Low friction planarizing/polishing pads and use thereof

Abstract

A polishing pad comprising a polymeric matrix and solid lubricant particles is useful for planarizing surfaces, and preventing delamination and scratches.

1 . A pad for planarizing a workpiece which comprises a polymeric matrix and solid lubricant particles in an amount sufficient to reduce friction between the pad and workpiece during planarizing.  
     
     
         2 . The pad of  claim 1 , wherein the solid lubricant particles comprise fluoropolymers selected from the group consisting of poly (tetrafluorethylene ((PTFE), fluoroethylene-propylene copolymers (FEP), perfluoroalkoxy resins (PFA) ethylene-chlorotrifluoroethylene alternating copolymer (ECTFE), poly (vinylidene fluoride) PVDE and mixtures thereof.  
     
     
         3 . The pad of  claim 1 , wherein the lubricant particles have a coefficient of friction of 0.03 to about 0.3.  
     
     
         4 . The pad of  claim 1  wherein the solid lubricant particles have a spherical shape, a cylindrical shape, or a platelet shape, and optionally contain cut fibers.  
     
     
         5 . The pad of  claim 1  wherein the size of the solid lubricant particles is about 0.05 to about 18 microns.  
     
     
         6 . The pad of  claim 1  wherein the size of the solid lubricant particles is about 0.05 to about 0.5 microns.  
     
     
         7 . The pad of  claim 2  wherein the organic fluoropolymers have a weight average molecular weight of about 1×10 5  to about 5×10 5 .  
     
     
         8 . The pad of  claim 1  wherein the amount of solid lubricant particles is about 0.5 to about 30% by weight.  
     
     
         9 . The pad of  claim 1  wherein the amount of solid lubricant particles is about 0.5 to about 10% by weight.  
     
     
         10 . The pad of  claim 1  wherein the amount of the solid lubricant particles is about 2 to 3% by weight.  
     
     
         11 . The pad of  claim 1  wherein the solid lubricant particles are pretreated with a surfactant in an amount sufficient to disperse the lubricant particles in a planarizing slurry upon being detached from the pad during planarizing.  
     
     
         12 . The pad of  claim 1  wherein the polymeric matrix comprises at least one member selected from the group consisting of polyurethane, polycarbonate, polyamide, polysulfone, polyvinyl chloride, polyacrylate, polymethacrylate, polyvinylalcohol, polyester and polyacrylamide.  
     
     
         13 . The pad of  claim 1 , wherein the polymeric matrix is microporous.  
     
     
         14 . The pad of  claim 1 , wherein the polymeric matrix is non-porous.  
     
     
         15 . The pad of  claim 1 , wherein the pad surface contains macroscopic channels before use and microscopic texture during use to facilitate slurry transport.  
     
     
         16 . The pad of  claim 1 , wherein said lubricant particles comprises at least one member selected from the binding agent, coupling agent or adhesive promoter.  
     
     
         17 . A method for planarizing a surface which is formed on a substrate which comprises 
 providing on the surface to be planarized a liquid polish slurry composition;    and contacting said surface with a polishing pad that comprises a polymeric matrix and solid lubricant particles in an amount sufficient to reduce friction between the pad and surface during planarizing.    
     
     
         18 . The method of  claim 17 , wherein the solid lubricant particles comprise fluoropolymers selected from the group consisting of poly (tetrafluorethylene ((PTFE), fluoroethylene-propylene copolymers (FEP), perfluoroalkoxy resins (PFA) ethylene-chlorotrifluoroethylene alternating copolymer (ECTFE), poly (vinylidene fluoride) PVDE and mixtures thereof.  
     
     
         19 . The method of  claim 17 , wherein the lubricant particles have a coefficient of friction of 0.03 to about 0.3.  
     
     
         20 . The method of  claim 17 , wherein the solid lubricant particles have a spherical shape, a cylindrical shape, or a platelet shape, and optionally contain cut fibers.  
     
     
         21 . The method of  claim 17 , wherein the size of the solid lubricant particles is about 0.05 to about 18 microns.  
     
     
         22 . The method of  claim 17 , wherein the size of the solid lubricant particles is about 0.05 to about 0.5 microns.  
     
     
         23 . The method of  claim 17 , wherein the organic fluoropolymers have a weight average molecular weight of about 1×10 5  to about 5×10 5 .  
     
     
         24 . The method of  claim 17 , wherein the amount of solid lubricant particles is about 0.5 to about 30% by weight.  
     
     
         25 . The method of  claim 17  wherein the amount of solid lubricant particles is about 0.5 to about 10% by weight.  
     
     
         26 . The method of  claim 17 , wherein the amount of the solid lubricant particles is about 2 to 3% by weight.  
     
     
         27 . The method of  claim 17 , wherein the solid lubricant particles are pretreated with a surfactant in an amount sufficient to disperse the lubricant particles in a planarizing slurry upon being detached from the pad during planarizing.  
     
     
         28 . The method of  claim 17 , wherein the polymeric matrix comprises at least one member selected from the group consisting of polyurethane, polycarbonate, polyamide, polysulfone, polyvinyl chloride, polyacrylate, polymethacrylate, polyvinylalcohol, polyester and polyacrylamide.  
     
     
         29 . The method of  claim 17 , wherein the polymeric matrix is microporous.  
     
     
         30 . The method of  claim 17 , wherein the polymeric matrix is non-porous.  
     
     
         31 . The method of  claim 17 , wherein the pad surface contains macroscopic channels before use and microscopic texture during use to facilitate slurry transport.  
     
     
         32 . The method of  claim 17 , wherein said lubricant particles comprises at least one member selected from the group consisting of a binding agent, coupling agent or adhesive promoter.  
     
     
         33 . A method according to  claim 17 , wherein the surface to be polished is selected from the group consisting of Al, Al alloys, Cu, Cu alloys, Ag, Ag-alloys, Au, Au alloys, W, W alloys, silicon oxide, polysilicon, silicon nitride, Ta, Ta alloys, Ti, Ti alloys, low-k dielectric and combinations thereof.  
     
     
         34 . A method according to  claim 17 , wherein the surface to be polished contains at least one low-k dielectric selected from the group consisting low-k porous dielectric, low-k non-porous dielectric and air bridges and combinations thereof.  
     
     
         35 . A method according to  claim 34  wherein said low-k dielectric comprises at least one member selected from the group consisting of CVD carbon-doped silicon oxide, spin on organo silicate and spin on organic polymer.  
     
     
         36 . A method according to  claim 17 , wherein said planarizing is chemical-mechanical polishing (CMP).