Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method

Abstract

A dressing apparatus DA is constructed from a pad holding mechanism 10 which holds a polishing pad 15 that has a doughnut disk-form pad surface 15 a , and which causes this polishing pad 15 to rotate, a dressing tool 2 which has a substantially rectangular dressing surface 3 , and a dressing tool holding mechanism 1 which holds the dressing tool 2 so that the dressing surface 3 of this dressing tool 2 is caused to face the pad surface 15 a of the polishing pad 15 that is held and caused to rotate by the pad holding mechanism 10 . The dressing tool holding mechanism 1 causes the held dressing tool 2 to contact the pad surface 15 a in a state in which the centerline L 1 in the direction of width of the dressing surface 3 is oriented so that this centerline extends in the radial direction of the pad surface 15 a , and thus causes dressing to be performed. As a result, the flatness of the working surface following dressing can be improved.

1 . A dressing tool which performs the dressing of a working tool that has a doughnut disk-form or circular disk-form working surface, this dressing tool being characterized by the fact that the tool has a substantially rectangular dressing surface that performs dressing by contacting the working surface of the above-mentioned working tool, and the above-mentioned dressing surface is disposed so that the centerline of the above-mentioned dressing surface in the direction of the short sides of the above-mentioned substantially rectangular shape coincides with the radial direction passing through the center of the above-mentioned doughnut disk or circular disk of the above-mentioned working tool during dressing.  
   
   
       2 . The dressing tool according to  claim 1 , which is characterized by the fact that the shapes of both long sides of the above-mentioned substantially rectangular shape that extend parallel to the above-mentioned centerline in the direction of the short sides are shapes which are such that when the above-mentioned dressing surface is caused to contact the above-mentioned working surface, the contact length between the above-mentioned working surface and the above-mentioned dressing surface is equal at all positions in the radial direction of the above-mentioned working surface.  
   
   
       3 . A dressing apparatus which is characterized by the fact that this apparatus has the dressing tool according to  claim 1 , and a working tool holding mechanism which holds a working tool that has a doughnut disk-form or circular disk-form working surface, and which causes this working tool to rotate about an axis that passes through the center of the above-mentioned doughnut disk or circular disk perpendicular to the above-mentioned working surface.  
   
   
       4 . The dressing apparatus according to  claim 3 , which is characterized by the fact that this apparatus has a plurality of dressing tools, and these dressing tools are disposed so that the dressing tools simultaneously dress the above-mentioned working surface.  
   
   
       5 . A working apparatus which has the above-mentioned working tool that is dressed by the dressing tool according to  claim 1 .  
   
   
       6 . A working apparatus which has the above-mentioned working tool that is dressed by the dressing apparatus according to  claim 3 .  
   
   
       7 . A dressing tool which is used to dress the working surface of a working tool that has a circular outer circumference, this dressing tool being characterized by the fact that the dressing tool comprises a dressing surface which is constructed from a circular region that has a first cutting capacity per unit area, and an annular region that is concentric with the above-mentioned circular region and that has a second cutting capacity per unit area that is higher than the above-mentioned first cutting capacity per unit area, the diameter of the above-mentioned circular region of the above-mentioned dressing surface is greater than the effective use width within the radius of the above-mentioned working surface, and the external diameter of the above-mentioned annular region of the above-mentioned dressing surface is substantially half of the external diameter of the above-mentioned working surface.  
   
   
       8 . A dressing tool which is used to dress the working surface of a working tool that has a circular outer circumference, this dressing tool being characterized by the fact that the dressing tool comprises a dressing surface which is constructed from a circular region in which abrasive grains are distributed at a first mean distribution density, and an annular region which is concentric with the above-mentioned circular region, and in which abrasive grains are distributed at a second mean distribution density that is higher than the above-mentioned first mean distribution density, the diameter of the above-mentioned circular region of the above-mentioned dressing surface is greater than the effective use width within the radius of the above-mentioned working surface, and the external diameter of the above-mentioned annular region of the above-mentioned dressing surface is substantially half of the external diameter of the above-mentioned working surface.  
   
   
       9 . The dressing tool according to  claim 8 , which is characterized by the fact that the above-mentioned first mean distribution density is 10% to 50% of the above-mentioned second mean distribution density.  
   
   
       10 . A dressing apparatus which is characterized by the fact that this dressing apparatus comprises the dressing tool according to  claim 7 , and a rotational mechanism which causes this dressing tool to rotate.  
   
   
       11 . A dressing method which dresses the working surface of a working tool supported on a substrate by causing contact between this working surface and the dressing surface of a dressing tool and causing relative motion between the above-mentioned substrate and the above-mentioned dressing tool, this dressing method being characterized by the fact that this method comprises a setting stage in which the relative inclination of the above-mentioned dressing surface with reference to the above-mentioned substrate is adjusted to a desired inclination and set, and a dressing stage in which the above-mentioned working surface is dressed while maintaining the above-mentioned relative inclination set in the above-mentioned setting stage.  
   
   
       12 . The dressing method according to  claim 11 , which is characterized by the fact that the above-mentioned setting stage includes a stage in which information corresponding to the surface shape of the above-mentioned working surface is obtained, and a stage in which the above-mentioned relative inclination is adjusted and set on the basis of the above-mentioned information.  
   
   
       13 . The dressing method according to  claim 11 , which is characterized by the fact that the above-mentioned setting stage and the above-mentioned dressing stage are alternately repeated a multiple number of times each until the surface shape of the above-mentioned working surface becomes a surface shape that is within the permissible range.  
   
   
       14 . The dressing method according to  claim 11 , which is characterized by the fact that the dressing of the above-mentioned working surface in the above-mentioned dressing stage is performed in a state in which a portion of the above-mentioned dressing surface protrudes from the circumference of the above-mentioned working surface.  
   
   
       15 . The dressing method according to  claim 11 , which is characterized by the fact that the above-mentioned relative inclination is an inclination about a specified axial line that is substantially perpendicular to a straight line passing through the vicinity of the center of the above-mentioned working surface and the vicinity of the center of the above-mentioned dressing surface.  
   
   
       16 . A dressing apparatus which dresses the working surface of a working tool supported on a substrate by causing contact between this working surface and the dressing surface of a dressing tool and causing relative motion between the above-mentioned substrate and the above-mentioned dressing tool, this dressing apparatus being characterized by the fact that the apparatus comprises an inclination adjustment mechanism that can adjust the relative inclination of the above-mentioned dressing surface with reference to the above-mentioned substrate to a desired inclination and set this inclination, and a moving mechanism which dresses the above-mentioned working surface by causing relative motion between the above-mentioned substrate and the above-mentioned dressing tool while maintaining the above-mentioned relative inclination set by the above-mentioned inclination adjustment mechanism.  
   
   
       17 . The dressing apparatus according to  claim 16 , which is characterized by the fact that the dressing apparatus is an apparatus that dresses the working surface of a working tool that has a circular outer circumference, the above-mentioned dressing tool comprises a dressing surface which is constructed from a circular region that has a first cutting capacity per unit area, and an annular region that is concentric with the above-mentioned circular region and that has a second cutting capacity per unit area that is higher than the above-mentioned first cutting capacity per unit area, the diameter of the above-mentioned circular region of the above-mentioned dressing surface is greater than the effective use width within the radius of the above-mentioned working surface, and the external diameter of the above-mentioned annular region of the above-mentioned dressing surface is substantially half of the external diameter of the above-mentioned working surface.  
   
   
       18 . The dressing apparatus according to  claim 16 , which is characterized by the fact that the dressing apparatus comprises a control part that operates the above-mentioned inclination adjustment mechanism on the basis of information corresponding to the surface shape of the above-mentioned working surface so that the above-mentioned relative inclination is a desired inclination.  
   
   
       19 . The dressing apparatus according to  claim 18 , which is characterized by the fact that the dressing apparatus comprises a measuring part that acquires the above-mentioned information.  
   
   
       20 . A dressing apparatus which dresses the working surface of a working tool supported on a substrate by causing contact between this working surface and the dressing surface of a dressing tool and causing relative motion between the above-mentioned substrate and the above-mentioned dressing tool, this dressing apparatus being characterized by the fact that the apparatus comprises an inclination adjustment mechanism that can adjust the relative inclination of the above-mentioned dressing surface with reference to the above-mentioned substrate to a desired inclination and set this inclination, a moving mechanism which dresses the above-mentioned working surface by causing relative motion between the above-mentioned substrate and the above-mentioned dressing tool while maintaining the above-mentioned relative inclination set by the above-mentioned inclination adjustment mechanism, a measuring part which acquires information corresponding to the surface shape of the above-mentioned working surface, and a control part which, in response to specified command signals, (i) causes the above-mentioned dressing to be performed by operating the above-mentioned moving mechanism, (ii) makes a judgement as to whether or not the above-mentioned relative inclination that is currently set is the desired inclination on the basis of the above-mentioned information acquired by the above-mentioned measuring part following the dressing performed in the above-mentioned (i), (iii) ends the adjustment of the above-mentioned relative inclination in cases where it is judged in the above-mentioned (ii) that the currently set inclination is the desired inclination, and (iv) repeats the operation from the above-mentioned (i) on after operating the above-mentioned inclination adjustment mechanism so that the above-mentioned relative inclination is adjusted to the desired inclination or an inclination that approaches this desired inclination in cases where it is judged in the above-mentioned (ii) that the currently set inclination is not the desired inclination.  
   
   
       21 . The dressing apparatus according to  claim 20 , which is characterized by the fact that the dressing apparatus is an apparatus that dresses the working surface of a working tool that has a circular outer circumference, the above-mentioned dressing tool comprises a dressing surface which is constructed from a circular region that has a first cutting capacity per unit area, and an annular region that is concentric with the above-mentioned circular region and that has a second cutting capacity per unit area that is higher than the above-mentioned first cutting capacity per unit area, the diameter of the above-mentioned circular region of the above-mentioned dressing surface is greater than the effective use width within the radius of the above-mentioned working surface, and the external diameter of the above-mentioned annular region of the above-mentioned dressing surface is substantially half of the external diameter of the above-mentioned working surface.  
   
   
       22 . The dressing apparatus according to  claim 16 , which is characterized by the fact that the dressing of the above-mentioned working surface is performed in a state in which a portion of the above-mentioned dressing surface protrudes from the circumference of the above-mentioned working surface.  
   
   
       23 . The dressing apparatus according to  claim 20 , which is characterized by the fact that the dressing of the above-mentioned working surface is performed in a state in which a portion of the above-mentioned dressing surface protrudes from the circumference of the above-mentioned working surface.  
   
   
       24 . The dressing apparatus according to  claim 16 , which is characterized by the fact that the above-mentioned relative inclination is an inclination about a specified axial line that is substantially perpendicular to a straight line passing through the vicinity of the center of the above-mentioned working surface and the vicinity of the center of the above-mentioned dressing surface.  
   
   
       25 . The dressing apparatus according to  claim 20 , which is characterized by the fact that the above-mentioned relative inclination is an inclination about a specified axial line that is substantially perpendicular to a straight line passing through the vicinity of the center of the above-mentioned working surface and the vicinity of the center of the above-mentioned dressing surface.  
   
   
       26 . A working apparatus which comprises a working tool that has a working surface, and a holding part that holds the workpiece, and which works the above-mentioned workpiece by applying a load between the above-mentioned working surface of the above-mentioned working tool and the above-mentioned workpiece and causing the relative motion of the above-mentioned working tool and the above-mentioned workpiece, this working apparatus being characterized by the fact that the above-mentioned working surface is dressed by the dressing method according to  claim 11 .  
   
   
       27 . A working apparatus which comprises a working tool that has a working surface, and a holding part that holds workpiece, and which works the above-mentioned workpiece by applying a load between the above-mentioned working surface of the above-mentioned working tool and the above-mentioned workpiece and causing the relative motion of the above-mentioned working tool and the above-mentioned workpiece, this working apparatus being characterized by the fact that the above-mentioned working surface is dressed by the dressing apparatus according to  claim 16 .  
   
   
       28 . A working apparatus which comprises a working tool that has a working surface, and a holding part that holds the workpiece, and which works the above-mentioned workpiece by applying a load between the above-mentioned working surface of the above-mentioned working tool and the above-mentioned workpiece and causing the relative motion of the above-mentioned working tool and the above-mentioned workpiece, this working apparatus being characterized by the fact that the above-mentioned working surface is dressed by the dressing apparatus according to  claim 20 .  
   
   
       29 . A working apparatus which comprises a working tool that has a working surface, and a holding part that holds the workpiece, and which works the above-mentioned workpiece by applying a load between the above-mentioned working surface of the above-mentioned working tool and the above-mentioned workpiece and causing the relative motion of the above-mentioned working tool and the above-mentioned workpiece, this working apparatus being characterized by the fact that the apparatus comprises the dressing apparatus according to  claim 16 .  
   
   
       30 . A working apparatus which comprises a working tool that has a working surface, and a holding part that holds the workpiece, and which works the above-mentioned workpiece by applying a load between the above-mentioned working surface of the above-mentioned working tool and the above-mentioned workpiece and causing the relative motion of the above-mentioned working tool and the above-mentioned workpiece, this working apparatus being characterized by the fact that the apparatus comprises the dressing apparatus according to  claim 20 .  
   
   
       31 . A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer is flattened using the working apparatus according to  claim 5 .  
   
   
       32 . A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer is flattened using the working apparatus according to  claim 6 .  
   
   
       33 . A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer is flattened using the working apparatus according to  claim 26 .  
   
   
       34 . A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer is flattened using the working apparatus according to  claim 27 .  
   
   
       35 . A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer is flattened using the working apparatus according to  claim 28 .  
   
   
       36 . A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer is flattened using the working apparatus according to  claim 29 .  
   
   
       37 . A semiconductor device manufacturing method which is characterized by the fact that this method has a process in which the surface of a semiconductor wafer is flattened using the working apparatus according to  claim 30.