Plating tool, plating method, electroplating apparatus, plated product, and method for producing plated product

Abstract

A plating tool for plating an object, includes a rotatable supporting member which includes an opening formed so as to pass through the rotatable supporting member, a line member which is provided so as to cross the opening, and a guide portion which is provided on the rotatable supporting member so as to promote a flow of a plating liquid toward the opening. A space defined by an inner wall face of the opening and the line member is a cell in which the object to be plated is placed.

1 . A plating tool for plating an object, comprising: 
 a rotatable supporting member, which includes an opening formed so as to pass through the rotatable supporting member;    a line member, which is provided so as to cross the opening; and    a guide portion, which is provided on the rotatable supporting member, and promotes a flow of a plating liquid toward the opening,    wherein a space defined by an inner wall face of the opening and the line member is a cell in which the object to be plated is placed.    
     
     
         2 . The plating tool as set forth in  claim 1 , wherein the guide portion is provided as a step portion formed on a surround of the opening, the step portion being lower than a surface of the supporting member.  
     
     
         3 . The plating tool as set forth in  claim 1 , wherein the guide portion is a cone-shaped portion which expands from an opening face of the opening toward a surface of the supporting member.  
     
     
         4 . The plating tool as set forth in  claim 1 , wherein the line member is provided as an conductive member which applies a current to the object.  
     
     
         5 . The plating tool as set forth in  claim 1 , wherein the object is moved in the cell in accordance with a rotation of the supporting member; 
 wherein the cell is formed so as to have at least two stable positions which allow to stably support the object for a predetermined period of time; and    wherein while the object moves from a first stable position to a second stable position of the at least two stable positions, the object is brought into contact with at least one contact area of the inner wall face of the cell.    
     
     
         6 . The plating tool as set forth in  claim 8 , wherein the cell has a shape in which a line connecting the first stable position with the second stable position deviates from the vertical direction in any displacement condition of a rotating position of the supporting member.  
     
     
         7 . The plating tool as set forth in  claim 1 , wherein the supporting member has a plurality of cells formed therein.  
     
     
         8 . The plating tool as set forth in  claim 10 , wherein each of the cells has the guide portion.  
     
     
         9 . The plating tool as set forth in  claim 1 , wherein the supporting member is constituted by a two plate members which are superposed each other, each of the plate members having a through hole.  
     
     
         10 . The plating tool as set forth in  claim 1 , wherein the supporting member has a long rectangular shape; and 
 wherein a major side of the supporting member extends in a rotating radial direction thereof.    
     
     
         11 . The plating tool as set forth in  claim 1 , further comprising a plurality of supporting member which are radially disposed around a center of the rotation axis thereof.  
     
     
         12 . A plating tool for plating an object, comprising: 
 a rotatable supporting member, which includes an opening formed so as to pass through the rotatable supporting member;    a line member, which is provided so as to cross the opening; and    a shielding portion, which is provided on the rotatable supporting member, and narrows an open face of the opening,    wherein a space defined by an inner wall face of the opening and the line member is a cell in which the object to be plated is placed.    
     
     
         13 . The plating tool as set forth in  claim 12 , wherein a guide portion is provided on the rotatable supporting member so as to promote a flow of a plating liquid toward the opening.  
     
     
         14 . The plating tool as set forth in  claim 13 , wherein the guide portion is provided as a step portion formed on a surround of the opening, the step portion being lower than a surface of the supporting member.  
     
     
         15 . The plating tool as set forth in  claim 13 , wherein the guide portion is a cone-shaped portion which expands from an opening face of the opening toward a surface of the supporting member.  
     
     
         16 . The plating tool as set forth in  claim 12 , wherein the line member is provided as an conductive member which applies a current to the object.  
     
     
         17 . The plating tool as set forth in  claim 12 , wherein the object is moved in the cell in accordance with a rotation of the supporting member; 
 wherein the cell is formed so as to have at least two stable positions which allow to stably support the object for a predetermined period of time; and    wherein while the object moves from a first stable position to a second stable position of the at least two stable positions, the object is brought into contact with at least one contact area of the inner wall face of the cell.    
     
     
         18 . The plating tool as set forth in  claim 17 , wherein the cell has a shape in which a line connecting the first stable position with the second stable position deviates from the vertical direction in any displacement condition of a rotating position of the supporting member.  
     
     
         19 . The plating tool as set forth in  claim 12 , wherein the supporting member has a plurality of cells formed therein.  
     
     
         20 . The plating tool as set forth in  claim 19 , wherein each of the cells has the guide portion.  
     
     
         21 . The plating tool as set forth in  claim 12 , wherein the supporting member is constituted by a two plate members which are superposed each other, each of the plate members having a through hole.  
     
     
         22 . The plating tool as set forth in  claim 12 , wherein the supporting member has a long rectangular shape; and 
 wherein a major side of the supporting member extends in a rotating radial direction thereof.    
     
     
         23 . The plating tool as set forth in  claim 12 , further comprising a plurality of supporting member which are radially disposed around a center of the rotation axis thereof.  
     
     
         24 . A plating tool for plating an object, comprising: 
 a rotatable supporting member, which includes an opening formed so as to pass through the rotatable supporting member;    a line member, which is provided so as to cross the opening; and    a wall portion, which is provided on the rotatable supporting member, and protrudes from an edge portion of the opening toward an opening face of the opening,    wherein a space defined by an inner wall face of the opening and the line member is a cell in which the object to be plated is placed.    
     
     
         25 . The plating tool as set forth in  claim 24 , wherein a guide portion is provided on the rotatable supporting member so as to promote a flow of a plating liquid toward the opening.  
     
     
         26 . The plating tool as set forth in  claim 25 , wherein the guide portion is provided as a step portion formed on a surround of the opening, the step portion being lower than a surface of the supporting member.  
     
     
         27 . The plating tool as set forth in  claim 25 , wherein the guide portion is a cone-shaped portion which expands from an opening face of the opening toward a surface of the supporting member.  
     
     
         28 . The plating tool as set forth in  claim 24 , wherein the line member is provided as an conductive member which applies a current to the object.  
     
     
         29 . The plating tool as set forth in  claim 24 , wherein the object is moved in the cell in accordance with a rotation of the supporting member; 
 wherein the cell is formed so as to have at least two stable positions which allow to stably support the object for a predetermined period of time; and    wherein while the object moves from a first stable position to a second stable position of the at least two stable positions, the object is brought into contact with at least one contact area of the inner wall face of the cell.    
     
     
         30 . The plating tool as set forth in  claim 29 , wherein the cell has a shape in which a line connecting the first stable position with the second stable position deviates from the vertical direction in any displacement condition of a rotating position of the supporting member.  
     
     
         31 . The plating tool as set forth in  claim 24 , wherein the supporting member has a plurality of cells formed therein.  
     
     
         32 . The plating tool as set forth in  claim 31 , wherein each of the cells has the guide portion.  
     
     
         33 . The plating tool as set forth in  claim 24 , wherein the supporting member is constituted by a two plate members which are superposed each other, each of the plate members having a through hole.  
     
     
         34 . The plating tool as set forth in  claim 24 , wherein the supporting member has a long rectangular shape; and 
 wherein a major side of the supporting member extends in a rotating radial direction thereof.    
     
     
         35 . The plating tool as set forth in  claim 24 , further comprising a plurality of supporting member which are radially disposed around a center of the rotation axis thereof.  
     
     
         36 . A plating method of plating an object to be plated having an inner peripheral face by using the plating tool according to any one of  claims 1  to  35 .  
     
     
         37 . An electroplating apparatus including the plating tool according to any one of  claims 1  to  35 .  
     
     
         38 . A plating tool for plating an object to be plated in ring form, comprising: 
 a supporting portion, which supports the object to be plated,    wherein the supporting portion is arranged so as to rotates around a rotation axis as a center of rotation;    wherein the supporting portion has a contact face which contacts with an inner peripheral face of the object when the supporting portion supports the object; and    wherein the supporting portion has inclined walls which extend from both sides of the contact face, and restrict a position of the object.    
     
     
         39 . The plating tool as set forth in  claim 38 , further comprising a base portion which rotates around the rotation axis as a center of rotation, 
 wherein the supporting portion is formed as an projection provided on the base portion.    
     
     
         40 . The plating tool as set forth in  claim 39 , wherein the supporting portion is formed as a plurality of supporting portions which are arranged in a circular pattern having a center of rotation same as the rotation axis of the base portion.  
     
     
         41 . The plating tool as set forth in  claim 39 , wherein the supporting portion includes a dropping-off prevention member which prevents the object from being dropped off.  
     
     
         42 . The plating tool as set forth in  claim 41 , wherein the dropping-off prevention member is formed as a circular plate which is provided at a tip end portion of the projection.  
     
     
         43 . The plating tool as set forth in  claim 42 , wherein a diameter of the circular plate is smaller than an inner diameter of the object.  
     
     
         44 . The plating tool as set forth in  claim 38 , wherein the supporting portion is provided as a conductive member which applies a current to the object.  
     
     
         45 . A plating method of forming a plated object shaped in ring form by using the plating tool according to any one of  claims 38  to  44 .  
     
     
         46 . A plating apparatus including the plating tool according to any one of  claims 38  to  44 .  
     
     
         47 . A plating method of forming a nickel film by electrochemical reaction, comprising the steps of: 
 forming a one-layer nickel film on a surface of a rare-earth bonded magnet by using a plating bath which contains nickel sulfate, nickel chloride and boric acid; and    dipping the rare-earth bonded magnet to be plated in hydrochloric acid having a concentration of from 1 to 6% for 7 to 25 seconds for surface-treating of the rare-earth bonded magnet before the forming step.    
     
     
         48 . The plating method as set forth in  claim 47 , wherein the plating bath contains a dull-finish additive.  
     
     
         49 . A method of producing a plated product of rare-earth bonded magnets having a nickel plating film formed thereon, comprising the steps of: 
 providing a rare-earth bonded magnet which has a porosity of at most 7% by volume;    dipping the rare-earth bonded magnet in hydrochloric acid having a concentration of from 1 to 6% for 7 to 25 seconds for surface treatment; and    forming a one-layer nickel film on a surface of the rare-earth bonded magnet by using a plating bath which contains nickel sulfate, nickel chloride and boric acid to perform electroplating.    
     
     
         50 . The method as set forth in  claim 49 , wherein the providing step includes: 
 mixing a rare-earth magnet powder having an average particle size of from 0.5 to 50 μm and a binder resin; and    kneading a mixture of the rare-earth magnet powder and the binder resin at a temperature greater or equal to a softening temperature of the binder resin to provide the rare-earth bonded magnet.    
     
     
         51 . A plated product obtained according to the production method of  claim 49  or  50 .  
     
     
         52 . A plating method, comprising the steps of; 
 placing a magnet which has a surface magnetic flux density of 0.25 tesla or more in a plating liquid; and    forming a plated film on a surface of a material to be plated in the plating liquid by an electrochemical reaction.    
     
     
         53 . A plating method, comprising the steps of: 
 plating in a plating liquid a magnet which has a surface magnetic flux density which allows to capture a fine organic-metal composite floating in the plating liquid; and    forming a plated film on a surface of a material to be plated in the plating liquid by an electrochemical reaction.    
     
     
         54 . An electroplating apparatus, comprising: 
 a plating bath, which has a plating liquid therein;    an electrode, which is disposed in the plating liquid; and    at least one magnet, which is placed in the plating bath,    wherein the at least one magnet has a surface magnetic flux density of 0.25 tesla or more.    
     
     
         55 . An electroplating apparatus, comprising: 
 a plating bath, which has a plating liquid therein;    an electrode, which is disposed in the plating liquid; and    at least one magnet, which is placed in the plating bath,    wherein the at least one magnet has a surface magnetic flux density which allows to capture a fine organic-metal composite floating in the plating liquid.