Substrate assemblys, methods of manufacturing the substrate assembly, display devices having the substrate assembly, and methods of manufacturing display device having the substrate assembly

Abstract

A substrate assembly includes a first substrate, a second substrate and a sealing member. The first substrate has a first hardness of a first area. The second substrate has a second hardness lower than the first hardness of the first substrate. The second substrate has a second area smaller than the first area. The second substrate is disposed on the first substrate. The sealing member seals an edge portion of a boundary defined by the first and second substrates so that chemical solutions or chemical gases may not permeate into the boundary, thereby preventing failures of pixels while the pixels are formed on the second substrate.

1 . A substrate assembly comprising: 
 a first substrate having a first hardness;    a second substrate having a second hardness smaller than the first hardness, the second substrate being disposed on the first substrate; and    a sealing member configured to seal a first edge portion defined by the first substrate and the second substrate.    
   
   
       2 . The substrate assembly of the  claim 1 , wherein the first substrate includes a glass material or a metal material.  
   
   
       3 . The substrate assembly of the  claim 1 , wherein the sealing member is comprised of a photosensitive material.  
   
   
       4 . The substrate assembly of the  claim 3 , wherein the photosensitive material is heat-treated at a temperature between about 100° C. and about 220° C., and wherein the photosensitive material is comprised of a negative type photoresist.  
   
   
       5 . The substrate assembly of the  claim 3 , wherein the sealing member has a thickness in a range from about 2 micrometers (μm) to about 6 micrometers (μm).  
   
   
       6 . The substrate assembly of the  claim 1 , further comprising an adhesive member interposed between the first substrate and the second substrate.  
   
   
       7 . The substrate assembly of the  claim 1 , wherein the first substrate has a first area larger than a second area of the second substrate.  
   
   
       8 . The substrate assembly of the  claim 1 , wherein the sealing member encloses a second edge of the second substrate and partially encloses a top face of the second substrate.  
   
   
       9 . The substrate assembly of the  claim 1 , wherein the sealing member covers the first substrate and the second substrate.  
   
   
       10 . A method of manufacturing a substrate assembly, comprising: 
 forming a second substrate having a second hardness;    forming a first substrate having a first hardness on the second substrate, the first hardness being smaller than the second hardness; and    forming a sealing member to seal a first edge portion defined by the first substrate and the second substrate.    
   
   
       11 . The method of  claim 10 , further comprising forming an adhesive member between the first substrate and the second substrate.  
   
   
       12 . The method of  claim 10 , wherein said forming a sealing member comprises coating a photosensitive material on the first and second substrates to form a photosensitive layer, patterning the photosensitive layer to form the sealing member, and heat-treating the sealing member.  
   
   
       13 . The method of  claim 12 , wherein the sealing member covers a second edge portion of the second substrate.  
   
   
       14 . The method of  claim 12 , wherein the sealing member is heat-treated at a temperature between about 100° C. and about 220° C.  
   
   
       15 . A substrate assembly comprising: 
 a first substrate having a first hardness;    a second substrate facing the first substrate, the second substrate having a second hardness lower than the first hardness of the first substrate;    an adhesive member to couple the first substrate to the second substrate; and    a sealing member configured to seal an edge portion defined by the first substrate and the second substrate.    
   
   
       16 . The substrate assembly of the  claim 15 , wherein the first substrate includes a glass material, and the second substrate includes a flexible material.  
   
   
       17 . A display device for displaying an image, the display device comprising: 
 a first substrate including a first flexible material;    a second substrate including a second flexible material, the second substrate facing the first substrate;    a first electrode disposed on the first substrate;    a second electrode disposed on the second substrate; and    a liquid crystal layer interposed between the first electrode and the second electrode.    
   
   
       18 . A method of manufacturing a display device comprising: 
 forming a first display substrate by disposing a second substrate having a second hardness on a first substrate having a first hardness larger than the second hardness, by sealing an edge portion defined between the first substrate and the second substrate, and by forming a first pixel on the second substrate so as to display an image;    forming a second display substrate by disposing a fourth substrate having a fourth hardness on a third substrate having a third hardness larger than the fourth hardness of the fourth substrate, sealing an edge portion defined by the third substrate and the fourth substrate, and forming a second pixel on the fourth substrate to display the image;    assembling the first display substrate and the second display substrate wherein the first pixel is opposed to the second pixel; and    separating the first substrate from the second substrate, and separating the third substrate from the fourth substrate.    
   
   
       19 . The method of the  claim 18 , wherein the second substrate and the fourth substrate include polarizing plates.  
   
   
       20 . The method of the  claim 18 , further comprising forming a liquid crystal layer between the first display substrate and the second display substrate.