System and method for electrolytic plating

Abstract

An electrolytic plating system for plating a via in a printed circuit board. The electrolytic plating system includes an electrolytic plating bath, a support rod supporting the printed circuit board in the bath, and means for alternately generating a laminar flow of electrolyte on each side of said printed circuit board.

1 . An electrolytic plating system for plating a via in a printed circuit board, comprising: 
 an electrolytic plating bath;    means for positioning said printed circuit board in said bath; and    means for alternately generating a laminar flow of electrolyte on each side of said printed circuit board.    
   
   
       2 . The electrolytic plating system of  claim 1 , wherein said means for alternately generating a laminar flow of electrolyte further comprises a floating shield with a venturi-shaped partition and an aligned partition below said printed circuit board and a plurality of eductors below said floating shield.  
   
   
       3 . The electrolytic plating system of  claim 1 , wherein said means for alternately generating a laminar flow of electrolyte further comprises a transport mechanism that moves the floating shield and its partitions from side to side relative to said eductors.  
   
   
       4 . The electrolytic plating system of  claim 1 , wherein said means for positioning said printed circuit board in said bath further comprises a vibrator and a system to prevent vibration energy being absorbed by fixed portions of said electrlytic plating system.  
   
   
       5 . An electrolytic plating system for plating a via in a printed circuit board, comprising: 
 an electrolyte bath;    a support rod above said bath;    a flexible electrical current supply connection attached to said support rod;    at least one printed circuit board clamp attached to said support rod;    a floating shield with v-saddles in contact with said printed circuit board, said floating shield further comprising a venturi-shaped partition;    at least one eductor in a lower portion of said bath below said floating shield for producing a laminar flow of electrolyte across said printed circuit board; and    means for alternating said laminar flow from one side of said printed circuit board to an other side of said printed circuit board.    
   
   
       6 . The electrolytic plating system of  claim 5 , further comprising: 
 an upper rod that supports said support rod;    a vibrator on said upper rod; and    a spring system to mount said upper rod to a rigid structure.    
   
   
       7 . The electrolytic plating system of  claim 5 , wherein said floating shield further comprises a partition directly below said printed circuit boards to direct flow of electrolyte to either side of said printed circuit boards.  
   
   
       8 . The electrolytic plating system of  claim 7 , wherein said means to alternate said laminar flow comprises a transport mechanism that moves the shield and its partitions from side to side relative to said eductors.  
   
   
       9 . An electrolytic plating system for printed circuit boards comprising: 
 a plating line supporting said printed circuit boards with a lower support rod;    an upper rod that supports said support rod;    a vibrator on said upper rod; and    a spring system to mount said upper rod to a rigid structure.    
   
   
       10 . An electrolytic plating method for plating a via in a printed circuit board, comprising: 
 positioning said printed circuit board in an electrolytic bath; and    alternately generating a laminar flow of electrolyte on each side of said printed circuit board.    
   
   
       11 . The electrolytic plating method of  claim 10 , wherein the step of alternately generating a laminar flow of electrolyte further comprises: 
 positioning a floating shield with a venturi-shaped partition and an aligned partition below said printed circuit board; and    operating a plurality of eductors below said floating shield.    
   
   
       12 . The electrolytic plating method of  claim 10 , wherein the step of alternately generating a laminar flow of electrolyte further comprises moving a transport mechanism so as to move the floating shield and its partitions from side to side relative to said eductors.  
   
   
       13 . The electrolytic plating method of  claim 12 , further comprising the step of supplying vibration energy to said printed circuit board in said bath by mounting a vibrator on said transport mechanism using a system to prevent vibration energy being absorbed by fixed supports.  
   
   
       14 . An electrolytic plating method for plating a via in a printed circuit board, comprising: 
 providing an electrolyte bath;    positioning a support rod above said bath;    providing electrical current to said support rod;    clamping at least one printed circuit board to said support rod;    transporting said printed circuit board in a floating shield with v-saddles in contact with said printed circuit board, said floating shield further positioning a verituri-shaped partition below said printed circuit board;    producing a laminar flow of electrolyte across said printed circuit board with at least one eductor positioned in a lower portion of said bath below said floating shield; and    alternating said laminar flow from one side of said printed circuit board to another side of said printed circuit board.    
   
   
       15 . The electrolytic plating method of  claim 14 , further comprising: 
 supporting said support rod with an upper rod;    supplying vibration energy to said upper rod; and    isolating said vibration energy from a fixed structure mounted to the upper rod.    
   
   
       16 . The electrolytic plating method of  claim 14 , further comprising providing a partition directly below said printed circuit board to direct flow of electrolyte to either side of said printed circuit board.  
   
   
       17 . The electrolytic plating method of  claim 16 , wherein moving a transport mechanism moves the shield and its partitions from side to side relative to said eductors to alternate said laminar flow.  
   
   
       18 . An electrolytic plating method for a printed circuit board comprising: 
 supporting said printed circuit board with a support rod of a plating line;    supporting said support rod with an upper rod;    supplying vibration energy to said upper rod; and    mounting said upper rod to a rigid structure with a system for preventing vibrational energy from being absorbed by the rigid structure.