US2005047085A1PendingUtilityA1

High performance cooling systems

Priority: Aug 26, 2003Filed: Aug 26, 2003Published: Mar 3, 2005
Est. expiryAug 26, 2023(expired)· nominal 20-yr term from priority
H05K 7/20336
29
PatentIndex Score
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Claims

Abstract

The High performance cooling system s for cooling a heat source is disclosed. The cooling systems are air cooling systems, liquid cooling system, or space radiation cooling system. The air cooling system includes at least one high performance cold plate or cold plate, at least one plenum, at least one liquid pump, and at least one liquid to air heat exchanger. The liquid cooling system includes at least one high performance cold plate or cold plate, at least one plenum, at least one liquid pump, and at least one liquid to liquid heat exchanger. The space radiation cooling system includes at least at least one high performance cold plate, or cold plate, at least one plenum, at least one liquid pump, and at least one space radiator. Several different coolant fluids are available and can be used as a primary system coolant depending on the application.

Claims

exact text as granted — not AI-modified
1 - 9 . (Canceled)  
   
   
       10 . A cooling assembly comprising 
 a cold plate assembly including at least one heat pipe and at least-one heat exchanger engaging and thermally connected to the at least one heat pipe and adapted for internally circulating a thermally conductive fluid therethrough;    heat generating electronic components in thermal conductivity with the at least one heat pipe;    a cooling system including a circuit having at least one circulating pump, at least one liquid to air heat exchanger and the heat exchanger engaging and thermally connected to the at least one heat pipe.    
   
   
       11 . A cooling assembly comprising 
 a cold plate assembly including at least one heat pipe and at least one heat exchanger engaging and thermally connected to the at least one heat pipe and adapted for internally circulating a thermally conductive fluid therethrough;    heat generating electronic components in thermal conductivity with the at least one heat pipe;    a cooling system including a circuit having at least one circulating pump, at least one liquid to liquid heat exchanger and the heat exchanger engaging and thermally connected to the at least one heat pipe.    
   
   
       12 . A cooling assembly comprising 
 a cold plate assembly including at least one heat pipe and at least one heat exchanger engaging and thermally connected to the at least one heat pipe and adapted for internally circulating a thermally conductive fluid therethrough;    heat generating electronic components in thermal conductivity with the at least one heat pipe;    a cooling system including a circuit having at least one circulating pump, at least one liquid to space radiator heat exchanger and the heat exchanger engaging and thermally connected to the at least one heat pipe.

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