Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

Abstract

A method of manufacturing a semiconductor device, including a first step of placing a resin between one surface of a semiconductor chip, having a plurality of electrodes formed thereon, and a substrate having a wiring pattern formed thereon and defining at least one through-hole in a region in which the semiconductor chip is to be mounted on the substrate, to form a space therebetween that opens into the through-hole, and a second step of pressing either one of the semiconductor chip and the substrate against the other to thereby bond the semiconductor chip to the substrate.

1 . A semiconductor device, comprising: 
 a semiconductor chip having a plurality of electrodes;    a substrate having a wiring pattern formed thereon, the substrate having a region on which the semiconductor chip is face-down bonded, the substrate defining at least one through-hole in the region on which the semiconductor chip is face-down bonded; and    a resin disposed at least between the semiconductor chip and the substrate, the resin divided by a space that is in communication with the through-hole into at least two parts.    
     
     
         2 . The semiconductor device as claimed in  claim 1 , the resin being disposed within the region in which the semiconductor chip is mounted on the substrate.  
     
     
         3 . The semiconductor device as claimed in  claim 1 , the resin containing conductive particles, the conductive particles being disposed between the electrodes and the wiring pattern.  
     
     
         4 . The semiconductor device as claimed in  claim 3 , the resin being an anisotropic conductive film.  
     
     
         5 . A circuit board incorporating the semiconductor device of  claim 1 .  
     
     
         6 . An electronic instrument incorporating the semiconductor device of  claim 1.