Apparatus and method for cleaning probe card contacts

Abstract

An apparatus and method for cleaning debris and residue from a multitude of electrical contacts of a test probe card of an integrated circuit test probe apparatus preferably comprises a silicon wafer having a grooved surface into which the test probe card is moved into pressurized contact. The grooved surface provides a grating structure that when combined with the pressurized electrical contacts will crush any intervening or attached residue particles, which will then break into smaller particles and fall away from the probe card. Pressure and relative movement of the probe card may be controlled by a variety of measurement sensors.

1 - 12 . (Cancelled)  
     
     
         13 . A method for cleaning a test probe needle of an integrated circuit (IC) test probe apparatus, comprising: 
 a) placing a ridged breaking apparatus in a wafer support cradle of the IC test probe apparatus;    b) applying a motive means to move the test probe needle into contact with the ridged breaking apparatus;    c) applying a predetermined additional force to move the test probe needle past the outermost surface of the ridged breaking apparatus, such that any debris that is attached to the end of the test probe needle is broken down into smaller residual portions due to the crushing action of the needle movement against the ridged breaking apparatus; and    d) removing the ridged breaking apparatus from the wafer support cradle of the IC test probe apparatus.    
     
     
         14 . The method as claimed in  claim 13 , additionally including after step c) a step of c1) removing the smaller residual portions from the test probe needle.  
     
     
         15 . The method as claimed in  claim 13 , wherein the motive means is applied in an orthogonal direction relative to the top surface of the breaker.  
     
     
         16 . The method as claimed in  claim 13 , wherein the motive means is applied in a direction that is between about 90 degrees and 135 degrees relative to the top surface of the breaker.  
     
     
         17 . The method as claimed in  claim 13 , wherein the motive means is applied in a direction that is about 103 degrees relative to the top surface of the breaker.  
     
     
         18 . The method as claimed in  claim 13 , wherein a plurality of test probe needles of an integrated circuit (IC) test probe apparatus is cleaned.  
     
     
         19 . A method for cleaning a test probe needle of an integrated circuit (IC) test probe apparatus, comprising the steps of: 
 a) placing a ridged breaking apparatus in a wafer support cradle of the IC test probe apparatus;    b) applying a motive means to move the ridged breaking apparatus into contact with the test probe needle;    c) applying a predetermined additional force to move the ridged breaking apparatus such that the outermost surface is past the tip of the needle, such that any debris that is attached to the end of the test probe needle is broken down into smaller residual portions due to the crushing action of the ridged breaking apparatus against the needle; and    d) removing the ridged breaking apparatus from the wafer support cradle of the IC test probe apparatus.    
     
     
         20 . The method as claimed in  claim 19 , additionally including after step c) a step of c1) removing the smaller residual portions from the probe needles.  
     
     
         21 . The method as claimed in  claim 19 , wherein the motive means is applied in an orthogonal direction relative to the top surface of the breaker.  
     
     
         22 . The method as claimed in  claim 19 , wherein the motive means is applied in a direction that is between about 90 degrees and about 135 degrees relative to the top surface of the breaker.  
     
     
         23 . The method as claimed in  claim 19 , wherein the motive means is applied in a direction that is about 103 degrees relative to the top surface of the breaker.  
     
     
         24 . The method as claimed in  claim 19 , wherein a plurality of test probe needles of an integrated circuit (IC) test probe apparatus is cleaned.