Dynamic integrated circuit clusters, modules including same and methods of fabricating

Abstract

A semiconductor wafer or other bulk semiconductor substrate having a plurality of dice thereon is manufactured using conventional processing techniques. The wafer is subjected to testing to identify functional and nonfunctional dice. The locations of the functional dice are analyzed to determine the location of immediately adjacent or closely proximate functional dice. A group of functional dice is identified and an interconnection circuit is formed therebetween. The functional die group, once interconnected, is then segmented from the wafer while maintaining the unitary integrity of the functional die group as well as the associated interconnections between dice. Modules including one or more functional die groups and methods of fabricating functional die groups and modules are also disclosed.

1 . A method of fabricating a semiconductor device, the method comprising: forming a plurality of dice on a common semiconductor substrate, each of the plurality of dice including at least one bond pad; 
 identifying at least a first and second functional die from among at least a portion of the plurality of dice;    forming an adjacent die interconnection circuit between the at least one bond pad of the at least a first functional die and the at least one bond pad of the at least a second functional die; and    unitarily segmenting the at least a first and second functional die from the common semiconductor substrate.    
   
   
       2 . The method, as recited in  claim 1 , wherein forming an adjacent die interconnection comprises forming at least one conductor segment having a first end electrically coupled to the at least one bond pad of the at least a first functional die and a second end electrically coupled to the at least one bond pad of the at least a second functional die.  
   
   
       3 . The method, as recited in  claim 2 , wherein forming an adjacent die interconnection further comprises forming a conductive bump electrically coupled to the at least one conductor segment configured for operatively coupling the at least one conductor segment of the semiconductor device with a substrate contact of a higher-level assembly.  
   
   
       4 . The method, as recited in  claim 1 , wherein identifying comprises identifying the at least a first and second functional die as immediately adjacent ones from among the at least a portion of the plurality of dice on the common semiconductor substrate.  
   
   
       5 . The method, as recited in  claim 1 , wherein identifying comprises identifying the at least a first and second functional die as separated by at least one nonfunctional die from among the at least a portion of the plurality of dice on the common semiconductor substrate.  
   
   
       6 . A method of functionally grouping a plurality of dice, comprising: 
 fabricating a plurality of dice on a common semiconductor substrate, at least a portion of the plurality of dice each including at least one bond pad;    identifying a plurality of functional and nonfunctional dice from among the at least a portion of the plurality of dice; and    electrically coupling the at least one bond pad of a first one of the plurality of functional dice with the at least one bond pad of at least a second one of the plurality of functional dice for forming a functional group of dice on the common semiconductor substrate.    
   
   
       7 . The method, as recited in  claim 6 , further comprising testing the functional group as a single assembly.  
   
   
       8 . The method, as recited in  claim 6 , further comprising unitarily segmenting the functional group from the common semiconductor substrate.