Two phase cooling system method for burn-in testing

Abstract

A cooling system for a semiconductor device burn-in test station includes one or more evaporators arranged in close thermal proximity to a semiconductor device. Each evaporator includes a chambered enclosure having a capillary wick disposed on the walls of the enclosure that define the chamber. A condenser is arranged in fluid communication with each chamber, and a pump is arranged in flow communication between each evaporator and the condenser so as to circulate a coolant liquid between a pool of the coolant liquid that is maintained within the chambered enclosure and the condenser.

1 . A cooling system for a semiconductor device burn-in test station comprising: 
 at least one evaporator including a chambered enclosure having a capillary wick disposed on the walls of said enclosure that define said chamber;    a condenser arranged in fluid communication with each said chamber; and    a pump arranged in flow communication between said at least one evaporator and said condenser so as to circulate a coolant liquid between a pool of said coolant liquid maintained within said chambered enclosure and said condenser.    
   
   
       2 . A cooling system according to  claim 1  wherein said chambered enclosure includes an inlet opening arranged in flow communication with said pump and an outlet opening arranged in flow communication with said condenser.  
   
   
       3 . A cooling system according to  claim 1  wherein said chambered enclosure includes a top wall that forms a portion of a device support platform arranged in a probe-station for supporting and thermally engaging a semiconductor device to be burn-in tested.  
   
   
       4 . A cooling system according to  claim 1  wherein said at least one evaporator includes an externally applied thermally conductive coating.  
   
   
       5 . A cooling system according to  claim 1  wherein said capillary wick comprises a porous internal surface coating deposited on the interior surfaces of said chambered enclosure.  
   
   
       6 . A cooling system according to  claim 1  wherein said capillary wick comprises a structure selected from the group consisting of grooves, screen, cables, adjacent layers of screening, felt, and sintered powders.  
   
   
       7 . A cooling system according to  claim 1  wherein said capillary wick draws coolant fluid to a top wall of said chambered enclosure from said pool thereby continuously saturating a portion of said capillary wick adjacent said top wall.  
   
   
       8 . A cooling system according to  claim 2  comprising a liquid level control valve located within said inlet opening, and arranged in flow control communication with said pump so as to maintain a predetermined level of said coolant pool within said chambered enclosure.  
   
   
       9 . A cooling system according to  claim 8  wherein said pump is arranged in fluid communication between said at least one evaporator and said condenser so as to provide a continuous flow of said coolant liquid to said at least one evaporator from said condenser.  
   
   
       10 . A cooling system according to  claim 9  wherein when said liquid level control valve is closed, said pool is at an optimum level for continuously saturating said capillary wick.  
   
   
       11 . A cooling system according to  claim 9  wherein said liquid level control valve allows excess coolant fluid provided by said pump to be redirected back to said condenser.  
   
   
       12 . A cooling system for a semiconductor device burn-in test station comprising: 
 at least two evaporators each including a chambered enclosure having a capillary wick disposed on the walls of said enclosure that define said chamber;    a source of coolant arranged in fluid communication with each said chamber; and    a pump arranged in flow communication with said source of coolant and said at least two evaporators so as to circulate a coolant liquid between a pool of said coolant liquid maintained within said chambered enclosure and said source of coolant.    
   
   
       13 . A cooling system comprising: 
 at least one evaporator having walls that define a chamber with a capillary wick disposed on the surfaces of said walls that bound said chamber;    a pool of liquid coolant disposed within said chamber;    a condenser arranged in fluid communication with each said chamber; and    a pump arranged in flow communication between said at least one evaporator and said condenser so as to circulate said coolant liquid between said chamber and said condenser so as to maintain said pool within said chamber.    
   
   
       14 . A cooling system according to  claim 13  wherein said chamber includes an inlet opening arranged in flow communication with said pump and an outlet opening arranged in flow communication with said condenser.  
   
   
       15 . A cooling system according to  claim 14  comprising a liquid level control valve located within said inlet opening, and arranged in flow control communication with said pump so as to maintain a predetermined level of said pool of coolant liquid within said chamber.  
   
   
       16 . A cooling system according to  claim 15  wherein said pump is arranged in fluid communication between said at least one evaporator and said condenser so as to provide a continuous flow of said coolant liquid to said at least one evaporator from said condenser.  
   
   
       17 . A cooling system according to  claim 16  wherein when said liquid level control valve is closed, said pool is at an optimum level for continuously saturating said capillary wick.  
   
   
       18 . A cooling system according to  claim 13  wherein said chamber includes a top wall that forms a portion of a device support platform arranged in a probe-station for supporting and thermally engaging a semiconductor device to be burn-in tested.  
   
   
       19 . A cooling system according to  claim 13  wherein said at least one evaporator includes an externally applied thermally conductive coating.  
   
   
       20 . A cooling system according to  claim 13  wherein said capillary wick comprises a porous internal surface coating deposited on the interior surfaces of said chambered enclosure.  
   
   
       21 . A cooling system according to  claim 13  wherein said capillary wick comprises a structure selected from the group consisting of grooves, screen, cables, adjacent layers of screening, felt, and sintered powders.  
   
   
       22 . A cooling system according to  claim 13  Wherein said capillary wick draws coolant fluid to a top wall of said chamber from said pool thereby continuously saturating a portion of said capillary wick adjacent said top wall.  
   
   
       23 . A cooling system according to  claim 15  wherein said liquid level control valve allows excess coolant fluid provided by said pump to be redirected back to said condenser.  
   
   
       24 . A cooling system for a semiconductor device burn-in test station comprising: 
 at least two evaporators including a chambered enclosure having a capillary wick disposed on the walls of said enclosure that define said chamber;    a condenser arranged in fluid communication with each said chamber; and    a pump arranged in flow communication between said at least two evaporators and said condenser so as to circulate a coolant liquid between a pool of said coolant liquid maintained within said chambered enclosure and said condenser so that said coolant from said pool continuously wets said capillary wick.    
   
   
       25 . A semiconductor device burn-in test station comprising: 
 at least one evaporator having a wall arranged so as to support at least one semiconductor device and including a chambered enclosure having a capillary wick disposed on the walls of said enclosure that define said chamber;    a condenser arranged in fluid communication with each said chamber; and    a pump arranged in flow communication between said at least one evaporator and said condenser so as to circulate a coolant liquid between a pool of said coolant liquid maintained within said chambered enclosure and said condenser.    
   
   
       26 . A method for cooling a heat source comprising the steps of: 
 (A) pumping a coolant liquid into a chamber of an evaporator so as to form a pool;    (B) drawing continuously a portion of said coolant liquid from said pool through a capillary wick to a position located adjacent to said heat source so that said coolant fluid is vaporized; and    (C) condensing said vaporized coolant fluid and arranging said condensed coolant fluid in flow communication with said pump.