatus claimed in  claim 54 , wherein said substrate is mechanically pressed against said polishing surface during polishing operation of said substrate by moving said support member downward by said actuator.  
     
     
         58 . A method of polishing a substrate by holding a substrate by a substrate holder and pressing said substrate against a polishing surface of a polishing table, comprising: 
 supplying a fluid pressure into a fluid pressure chamber provided in said substrate holder to press the substrate against the polishing surface, said pressure chamber being formed by an elastic membrane supported by a support member provided within said substrate holder; and    adjusting a limitation of the movement of said support member in a vertical direction within said substrate holder by an actuator.