Petroleum-free, ammonia-free cleaner for firearms and ordnance

Abstract

A composition for removing copper from a surface comprises a polyphosphonic acid, a primary amine, and water. Optionally, the composition may also comprise a dialkanolamine and/or a trialkanolamine, a degreaser, and/or a surfactant. The pH of the composition is between 9.0 and 12.5. The method of removing copper from a surface, which may be a gun bore, involves contacting the surface with the composition.

1 . A composition for removing copper from a surface, the composition comprising between 0.5 wt. % and 15.0 wt. % of a polyphosphonic acid, between 1.0 wt. % and 40.0 wt. % of a hydroxyl-substituted primary amine, and water, and having a pH between 9.0 and 12.5.  
     
     
         2 . The composition of  claim 1 , wherein the primary amine does not additionally comprise either of a dialkanolamine moiety or a trialkanolamine moiety in the same molecule as the primary amine, the composition further comprising at least one of a dialkanolamine and a trialkanolamine.  
     
     
         3 . The composition of  claim 1 , wherein the primary amine does not additionally comprise either of a dialkanolamine moiety or a trialkanolamine moiety in the same molecule as the primary amine, the composition further comprising triethanolamine.  
     
     
         4 . The composition of  claim 1 , wherein the primary amine comprises a vicinal alkanolamine.  
     
     
         5 . The composition of  claim 1 , wherein the primary amine comprises ethanolamine.  
     
     
         6 . The composition of  claim 1 , wherein the polyphosphonic acid comprises a polymethylenephosphonic acid.  
     
     
         7 . The composition of  claim 1 , wherein the polyphosphonic acid comprises a polyethylenediamine backbone and wherein two or more nitrogen atoms in the backbone each bear at least one phosphonomethyl moiety substituted thereon.  
     
     
         8 . The composition of  claim 1 , wherein the polyphosphonic acid comprises diethylenetriaminepentamethylenephosphonic acid.  
     
     
         9 . The composition of  claim 1 , wherein the polyphosphonic acid comprises at least one nitrogen atom bearing at least two phosphonomethyl moieties substituted thereon.  
     
     
         10 . The composition of  claim 1  further comprising a degreaser.  
     
     
         11 . The composition of  claim 10 , wherein the degreaser comprises a polyglycol.  
     
     
         12 . The composition of  claim 10 , wherein the degreaser comprises polypropylene glycol.  
     
     
         13 . The composition of  claim 10 , wherein the degreaser comprises at least one of propylene glycol and polypropylene glycol.  
     
     
         14 . The composition of  claim 10 , wherein the degreaser comprises a glycol dialkyl ether derived from at least one of ethylene glycol, diethylene glycol, propylene glycol, and dipropylene glycol.  
     
     
         15 . The composition of  claim 1  further comprising a surfactant.  
     
     
         16 . The composition of  claim 15 , wherein the surfactant comprises an ethoxylated propylated fatty alcohol.  
     
     
         17 . The composition of  claim 1 , wherein the composition has a pH between 11.0 and 11.5.  
     
     
         18 . The composition of  claim 1 , wherein the polyphosphonic acid comprises diethylenetriaminepentamethylenephosphonic acid and the amine comprises ethanolamine, the composition further comprising a surfactant.  
     
     
         19 . A composition for removing copper from a surface, the composition comprising a polyphosphonic acid, a hydroxyl-substituted secondary amine, a surfactant, and water, and having a pH between 9.0 and 12.5.  
     
     
         20 . A composition for removing copper from a surface, the composition comprising a polyphosphonic acid, an amino acid, a surfactant, and water, and having a pH between 9.0 and 12.5.  
     
     
         21 . The composition of  claim 19 , wherein the polyphosphonic acid comprises a polymethylenephosphonic acid.  
     
     
         22 . A composition for removing copper from a surface, the composition comprising a polyphosphonic acid, a compound comprising a nitrogen-containing heteroaromatic ring, a surfactant, and water, and having a pH between 9.0 and 12.5.  
     
     
         23 . The composition of  claim 22 , wherein the polyphosphonic acid comprises a polymethylenephosphonic acid.  
     
     
         24 . A method of removing copper from a surface, the method comprising contacting the surface with a composition comprising a polyphosphonic acid, a primary amine, and water to effect a removal of the copper.  
     
     
         25 . The method of  claim 24 , wherein the surface comprises a metal.  
     
     
         26 . The method of  claim 24 , wherein the surface comprises steel.  
     
     
         27 . The method of  claim 24 , wherein the surface comprises a gun bore.  
     
     
         28 . A method of cleaning a gun bore, the method comprising contacting the bore with a composition comprising a polyphosphonic acid, a primary amine, and water.  
     
     
         29 . The method of  claim 28 , wherein the contacting comprises contacting the gun bore with a swab impregnated with the composition.