US2005045100A1PendingUtilityA1

Reactors, systems with reaction chambers, and methods for depositing materials onto micro-device workpieces

Priority: Mar 3, 2003Filed: Oct 5, 2004Published: Mar 3, 2005
Est. expiryMar 3, 2023(expired)· nominal 20-yr term from priority
Inventors:Garo Derderian
C23C 16/45544C23C 16/4558C23C 16/45508C23C 16/45574C23C 16/4412
51
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Claims

Abstract

Reactors, systems with reaction chambers, and methods for depositing materials onto micro-device workpieces are disclosed herein. In one embodiment, a method for depositing material onto a micro-device workpiece includes flowing a first gas along a first vector across a first portion and toward a center of the micro-device workpiece and flowing a second gas along a second vector across a second portion and toward the center of the micro-device workpiece. The second vector is transverse to the first vector. The method can further include exhausting the first gas from a region proximate to the center of the micro-device workpiece and exhausting the second gas from the region proximate to the center of the micro-device workpiece. Flowing the first gas can include depositing the first gas uniformly from a perimeter region to a center region of the micro-device workpiece.

Claims

exact text as granted — not AI-modified
1 - 44 . (Cancelled)  
   
   
       45 . The reactor of claim  4644  wherein: 
 the first inlet projects the first gas flow radially inward; and    the second inlet projects the second gas flow radially inward.    
   
   
       46 . A reactor for depositing material onto a surface of a micro-device workpiece in a reaction chamber, the reactor comprising: 
 a reaction chamber;    a gas distributor carried by the reaction chamber, the gas distributor comprising a first gas conduit having a first inlet and a second gas conduit having a second inlet, wherein the first inlet projects a first gas flow along a first vector and the second inlet projects a second gas flow along a second vector transverse to the first vector, wherein the first and second vectors are generally parallel to the surface of the micro-device workpiece; and    an exhaust conduit coupled to the reaction chamber, the exhaust conduit having a port proximate to a center region of the micro-device workpiece to remove the first and second gases from the reaction chamber.    
   
   
       47 . The reactor of claim  4644  wherein the first gas conduit has a plurality of first inlets arranged in a generally annular configuration, and wherein the second gas conduit has a plurality of second inlets arranged in a generally annular configuration.  
   
   
       48 . (Cancelled)  
   
   
       49 . A reactor for depositing material onto a micro-device workpiece in a reaction chamber, the reactor comprising: 
 a reaction chamber:    a gas distributor carried by the reaction chamber, the gas distributor comprising a first aperture arranged to flow a first gas across a first portion and toward a center of the micro-device workpiece and a second aperture arranged to flow a second gas across a second portion and toward the center of the micro-device workpiece, wherein the first portion of the micro-device workpiece is different than the second portion; and    an exhaust conduit coupled to the reaction chamber, the exhaust conduit having a port proximate to the center of the micro-device workpiece to remove the first and second gases from the reaction chamber.    
   
   
       50 . The reactor of  claim 49  wherein the gas distributor further comprises a plurality of first apertures arranged in a generally annular configuration to flow the first gas toward the center of the micro-device workpiece and a plurality of second apertures arranged in a generally annular configuration to flow the second gas toward the center of the micro-device workpiece.  
   
   
       51 . A reactor for depositing material onto a micro-device workpiece in a reaction chamber, the reactor comprising: 
 a reaction chamber;    a gas distributor carried by the reaction chamber, the gas distributor comprising a first aperture arranged to flow a first gas across a first portion and toward a center of the micro-device workpiece and a second aperture arranged to flow a second gas across a second portion and toward the center of the micro-device workpiece, wherein the first portion of the micro-device workpiece is different than the second portion;    a workpiece support in the reaction chamber; and    a heater carried by the workpiece support;    wherein the first aperture is configured to flow the first gas proximate to the heater and the second aperture is configured to flow the second gas proximate to the heater.    
   
   
       52 . The reactor of  claim 49  wherein the gas distributor further comprises a first injector having the first aperture and a second injector having the second aperture.  
   
   
       53 . The reactor of  claim 49  wherein the first aperture is configured to flow the first gas in a first direction and the second aperture is configured to flow the second gas in a second direction diametrically opposed to the first direction.  
   
   
       54 . The reactor of  claim 49  wherein the first aperture is coupled to a first gas conduit and the second aperture is coupled to a second gas conduit different than the first gas conduit.  
   
   
       55 . (Cancelled)  
   
   
       56 . A reactor for depositing material onto a micro-device workpiece in a reaction chamber, the reactor comprising: 
 a reaction chamber;    a gas distributor carried by the reaction chamber, the gas distributor comprising a plurality of apertures arranged generally annularly about the micro-device workpiece and configured to flow a gas radially inward across corresponding portions of the workpiece from a perimeter region to a central region; and    an exhaust conduit coupled to the reaction chamber, the exhaust conduit having a port proximate to the central region of the micro-device workpiece to remove the gas from the reaction chamber.    
   
   
       57 . A reactor for depositing material onto a micro-device workpiece in a reaction chamber, the reactor comprising: 
 a reaction chamber;    a gas distributor carried by the reaction chamber, the gas distributor comprising a plurality of apertures arranged generally annularly about the micro-device workpiece and configured to flow a gas radially inward across corresponding portions of the workpiece from a perimeter region to a central region;    a workpiece support in the reaction chamber; and    a heater carried by the workpiece support;    wherein the plurality of apertures are configured to flow the gas proximate to the heater.    
   
   
       58 . The reactor of  claim 56  wherein the gas distributor has an annular configuration.  
   
   
       59 . The reactor of  claim 56  wherein the apertures include first and second apertures, and wherein the first aperture is configured to flow the gas in a first direction and the second aperture is configured to flow the gas in a second direction diametrically opposed to the first direction.  
   
   
       60 . The reactor of  claim 56  wherein the apertures include first and second apertures, and wherein the first aperture is coupled to a first gas conduit and the second aperture is coupled to a second gas conduit different than the first gas conduit.  
   
   
       61 . The reactor of  claim 56  wherein the gas distributor further comprises an antechamber in fluid communication with the apertures.  
   
   
       62 . A system for depositing material onto a micro-device workpiece in a reaction chamber, the system comprising: 
 a gas supply assembly having a first gas source and a second gas source;    a reaction chamber;    a workpiece support in the reaction chamber, the workpiece support having a center region and a perimeter region surrounding the center region;    a gas distributor carried by the reaction chamber and coupled to the gas supply assembly, the gas distributor comprising a first aperture proximate to the perimeter region of the workpiece support and a second aperture proximate to the perimeter region of the workpiece support, wherein a first gas flows through the first aperture and a second gas flows through the second aperture; and    an exhaust conduit coupled to the reaction chamber, the exhaust conduit having a port proximate to the center region of the workpiece support to remove the first and second gases from the reaction chamber.    
   
   
       63 . The system of  claim 62  wherein the gas distributor further comprises a plurality of first apertures proximate to the perimeter region and arranged in a generally annular configuration to flow the first gas toward the center of the micro-device workpiece and a plurality of second apertures proximate to the perimeter region and arranged in a generally annular configuration to flow the second gas toward the center of the micro-device workpiece.  
   
   
       64 . The system of  claim 62  wherein the gas distributor further comprises a first injector having the first aperture and a second injector having the second aperture.  
   
   
       65 . A system for depositing material onto a surface of a micro-device workpiece in a reaction chamber, the system comprising: 
 a gas supply assembly having a first gas source and a second gas source;    a reaction chamber;    a workpiece support in the reaction chamber;    a gas distributor carried by the reaction chamber and coupled to the gas supply assembly, the gas distributor comprising a first gas conduit having a first inlet and a second gas conduit having a second inlet, wherein the first inlet projects a first gas flow along a first vector and the second inlet projects a second gas flow along a second vector transverse to the first vector, wherein the first and second vectors are generally parallel to the surface of the micro-device workpiece; and    an exhaust conduit coupled to the reaction chamber, the exhaust conduit having a port proximate to a center of the micro-device workpiece to remove the first and second gases from the reaction chamber.    
   
   
       66 . The system of  claim 65  wherein: 
 the first inlet projects the first gas flow radially inward; and    the second inlet projects the second gas flow radially inward.    
   
   
       67 . The system of  claim 65  wherein the first gas conduit has a plurality of first inlets arranged in a generally annular configuration, and wherein the second gas conduit has a plurality of second inlets arranged in a generally annular configuration.  
   
   
       68 . A system for depositing material onto a micro-device workpiece in a reaction chamber, the system comprising: 
 a gas supply assembly having a first gas source and a second gas source;    a reaction chamber;    a workpiece support in the reaction chamber;    a gas distributor carried by the reaction chamber and coupled to the gas supply assembly, the gas distributor comprising a first aperture arranged to flow a first gas across a first portion and toward a center of the micro-device workpiece and a second aperture arranged to flow a second gas across a second portion and toward the center of the micro-device workpiece, wherein the first portion of the micro-device workpiece is different than the second portion; and    an exhaust conduit coupled to the reaction chamber, the exhaust conduit having a port proximate to the center of the micro-device workpiece to remove the first and second gases from the reaction chamber.    
   
   
       69 . The system of  claim 68  wherein the gas distributor further comprises a plurality of first apertures arranged in a generally annular configuration to flow the first gas toward the center of the micro-device workpiece and a plurality of second apertures arranged in a generally annular configuration to flow the second gas toward the center of the micro-device workpiece.  
   
   
       70 . The system of  claim 68 , further comprising a heater carried by the workpiece support, wherein the first aperture is configured to flow the first gas proximate to the heater and the second aperture is configured to flow the second gas proximate to the heater.  
   
   
       71 . A system for depositing material onto a micro-device workpiece in a reaction chamber, the system comprising: 
 a gas supply assembly having a first gas source and a second gas source;    a reaction chamber;    a workpiece support in the reaction chamber;    a gas distributor carried by the reaction chamber and coupled to the gas supply assembly, the gas distributor comprising a plurality of apertures arranged generally annularly about the micro-device workpiece and configured to flow a gas radially inward across corresponding portions of the workpiece from a perimeter region to a central region; and    an exhaust conduit coupled to the reaction chamber, the exhaust conduit having a port proximate to the central region of the micro-device workpiece to remove the gas from the reaction chamber.    
   
   
       72 . The system of  claim 71 , further comprising a heater carried by the workpiece support, wherein the plurality of apertures are configured to flow the gas proximate to the heater.  
   
   
       73 . The system of  claim 71  wherein the gas distributor further comprises a plurality of injectors having the apertures.

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