Method for removing the harmful effects of organic halogen compound gas, apparatus for removing the harmful effects of organic halogen compound gas, system for fabricating semiconductor devices, and method for fabricating semiconductor devices

Abstract

The invention provides a method for removing the harmful effects of organic halogen compound gas, in which an organic halogen compound gas ( 20 ) discharged by a production unit ( 8 ) is transferred into an organic halogen compound-decomposing unit ( 4 ) via an adsorbing part ( 6 ) that contains an adsorbent ( 60 ), followed by decomposing the organic halogen compound gas ( 20 ) in the organic halogen compound-decomposing unit ( 4 ), and provides an apparatus for removing the harmful effects of organic halogen compound gas, a system for fabricating semiconductor devices, and a method for fabricating semiconductor devices.

1 . An apparatus for removing the harmful effects of organic halogen compound gas, which comprises: 
 an organic halogen compound-decomposing unit in which the organic halogen compound gas having been discharged by a production unit is decomposed; and    an adsorbing part that contains an adsorbent and is placed between the production unit and the organic halogen compound-decomposing unit in the path of the organic halogen compound gas flow.    
     
     
         2 . The apparatus for removing the harmful effects of organic halogen gas compound as claimed in  claim 1 , wherein the adsorbent is a porous material.  
     
     
         3 . The apparatus for removing the harmful effects of organic halogen gas compound as claimed in  claim 1 , wherein the adsorbent is any one of zeolite, activated charcoal and porous ceramics.  
     
     
         4 . The apparatus for removing the harmful effects of organic halogen gas compound as claimed in  claim 1 , wherein the exhaust gas-decomposing unit is any one of chemical-type, catalyst-type, combustion-type or plasma-type decomposing units.  
     
     
         5 . A system for fabricating semiconductor devices, which comprises: 
 a semiconductor device fabricating unit that discharges organic halogen compound gas;    an organic halogen compound-decomposing unit for decomposing the organic halogen compound gas; and    an adsorbing part that contains an adsorbent and is placed between the semiconductor device-fabricating unit and the organic halogen compound-decomposing unit in the path of the organic halogen compound gas flow.    
     
     
         6 . The system for fabricating semiconductor devices as claimed in  claim 5 , wherein the adsorbent is a porous material.  
     
     
         7 . The system for fabricating semiconductor devices as claimed in  claim 5 , wherein the adsorbent is any one of zeolite, activated charcoal and porous ceramics.  
     
     
         8 . The system for fabricating semiconductor devices as claimed in  claim 5 , wherein the exhaust gas-decomposing unit is any one of chemical-type, catalyst-type, combustion-type or plasma-type decomposing units.  
     
     
         9 . The system for fabricating semiconductor devices as claimed in  claim 5 , wherein the semiconductor device-fabricating unit is a CVD unit or an etching unit.