Electrodeposition device and electrodeposition system for coating structures which have already been made conductive

Abstract

Electrodeposition device for electrodepositing an electrically conductive layer on a substrate having an electrolyte bath in which an anode device and at least one contact-making unit are arranged, each contact-making unit having a plurality of electrically conductive regions of which at least one is connected cathodically and at least one is connected anodically.

1 . An electrodeposition device for electrodepositing an electrically conductive layer on a substrate, comprising: 
 an electrolyte bath;    an anode device arranged in the electrolyte bath;    at least one contact-making unit arranged near the anode device in the electrolyte bath and having a plurality of electrically conductive regions,    wherein at least one of the electrically conductive regions is connected cathodically and at least one of the electrically-conductive regions is connected anodically.    
     
     
         2 . The electrodeposition device as claimed in  claim 1 , wherein the plurality of the electrically conductive regions are simultaneously connected cathodically or anodically.  
     
     
         3 . The electrodeposition device as claimed in  claim 1 , wherein each electrically conductive region of the at least one contact-making unit is connected as cathode or anode.  
     
     
         4 . The electrodeposition device as claimed in  claim 1 , wherein the electrically conductive region(s) of the at least one contact-making unit which is/are connected as anode is/are arranged in a vicinity of the electrically conductive region(s) connected as cathode and form(s) auxiliary anode(s).  
     
     
         5 . The electrodeposition device as claimed in  claim 1 , wherein the at least one contact-making unit is of cylindrical design.  
     
     
         6 . The electrodeposition device as claimed in  claim 5 , wherein the electrically conductive regions extend on the lateral surface of the cylindrical contact-making unit from one base surface toward the other base surface.  
     
     
         7 . The electrodeposition device as claimed in  claim 5 , wherein the electrically conductive regions are spaced apart from one another and run in a shape of waves, zigzags, or obliquely.  
     
     
         8 . The electrodeposition device as claimed in  claim 7 , wherein sections of the electrically conductive regions that are connected cathodically are shielded from the anode device.  
     
     
         9 . The electrodeposition device as claimed in  claim 1 , further comprising a fixture which presses the substrate onto the at least one contact-making unit.  
     
     
         10 . The electrodeposition device as claimed in  claim 9 , wherein the fixture is a further contact-making unit or a nonconductive roller.  
     
     
         11 . The electrodeposition device as claimed in  claim 1 , wherein the contact-making unit has slides which contact substrate regions that are to undergo electrodeposition.  
     
     
         12 . The electrodeposition device as claimed in  claim 1 , wherein the contact-making unit has pins which move with respect to a base plate and which are actuated independently, with each of the pins being connected cathodically or anodically depending on its position.  
     
     
         13 . The electrodeposition device as claimed in  claim 12 , wherein the base plate is of two-layer structure, the first layer being connected anodically and the second layer being connected cathodically.  
     
     
         14 . An electrodeposition system comprising: 
 at least one electrodeposition device as claimed in  claim 1;     a feed device which feeds a substrate to undergo electrodeposition to the at least one electrodeposition device; and    a receiving device which receives the substrate after it has been electrodeposed.    
     
     
         15 . The electrodeposition system as claimed in  claim 14 , wherein the substrate is fed to the at least one electrodeposition device in continuous form.  
     
     
         16 . The electrodeposition system as claimed in  claim 14 , wherein the electrodeposition device is arranged in a collection vessel, into which an electrolyte which is displaced in the electrolyte bath by filtered electrolyte can overflow, so that a self-regenerating electrolyte is present in the electrolyte bath.  
     
     
         17 . The electrodeposition system as claimed in  claim 14 , wherein at least two electrodeposition devices, which can be operated with the same electrolyte or a different electrolyte, are connected in series.