US2005034810A1PendingUtilityA1

Mask and container and manufacturing apparatus

Assignee: SEMICONDUCTOR ENERGY LABPriority: Apr 10, 2003Filed: Apr 8, 2004Published: Feb 17, 2005
Est. expiryApr 10, 2023(expired)· nominal 20-yr term from priority
G03F 7/70741G03F 1/66C23C 14/042H10K 71/166
43
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Claims

Abstract

The present invention provides a large mask with a high mask accuracy for conducting selective deposition on a substrate with a large surface area. In accordance with the present invention, the mask body is fixed in a fixing position disposed on a line passing through a thermal expansion center in the width of the mask frame. Further, in accordance with the present invention, the substrate and mask body are fixed and deposition is carried out by moving the deposition source in the X direction or Y direction. A method comprising moving the deposition source in the X direction or Y direction is suitable for deposition on large substrates.

Claims

exact text as granted — not AI-modified
1 . A thin-sheet mask having a pattern opening, characterized in that 
 the mask is fixed to a frame in a stretched state and said mask is adhesively bonded in a location coinciding with a line passing through a thermal expansion center in the members of the frame.    
   
   
       2 . The mask according to  claim 1 , characterized in that four corners of said frame have a curvature.  
   
   
       3 . The mask according to  claim 1 , characterized in that said mask is adhesively bonded to the frame with an adhesive material having heat resistance.  
   
   
       4 . A thin-sheet mask having a pattern opening, characterized in that 
 the mask is fixed to a frame in a stretched state and said mask is adhesively bonded in a location on the outside of a line passing through a thermal expansion center in the members of the frame,    the frame is caused to expand by heating during deposition and the mask maintains the stretched state.    
   
   
       5 . The mask according to  claim 4 , characterized in that four corners of said frame have a curvature.  
   
   
       6 . The mask according to  claim 4 , characterized in that said mask is adhesively bonded to the frame with an adhesive material having heat resistance.  
   
   
       7 . A container for accommodating a deposition material, which is disposed in a deposition source of a deposition apparatus, characterized in that 
 the cross section in a plane of said container has a rectangular or square shape and the opening portion through which the deposition material passes has a thin elongated shape.    
   
   
       8 . A production apparatus comprising a loading chamber, a transportation chamber linked to said loading chamber, a plurality of film forming chambers linked to said transportation chamber, and a disposition chamber linked to said film forming chambers, characterized in that 
 the plurality of film forming chambers comprise means for fixing a substrate which is linked to an evacuation chamber for evacuating the inside of the film forming chambers, a mask, a frame for fixing said mask, alignment means for aligning the mask and the substrate, one or two deposition sources, means for moving said deposition sources inside said film forming chambers, and means for heating the substrate, and    the end portion of the mask is adhesively bonded in a location matching a line passing through a thermal expansion center in the members of said frame.    
   
   
       9 . The production apparatus according to  claim 8 , characterized in that said film forming chambers and said disposition chamber comprise means capable of introducing a material gas or cleaning gas and linked to the evacuation chamber for evacuating the inside of the chambers.  
   
   
       10 . The production apparatus according to  claim 8 , characterized in that said deposition source can be moved in the X direction, Y direction, or Z direction inside the film forming chamber.  
   
   
       11 . The production apparatus according to  claim 8 , characterized in that a shutter for partitioning the inside of the film forming chamber and shielding the deposition on said substrate is provided in said film forming chamber.  
   
   
       12 . A production apparatus comprising a loading chamber, a transportation chamber linked to said loading chamber, a plurality of film forming chambers linked to said transportation chamber, and a disposition chamber linked to said film forming chambers, characterized in that 
 the plurality of film forming chambers comprise means for fixing a substrate which is linked to an evacuation chamber for evacuating the inside of the film forming chambers, a mask, a frame for fixing said mask, alignment means for aligning said mask and the substrate, one or two deposition sources, means for moving said deposition sources inside the film forming chambers, and means for heating the substrate, and    the cross section in a plane of the container for accommodating a deposition material, which is disposed in said deposition source, has a rectangular or square shape and the opening portion has a thin elongated shape.    
   
   
       13 . The production apparatus according to  claim 12 , characterized in that said container is composed of an upper part and a lower part, and evaporation of the material from said deposition source is adjusted by the shape of the opening portion in the upper part of the container.  
   
   
       14 . The production apparatus according to  claim 12 , characterized in that said film forming chambers and said disposition chamber comprise means capable of introducing a material gas or cleaning gas and linked to the evacuation chamber for evacuating the inside of the chambers.  
   
   
       15 . The production apparatus according to  claim 12 , characterized in that said deposition source can be moved in the X direction, Y direction, or Z direction inside the film forming chamber.  
   
   
       16 . The production apparatus according to  claim 12 , characterized in that a shutter for partitioning the inside of the film forming chamber and shielding the deposition on said substrate is provided in said film forming chamber.

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