Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer

Abstract

Process for producing a structured metal layer on a substrate body, in which either a structured bonding layer is applied to the substrate body, in order for a metal foil or a metal powder to be fixed on this bonding layer, or in which a metal foil or a metal layer is applied to the entire surface of a substrate body made from a plastics material and is pressed onto the substrate body with the aid of a structured, heated ram and fixed by a subsequent setting of the substrate body. The metal layer is structured by mechanical removal of those regions of the metal foil or of the metal powder which are not joined to the adhesive or to the substrate body.

1 . A process for producing a metal layer on a substrate body, comprising the steps of: 
 applying a bonding layer to at least part of a surface of the substrate body;    applying a metal foil or a metal powder to the surface of the substrate body which has been provided with the bonding layer, thereby fixing the metal foil or the metal powder to the bonding layer; and    mechanically removing regions of the metal foil or of the metal powder that are not fixed to the bonding layer, so that only regions of the metal foil or of the metal powder that are fixed to the bonding layer remain, in correspondingly structured form, on the substrate body.    
     
     
         2 . The process according to  claim 1 , wherein the bonding layer is a layer of adhesive.  
     
     
         3 . A process for producing a metal layer on a substrate body, comprising the steps of: 
 arranging a metal foil or metal powder on at least part of a surface of the substrate body;    pressing the metal foil or the metal powder onto the substrate body by a heated, structured ram, wherein regions of the substrate body which are operatively connected to the ram are converted from a solid state into a viscous state;    removing the structured ram from the metal foil or the powder-coated substrate material after a predetermined period of time, and then allowing the substrate body to set again such that the metal foil or the metal powder is fixedly joined to the substrate body at the regions; and    mechanically removing regions of the metal foil or of the metal powder that are not fixed to the substrate body, so that only those regions of the metal foil or of the metal powder which are fixed to the substrate body remain on the substrate body, in correspondingly structured form.    
     
     
         4 . The process according to  claim 3 , wherein the substrate body consists of a material whose melting point is lower than a melting point of the metal foil or of the metal powder.  
     
     
         5 . The process according to  claim 3 , wherein the substrate body is made from a plastics material.  
     
     
         6 . The process according to  claim 1 , wherein the mechanical removal of those parts of the metal foil or of the metal powder that are not fixed to the bonding layer is effected by brushing, sucking, or sweeping them off.  
     
     
         7 . The process according to  claim 3 , wherein the mechanical removal of those parts of the metal foil or of the metal powder that are not fixed to the bonding layer is effected by brushing, sucking, or sweeping them off.  
     
     
         8 . The process according to  claim 3 , wherein the structured metal layer is reinforced chemically and/or by electrodeposition.  
     
     
         9 . The process according to  claim 1 , wherein the metal foil or the metal powder comprises copper, brass, or another metal.  
     
     
         10 . The process according to  claim 3 , wherein the metal foil or the metal powder comprises copper, brass, or another metal.  
     
     
         11 . The process according to  claim 1 , wherein the metal foil or the metal powder comprises gold.  
     
     
         12 . The process according to  claim 3 , wherein the metal foil or the metal powder comprises gold.  
     
     
         13 . A substrate body having a metal foil in which a metal layer is joined to a surface of the substrate body via a bonding layer, wherein the thickness of the metal layer is less than 4 μm.  
     
     
         14 . A substrate body having a structured metal layer, wherein the metal layer is applied directly to a surface of the substrate body, and the thickness of the metal layer is less than 4 μm.  
     
     
         15 . A substrate body according to  claim 13 , wherein a further metal layer is provided on a side of the metal layer that is remote from the substrate body.  
     
     
         16 . A substrate body according to  claim 14 , wherein a further metal layer is provided on a side of the metal layer that is remote from the substrate body.