Integral chip lid and heat sink

Abstract

An integrally formed chip lid and heat sink of the present invention comprises a chip lid portion, and a heat sink portion formed from said chip lid. The integrally formed chip lid portion and heat sink portion are manufactured as a single part, such that there is no interface between the chip lid portion and the heat sink portion.

1 . An integrally formed chip lid and heat sink comprising: 
 a chip lid portion; and    a heat sink portion formed from said chip lid.    
   
   
       2 . The integrally formed chip lid and heat sink according to  claim 1 , further comprising a die receptacle integrally formed in said chip lid portion.  
   
   
       3 . The integrally formed chip lid and heat sink according to  claim 2 , wherein said die receptacle is orientated in said chip lid portion such that said heat sink portion is orientated parallel to an airflow about said heat sink portion.  
   
   
       4 . The integrally formed chip lid and heat sink according to  claim 1 , further comprising a vapor chamber formed in said heat sink portion.  
   
   
       5 . The integrally formed chip lid and heat sink according to  claim 1 , wherein said chip lid portion and said heat sink portion are formed from a thermally conductive material selected from the group consisting of a metal, a ceramic, a ceramic infused with metal, a plastic and an epoxy.  
   
   
       6 . The integrally formed chip lid and heat sink according to  claim 1 , wherein said heat sink portion comprises a fin selected from a group consisting of a folded fin, a stacked fin, a boxed fin and a pin field fin.  
   
   
       7 . The integrally formed chip lid and heat sink according to  claim 1 , further comprising a pedestal formed in said chip lid portion.  
   
   
       8 . An integrally formed chip lid and heat sink comprising: 
 a chip lid portion; and    a heat sink portion formed from said chip lid, wherein said heat sink portion comprises a heat sink fin receptacle.    
   
   
       9 . The integrally formed chip lid and heat sink according to  claim 8 , further comprising a heat sink fin coupled to said heat sink fin receptacle.  
   
   
       10 . The integrally formed chip lid and heat sink according to  claim 8 , wherein said heat sink portion further comprises a vapor chamber.  
   
   
       11 . The integrally formed chip lid and heat sink according to  claim 8 , further comprising a die receptacle integrally formed in said chip lid portion.  
   
   
       12 . The integrally formed chip lid and heat sink according to  claim 11 , wherein said die receptacle is orientated in said chip lid portion such that said heat sink portion is orientated parallel to an airflow about said heat sink portion.  
   
   
       13 . A method of fabricating an integral chip lid and heat sink comprising: 
 forming a chip lid portion; and    forming a heat sink portion integrally with said chip lid.    
   
   
       14 . The method according to  claim 13 , wherein forming said chip lid portion comprises a process selected from the group consisting of molding, casting, machining and forging.  
   
   
       15 . The method according to  claim 13 , wherein forming said heat sink portion comprises a process selected from the group consisting of molding, casting, machining and forging.  
   
   
       16 . The method according to  claim 13 , further comprising forming a vapor chamber in said heat sink portion.  
   
   
       17 . The method according to  claim 13 , further comprising forming a heat sink fin receptacle in said heat sink portion.  
   
   
       18 . The method according to  claim 17 , further comprising attaching a heat sink fin to said heat sink fin receptacle.  
   
   
       19 . The method according to  claim 13 , further comprising forming a plurality of heat sink fin receptacles in said heat sink portion.  
   
   
       20 . The method according to  claim 19 , further comprising attaching a plurality of heat sink fins to said plurality of heat sink fin receptacles, wherein said plurality of heat sink fins are selected from a group consisting of a stacked fin, a folded fin, a boxed fin and a pin field fin.