US2005070038A1PendingUtilityA1

Display device and method of fabricating the same

Priority: Mar 10, 1995Filed: Oct 21, 2004Published: Mar 31, 2005
Est. expiryMar 10, 2015(expired)· nominal 20-yr term from priority
H10P 72/7432H10P 72/0442H10W 72/07251H10W 72/20G02F 1/1345G02F 1/13454G02F 1/133305G02F 1/13452G02F 1/1303
46
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Claims

Abstract

A method of fabricating a driver circuit for use with a passive matrix or active matrix electrooptical display device such as a liquid crystal display. The driver circuit occupies less space than heretofore. A circuit (stick crystal) having a length substantially equal to the length of one side of the matrix of the display device is used as the driver circuit. The circuit is bonded to one substrate of the display device, and then the terminals of the circuit are connected with the terminals of the display device. Subsequently, the substrate of the driver circuit is removed. This makes the configuration of the circuit much simpler than the configuration of the circuit heretofore required by the TAB method or COG method, because conducting lines are not laid in a complex manner. The driver circuit can be formed on a large-area substrate such as a glass substrate. The display device can be formed on a lightweight material having a high shock resistance such as a plastic substrate. Hence, a display device having excellent portability can be obtained.

Claims

exact text as granted — not AI-modified
1 . (canceled)  
   
   
       2 . A method of manufacturing a display device comprising: 
 forming a color filter over a first substrate;    forming a planarization film over the color filter;    forming an electrode over the planarization film;    forming an orientation film over the electrode;    providing a driver circuit over the first substrate with an adhesive therebetween, said driver circuit held by a second substrate;    removing said second substrate providing said driver circuit over the first substrate;    forming a sealing material over the first substrate;    dripping a liquid crystal material onto the orientation film;    bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and    cutting the bonded first and second substrates.    
   
   
       3 . The method according to  claim 2  wherein said display device is a passive type display device.  
   
   
       4 . The method according to  claim 2  wherein said display device is an active matrix display device.  
   
   
       5 . A method of manufacturing an active matrix display device comprising: 
 forming an electrode over a first substrate;    forming an orientation film over the electrode;    forming a sealing material over first substrate;    dripping a liquid crystal material onto the orientation film;    bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and    cutting the bonded first and second substrates.    
   
   
       6 . The method according to  claim 5  wherein said electrode is formed by printing.  
   
   
       7 . The method according to  claim 5  wherein said orientation film is formed by printing.  
   
   
       8 . The method according to  claim 5  wherein the sealing material is cured by heating.  
   
   
       9 . The method according to  claim 5  wherein said sealing material is formed by printing.  
   
   
       10 . A method of manufacturing an active matrix display device comprising: 
 forming an electrode over a first substrate;    forming spacers over the electrode;    forming a sealing material over first substrate;    dripping a liquid crystal material onto the first substrate;    bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and    cutting the bonded first and second substrates.    
   
   
       11 . The method according to  claim 10  wherein said electrode is formed by printing.  
   
   
       12 . The method according to  claim 10  wherein said spacers are formed by spraying.  
   
   
       13 . The method according to  claim 10  wherein the sealing material is cured by heating.  
   
   
       14 . The method according to  claim 10  wherein said sealing material is formed by printing.  
   
   
       15 . The method according to  claim 10  further comprising an orientation film over the first substrate.  
   
   
       16 . A method of manufacturing a display device comprising: 
 forming a color filter over a first substrate;    forming a planarization film over the color filter;    forming an electrode over the planarization film;    forming a sealing material over the first substrate;    dripping a liquid crystal material over the first substrate;    bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and    cutting the bonded first and second substrates.    
   
   
       17 . The method according to  claim 16  wherein said color filter is formed by printing.  
   
   
       18 . The method according to  claim 16  wherein said planarization film is formed by printing.  
   
   
       19 . The method according to  claim 16  wherein said electrode is formed by printing.  
   
   
       20 . The method according to  claim 16  wherein said sealing material is cured by heating.  
   
   
       21 . A method of manufacturing a display device comprising: 
 forming a color filter over a first substrate;    forming a planarization film over the color filter;    forming an electrode over the planarization film;    forming an orientation film over the electrode;    forming a sealing material over the first substrate;    dripping a liquid crystal material over the first substrate;    bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and    cutting the bonded first and second substrates.    
   
   
       22 . The method according to  claim 21  wherein said orientation film is formed by printing.  
   
   
       23 . The method according to  claim 21  wherein said planarization film is formed by printing.  
   
   
       24 . The method according to  claim 21  wherein said electrode is formed by printing.  
   
   
       25 . The method according to  claim 21  wherein said orientation film is formed by printing.  
   
   
       26 . The method according to  claim 21  wherein said sealing material is cured by heating.  
   
   
       27 . A method of manufacturing a display device comprising: 
 forming a color filter over a first substrate;    forming a planarization film over the color filter;    forming an electrode over the planarization film;    forming spacers the first substrate;    forming a sealing material over the first substrate;    dripping a liquid crystal material over the first substrate;    bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and    cutting the bonded first and second substrates.    
   
   
       28 . The method according to  claim 27  wherein said color filter is formed by printing.  
   
   
       29 . The method according to  claim 27  wherein said planarization film is formed by printing.  
   
   
       30 . The method according to  claim 27  wherein said electrode is formed by printing.  
   
   
       31 . The method according to  claim 27  wherein said spacers are formed by spraying.  
   
   
       32 . The method according to  claim 27  wherein said sealing material is cured by heating.  
   
   
       33 . A method of manufacturing an active matrix display device comprising: 
 forming an electrode over a first substrate;    forming an orientation film over the electrode;    providing a driver circuit over the first substrate with an adhesive therebetween, said driver circuit held by a second substrate;    forming a sealing material over the first substrate;    dripping a liquid crystal material onto the orientation film;    bonding a counter substrate to the first substrate with said liquid crystal material interposed therebetween by said sealing material; and    cutting the bonded first and second substrates.    
   
   
       34 . The method according to  claim 33  further comprising a step of removing said second substrate after providing said driver circuit over the first substrate.

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