Electronic parts built-in substrate and method of manufacturing the same

Abstract

An electronic parts built-in substrate of the present invention includes a wiring substrate having connecting pads, a first electronic parts a bump of which is flip-chip connected to the connecting pad, a second electronic parts having a larger area than an area of the first electronic parts a bump of which is flip-chip connected to the connecting pad arranged on an outside of a periphery of the first electronic parts and which is packaged at a predetermined interval over the first electronic parts, and a filling insulating body filled in a clearance between the first electronic parts and the wiring substrate and clearances between the second electronic parts and the first electronic parts and the wiring substrate, wherein the first electronic parts is buried in the filling insulating body.

1 . An electronic parts built-in substrate comprising: 
 a wiring substrate including a wiring pattern having connecting pads;    a first electronic parts a bump of which is flip-chip connected to the connecting pad;    a second electronic parts a bump of which is flip-chip connected to the connecting pad arranged on an outside of a periphery of the first electronic parts and which is packaged at a predetermined interval from an upper surface of the first electronic parts; and    a filling insulating body filled in a clearance between the first electronic parts and the wiring substrate, and clearances between the second electronic parts and the first electronic parts, and the wiring substrate;    wherein the first electronic parts is buried in the filling insulating body.    
     
     
         2 . An electronic parts built-in substrate according to  claim 1 , wherein a height of the bump of the second electronic parts is set higher than a thickness that contains the bump of the first electronic parts.  
     
     
         3 . An electronic parts built-in substrate according to  claim 1 , wherein a thickness of the first electronic parts except the bump is 150 μm or less.  
     
     
         4 . An electronic parts built-in substrate according to  claim 1 , wherein a protection insulating film in which an opening portion to open collectively a packaging area in which the first and second electronic parts are packaged is provided is formed on the wiring substrate, and the filling insulating body is formed to extend from a side surface of the second electronic parts to a side surface of the opening portion of the protection insulating film.  
     
     
         5 . An electronic parts built-in substrate according to  claim 1 , wherein the filling insulating body is formed of a resin containing a filler and having a coefficient of thermal expansion of 20 to 30 ppm/° C.  
     
     
         6 . An electronic parts built-in substrate according to  claim 1 , wherein the electronic parts is a semiconductor chip.  
     
     
         7 . A method of manufacturing an electronic parts built-in substrate comprising the steps of: 
 preparing a wiring substrate including a wiring pattern having connecting pads;    flip-chip connecting a bump of a first electronic parts to the connecting pad;    flip-chip connecting a bump of a second electronic parts to the connecting pad arranged on an outside of a periphery of the first electronic parts to package the second electronic parts at a predetermined interval from an upper surface of the first electronic parts; and    filling a filling insulating body in a clearance between the first electronic parts and the wiring substrate, and clearances between the second electronic parts and the first electronic parts, and the wiring substrate, to bury the first electronic parts in the filling insulating body.    
     
     
         8 . A method of manufacturing an electronic parts built-in substrate according to  claim 7 , further comprising the step of: 
 forming a protection insulating film having an opening portion that exposes collectively a plurality of connecting pads on the wiring substrate, prior to the step of flip-chip connecting the bump of the first electronic parts to the connecting pad; and    wherein the filling insulating body is formed to extend from a side surface of the second electronic parts to a side surface of the opening portion of the protection insulating film in the step of filling the filling insulating body.    
     
     
         9 . A method of manufacturing an electronic parts built-in substrate according to  claim 7 , wherein a height of the bump of the second electronic parts is set higher than a thickness that contains the bump of the first electronic parts.  
     
     
         10 . A method of manufacturing an electronic parts built-in substrate according to  claim 7 , wherein a thickness of the first electronic parts except the bump is 150 μm or less.  
     
     
         11 . A method of manufacturing an electronic parts built-in substrate according to  claim 7 , wherein the filling insulating body is formed of a resin containing a filler and having a coefficient of thermal expansion of 20 to 30 ppm/° C.  
     
     
         12 . A method of manufacturing an electronic parts built-in substrate according to  claim 7 , wherein the electronic parts is a semiconductor chip.