Electronic apparatus

Abstract

In an electronic apparatus, having a heat diffusion structure having high efficiency, for corresponding to small-sizing and high-performances of an electronic part therein, a liquid sealing portion is provide on a cover on a side of the electronic part, which builds up a water-cooling jacket attached on an upper portion of the electronic part. Further, within an inside of this liquid sealing portion, a heat diffusion plate is provided, extending from the vicinity of the center of the water-cooling jacket in zigzag manner. With this, heat generated from the electronic part can be spread all over the cover, as a whole, on the side of the electronic part, with an aid of the evaporation heat of the liquid. The heat spread can be transmitted into the cooling liquid circulating within a housing thereof, through liquid flow passages of the water-cooling jacket, thereby being radiated into the atmosphere from the portion having a large or wide heat radiation area of the housing. Further, the heat generated from the electronic parts can be further spread, up to the water-cooling jacket having a wide area.

1 . An electronic apparatus, comprising: 
 a semiconductor element installed within a housing;    a heat-receiving portion for receiving heat generated from said semiconductor element; and    a heat radiation portion being connected between said heat radiation portion and said heat-receiving portion through conduits, wherein a heat diffusion plate is provided between said heat-receiving portion and said semiconductor element.    
   
   
       2 . The electronic apparatus, as described in the  claim 1 , wherein: 
 said heat diffusion plate is made of a metal defining a hermetically closed space therein, for enclosing evaporation medium within an inside thereof.    
   
   
       3 . The electronic apparatus, as described in the  claim 2 , wherein: 
 within the inside of said hermetically close space is attached a metal plate, expanding radial directions from a portion of said semiconductor element.    
   
   
       4 . The electronic apparatus, as described in the  claim 3 , wherein: 
 said metal plate is formed zigzagging.    
   
   
       5 . The electronic apparatus, as described in the  claim 1 , wherein: 
 said heat-receiving portion comprises four (4) pieces of liquid circulation flow passages within an inside thereof.    
   
   
       6 . The electronic apparatus, as described in the  claim 1 , wherein: 
 said liquid circulation flow passages are defined by three (3) pieces of partition walls attached on an interior wall surface of an upper cover for building up said heat-receiving portion.