Semiconductor plating system workpiece support having workpiece-engaging electrodes with distal contact part and dielectric cover

Abstract

A semiconductor workpiece holder used in electroplating systems for plating metal layers onto a semiconductor workpieces, and is of particular advantage in connection with plating copper onto semiconductor materials. The workpiece holder includes electrode assemblies which have a contact part which connects to a distal end of an electrode shaft and bears against the workpiece and conducts current therebetween. The contact part is preferably made from a corrosion resistant material, such as platinum. The electrode assembly also preferably includes a dielectric layer which covers the distal end of the electrode shaft and seals against the contact part to prevent plating liquid from corroding the joint between these parts.

1 - 30 . (Cancelled).  
     
     
         31 . An apparatus for processing microelectronic workpieces, comprising: 
 a vessel having an inner portion and an outer portion positioned outwardly from the inner portion, the inner portion being configured to be coupled to a source of processing liquid;    a wall between the inner portion and the outer portion, the wall being positioned to receive processing liquid proceeding upwardly through the inner portion;    an electrode support positioned in the inner portion of the vessel;    an electrode at the electrode support;    a flow control structure positioned above the electrode support, the flow control structure including a liquid pervious portion and a liquid impervious portion disposed annularly outwardly from the liquid pervious portion; and    a head assembly having a workpiece holder configured to position a semiconductor workpiece at a processing site, wherein the head assembly includes a plurality of electrical contacts arranged to contact a peripheral portion of the workpiece.    
     
     
         32 . The apparatus of  claim 31  wherein the electrode is a first electrode, and wherein the workpiece holder further comprises a workpiece support and a plurality of electrode fingers projecting from the workpiece support.  
     
     
         33 . The apparatus of  claim 31  wherein the flow control structure includes a diffuser plate.  
     
     
         34 . The apparatus of  claim 31  wherein the flow control structure includes a diffuser plate having perforations at the liquid pervious portion and no perforations at the liquid impervious portion.  
     
     
         35 . The apparatus of  claim 31  wherein the inner portion of the vessel has an inlet configured to be coupled to a source of processing liquid.  
     
     
         36 . The apparatus of  claim 31  wherein the flow control structure comprises a diffuser plate and wherein the electrode support comprises an anode shield.  
     
     
         37 . The apparatus of  claim 31  wherein the liquid pervious portion of the flow control structure is aligned with a central portion of the workpiece holder during processing, and wherein the liquid impervious portion of the flow control structure is positioned to align with a peripheral portion of the workpiece holder.  
     
     
         38 . The apparatus of  claim 31  wherein the wall between the inner portion and the outer portion of the vessel defines a weir over which processing fluid flows from the inner portion to the outer portion.  
     
     
         39 . An apparatus for processing microelectronic workpieces, comprising: 
 a plating vessel having an inner cup and an outer portion positioned outwardly from the inner cup, the inner cup having a central axis and a cup side with an upper lip defining a weir at least proximate to a processing zone, and wherein the cup side is positioned inwardly of the outer portion to define an overflow zone between the outer portion and the cup side;    an electrode support in the cup, the electrode support being configured to support an electrode under the processing zone;    a first electrode at the electrode support;    a flow control structure positioned between the electrode support and the processing zone, the flow control structure including a liquid pervious portion aligned with a first portion of the processing site and a liquid impervious portion radially outward from the liquid pervious portion and aligned with a second portion of the processing site; and    a processing head having workpiece holder configured to hold a semiconductor workpiece at the processing zone, the workpiece holder including a rotor configured to rotate about an axis aligned with the central axis of the cup and a plurality of electrical contacts arranged to contact a peripheral portion of the workpiece.    
     
     
         40 . The apparatus of  claim 39  wherein the flow control structure comprises a diffuser plate.  
     
     
         41 . The apparatus of  claim 39  wherein the flow control, structure comprises a diffuser plate having perforations at the liquid pervious portion and no perforations at the liquid impervious portion.  
     
     
         42 . The apparatus of  claim 39  wherein the inner cup has an inlet configured to be coupled to a source of processing liquid and to project processing fluid radially outward relative to the first electrode.  
     
     
         43 . The apparatus of  claim 42  wherein the flow control structure includes a diffuser plate.  
     
     
         44 . The apparatus of  claim 39  wherein the liquid pervious portion of the flow control structure is aligned with a central portion of a microelectronic workpiece when the microelectronic workpiece is carried at the processing zone, and wherein the liquid impervious portion of the flow control structure is aligned with a peripheral portion of the microelectronic workpiece outward from the central portion of the microelectronic workpiece.  
     
     
         45 . The apparatus of  claim 39  wherein the cup side has an inward facing surface and an outward facing surface, and wherein the liquid impervious portion of the flow control structure is positioned at least proximate to the inward facing surface.  
     
     
         46 . The apparatus of  claim 39  wherein cup side has an inward facing surface and an outward facing surface, and wherein the liquid impervious portion of the flow control structure abuts against the inward facing surface.  
     
     
         47 . An apparatus for processing microelectronic workpieces, comprising: 
 a vessel having an inner portion and an outer portion outward from the inner portion, the vessel having a flow path along which the processing liquid flows from the inner portion to the outer portion;    a wall between the inner portion and the outer portion, the wall being positioned to contain processing liquid proceeding upwardly through the inner portion to the outer portion;    a head configured to carry a microelectronic workpiece, the head including a workpiece support having a plurality of electrical contacts arranged to engage a peripheral portion of a workpiece;    an electrode support positioned in the inner portion of the vessel and an electrode at the electrode support;    a flow control structure positioned along the flow path downstream of the electrode support, the flow control structure including a liquid pervious portion and a liquid impervious portion annularly outwardly from the liquid pervious portion; and    a source of processing solution coupled in liquid communication with the inner portion of the vessel.    
     
     
         48 . The apparatus of  claim 47  wherein the wall between the inner portion and the outer portion of the vessel has an inward facing surface and an outward facing surface, and wherein the liquid impervious portion of the flow control structure abuts against the inward facing surface of the wall.  
     
     
         49 . A method for processing a microelectronic workpiece, comprising: 
 positioning a microelectronic workpiece in a vessel having an inner portion and an outer portion outward from the inner portion such that the workpiece is at least substantially horizontal in contact with a processing solution;    rotating the microelectronic workpiece such that the workpiece is at least substantially horizontal in contact with a processing liquid;    applying an electrical current to a first electrode in the inner portion of the vessel;    flowing the processing liquid past the first electrode in the inner portion of the vessel and through a liquid pervious portion of a flow control device positioned downstream of the first electrode;    at least restricting the flow of processing liquid through a liquid impervious portion of the flow control device positioned radially outward from the liquid pervious portion; and    flowing the processing liquid upwardly through the inner portion of the vessel, over a wall to the outer portion of the vessel.    
     
     
         50 . The method of  claim 49  wherein the method further comprises: 
 pressing a plurality of electrode fingers against a peripheral portion of the surface of the microelectronic workpiece; and    applying a current to the electrode fingers to electrolytically deposit a conductive material from the processing liquid onto the surface of the microelectronic workpiece.    
     
     
         51 . The method of  claim 49  wherein flowing the processing liquid through a liquid pervious portion of a flow control device includes flowing the processing liquid through perforations of a diffuser plate.  
     
     
         52 . The method of  claim 49  wherein at least restricting the flow of processing liquid through a liquid impervious portion of the flow control device includes preventing the flow of the processing liquid through a non-perforated portion of a diffuser plate.  
     
     
         53 . The method of  claim 49 , further comprising: 
 juxtaposing a central portion of the microelectronic workpiece above the liquid pervious portion of the flow control device; and    juxtaposing a peripheral portion of the microelectronic workpiece above the liquid impervious portion of the flow control device.