Method and device for encapsulating electronic components while exerting fluid pressure

Abstract

The invention relates to a method for encapsulating electronic components, in particular semiconductors, by receiving a component for encapsulating between two mould halves displaceable relative to each other and feeding a liquid encapsulating material under overpressure by means of a transfer mechanism to at least one mould cavity arranged for this purpose, characterized in that during feeding of liquid encapsulating material to the mould cavity the part of the mould cavity not yet filled with encapsulating material is filled with a gas under overpressure. The invention also relates to a device for encapsulating electronic components.

1 - 25 . (canceled)  
   
   
       26 . A method for encapsulating electronic components, in particular semiconductor, by receiving a component for encapsulating fixed on a carrier between two mould halves displaceable relative to each other and feeding a liquid encapsulating material under overpressure by means of a transfer mechanism to at least one mould cavity arranged for this purpose, whereby during feeding of liquid encapsulating material to the mould cavity the part of the mould cavity not yet filled with encapsulating material is filled with a fluid under overpressure, wherein a foil layer is placed between the mould cavity and the component for encapsulating.  
   
   
       27 . The method as claimed in  claim 26 , wherein the fluid under overpressure is situated between the cavity and the foil layer.  
   
   
       28 . The method as claimed in  claim 26 , wherein the fluid pressure in the mould cavity is maintained until the cavity is completely filled with encapsulating material.  
   
   
       29 . The method as claimed in  claim 26 , wherein the fluid pressure amounts to at least 1.5×10 5  Pa, preferably at least 5×10 5  Pa.  
   
   
       30 . The method as claimed in  claim 26 , wherein the fluid pressure is applied by means of an inert gas.  
   
   
       31 . The method as claimed in  claim 26 , wherein the fluid pressure is applied by at least one venting opening for excess gas connecting onto the mould cavity.  
   
   
       32 . The method as claimed in  claim 26 , wherein an underpressure is also created locally in the mould cavity on a side remote from the component for encapsulating where the overpressure is created.  
   
   
       33 . A device for encapsulating electronic components, in particular semiconductors, comprising: 
 two mould halves displaceable relative to each other for receiving a component for encapsulating, which mould halves are provided with at least one mould cavity, and    a transfer mechanism for feeding a liquid encapsulating material under overpressure to the mould cavity,    wherein a fluid feed connects onto the mould cavity for receiving liquid encapsulating material,    wherein the fluid feed also connects onto means for generating an underpressure.    
   
   
       34 . The device as claimed in  claim 33 , wherein the cavity is provided with a receiving space for a carrier and recesses for the purpose of forming encapsulating parts located on either side of the receiving space for the carrier.  
   
   
       35 . The device as claimed in  claim 33 , wherein the mould cavity is provided with a medium-tight sealing edge.  
   
   
       36 . A method for encapsulating electronic components, in particular semiconductors, by receiving a component for encapsulating fixed on a carrier between two mould halves displaceable relative to each other and feeding a liquid encapsulating material under overpressure by means of a transfer mechanism to at least one mould cavity arranged for this purpose, 
 wherein during feeding of liquid encapsulating material to the mould cavity a fluid pressure is exerted on the carrier on the side of the carrier remote from the cavity.    
   
   
       37 . The method as claimed in  claim 36 , wherein the fluid pressure is adjusted in relation to the pressure on the liquid encapsulating material.  
   
   
       38 . A device for encapsulating electronic components, in particular semiconductors, comprising: 
 two mould halves displaceable relative to each other for receiving a component for encapsulating, which mould halves are provided with at least one mould cavity, and    a transfer mechanism for feeding a liquid encapsulating material under overpressure to the mould cavity by means of a feed for encapsulating material, wherein at a distance from the feed for encapsulating material at least one fluid feed connects onto the displaceable mould halves for positioning the component for encapsulating by means of fluid pressure.    
   
   
       39 . The device as claimed in  claim 38 , wherein the mould cavity is arranged at least substantially in one of the mould halves, and the fluid feed connects onto the mould half connecting to the mould half in which the cavity is arranged.  
   
   
       40 . The device as claimed in  claim 38 , wherein the mould cavity is provided with a receiving space for a carrier and recesses for the purpose of forming encapsulating parts located on either side of the receiving space for the carrier.